Methods and compositions for forming patterns with isolated or discrete features using block copolymer materials
    4.
    发明申请
    Methods and compositions for forming patterns with isolated or discrete features using block copolymer materials 有权
    使用嵌段共聚物材料形成具有孤立或离散特征的图案的方法和组合物

    公开(公告)号:US20080299353A1

    公开(公告)日:2008-12-04

    申请号:US11879758

    申请日:2007-07-17

    IPC分类号: B32B27/28 B44C1/22

    摘要: Methods of directing the self assembly of block copolymers on chemically patterned surfaces to pattern discrete or isolated features needed for applications including patterning integrated circuit layouts are described. According to various embodiments, these features include lines, t-junctions, bends, spots and jogs. In certain embodiments a uniform field surrounds the discrete feature or features. In certain embodiments, a layer contains two or more distinct regions, the regions differing in one or more of type of feature, size, and/or pitch. An example is an isolated spot at one area of the substrate, and a t-junction at another area of the substrate. These features or regions of features may be separated by unpatterned or uniform fields, or may be adjacent to one another. Applications include masks for nanoscale pattern transfer as well as the fabrication of integrated circuit device structures.

    摘要翻译: 将嵌段共聚物的自组装引导到化学图案化表面上以对包括图案化集成电路布局的应用所需的图案离散或隔离特征进行描述的方法。 根据各种实施例,这些特征包括线,T形接头,弯曲部,点和点动。 在某些实施例中,均匀的场围绕离散的特征或特征。 在某些实施例中,层包含两个或更多个不同的区域,该区域在特征,尺寸和/或间距类型中的一种或多种中是不同的。 一个例子是在衬底的一个区域处的孤立点,以及在衬底的另一个区域处的t结。 特征的这些特征或区域可以由未图案化或均匀的场分开,或者可以彼此相邻。 应用包括用于纳米尺度图案转移的掩模以及集成电路器件结构的制造。

    Methods and compositions for forming patterns with isolated or discrete features using block copolymer materials
    7.
    发明授权
    Methods and compositions for forming patterns with isolated or discrete features using block copolymer materials 有权
    使用嵌段共聚物材料形成具有孤立或离散特征的图案的方法和组合物

    公开(公告)号:US08133534B2

    公开(公告)日:2012-03-13

    申请号:US11879758

    申请日:2007-07-17

    IPC分类号: B05D5/00

    摘要: Methods of directing the self assembly of block copolymers on chemically patterned surfaces to pattern discrete or isolated features needed for applications including patterning integrated circuit layouts are described. According to various embodiments, these features include lines, t-junctions, bends, spots and jogs. In certain embodiments a uniform field surrounds the discrete feature or features. In certain embodiments, a layer contains two or more distinct regions, the regions differing in one or more of type of feature, size, and/or pitch. An example is an isolated spot at one area of the substrate, and a t-junction at another area of the substrate. These features or regions of features may be separated by unpatterned or uniform fields, or may be adjacent to one another. Applications include masks for nanoscale pattern transfer as well as the fabrication of integrated circuit device structures.

    摘要翻译: 将嵌段共聚物的自组装引导到化学图案化表面上以对包括图案化集成电路布局的应用所需的图案离散或隔离特征进行描述的方法。 根据各种实施例,这些特征包括线,T形接头,弯曲部,点和点动。 在某些实施例中,均匀的场围绕离散的特征或特征。 在某些实施例中,层包含两个或更多个不同的区域,该区域在特征,尺寸和/或间距类型中的一种或多种中是不同的。 一个例子是在衬底的一个区域处的孤立点,以及在衬底的另一个区域处的t结。 特征的这些特征或区域可以由未图案化或均匀的场分开,或者可以彼此相邻。 应用包括用于纳米尺度图案转移的掩模以及集成电路器件结构的制造。

    Directed assembly of triblock copolymers
    8.
    发明申请
    Directed assembly of triblock copolymers 有权
    三嵌段共聚物的定向组装

    公开(公告)号:US20090087664A1

    公开(公告)日:2009-04-02

    申请号:US11580694

    申请日:2006-10-12

    IPC分类号: C08G63/48 B32B9/04

    摘要: Methods of directed self-assembly of multi-block (i.e., triblock and higher-order) copolymers on patterned substrates and related compositions are provided. According to various embodiments, the methods involve depositing copolymer materials on substrates configured to drive the assembly of micro-phase separated films that exhibit the same morphology as that copolymer materials in the bulk. In certain embodiments, binary patterns are used to drive the triblock copolymer films. The binary two-dimensional surface patterns are transformed into three-component and three-dimensional structures throughout the thickness of the overlying copolymer films.

    摘要翻译: 提供了在图案化基材和相关组合物上多嵌段(即三嵌段和高级)共聚物的定向自组装方法。 根据各种实施方案,所述方法包括将共聚物材料沉积在被配置为驱动微分离膜的组合的基材上,所述膜与本体中共聚物材料呈现相同的形态。 在某些实施方案中,使用二元图案来驱动三嵌段共聚物膜。 二元二维表面图案在上覆共聚物膜的整个厚度上转变为三组分和三维结构。