摘要:
A honeycomb body is disclosed having cells extending along a common direction, a first plurality of the cells being open at both ends of the body and a second plurality of the cells being closed at one or both ends of the body, the second plurality of cells arranged in one or more groups of cells cooperating to define one or more fluid passages extending through the body at least in part perpendicularly to the common direction, wherein, in a plane perpendicular to the common direction, the ratio of the area of cells of the first plurality to the area of cells of the second plurality varies along the length of at least one of the one or more fluid passages.
摘要:
A honeycomb body is disclosed having cells extending along a common direction, a first plurality of the cells being open at both ends of the body and a second plurality of the cells being closed at one or both ends of the body, the second plurality of cells arranged in one or more groups of cells cooperating to define one or more fluid passages extending through the body at least in part perpendicularly to the common direction, wherein, in a plane perpendicular to the common direction, the ratio of the area of cells of the first plurality to the area of cells of the second plurality varies along the length of at least one of the one or more fluid passages.
摘要:
Porous ceramic honeycomb bodies and methods of making them, wherein the ceramic body has a total porosity (% P) defined by a median pore size (d50) greater than or equal to 10 microns; a pore size distribution d-factor less than 0.8, wherein d-factor=(d50−d10)/d50, and a submicron pore fraction characterized by less than 5% of the total porosity being comprised of pores having a pore diameter less than 1.0 micron.
摘要:
Porous ceramic honeycomb bodies and methods of making them, wherein the ceramic body has a total porosity (% P) defined by a median pore size (d50) greater than or equal to 10 microns; a pore size distribution d-factor less than 0.8, wherein d-factor=(d50−d10)/d50, and a submicron pore fraction characterized by less than 5% of the total porosity being comprised of pores having a pore diameter less than 1.0 micron.
摘要翻译:多孔陶瓷蜂窝体及其制造方法,其中所述陶瓷体具有大于或等于10微米的中值孔径(d≤50)定义的总孔隙率(%P); 孔径分布d因子小于0.8,其中d因子=(d≤50-10 i> 10)/ d 50,和 亚微米孔分数的特征在于总孔隙率小于5%的孔径由孔径小于1.0微米的孔组成。
摘要:
A washing machine includes a washing-basket assembly including a rotatable shaft configured to be rotatably supported. A gear assembly is configured to engage with the rotatable shaft. A foot-peddle assembly is coupled to the gear assembly. This is done in such a way that the foot-peddle assembly, in use, urges a rotatable reciprocating movement of the gear assembly, the rotatable shaft and the washing-basket assembly.
摘要:
An electronic device may have a cavity antenna. The cavity antenna may have a logo-shaped dielectric window. An antenna resonating element for the cavity antenna may be formed from conductive traces on a printed circuit board. An antenna resonating element may be formed from the traces. The antenna resonating element may be mounted on an antenna support structure. A conductive cavity structure for the cavity antenna may have a planar lip that is mounted flush with an interior surface of a conductive housing wall. The cavity structure may have more than one depth. Shallower planar portions of the cavity structure may lie in a plane. The antenna resonating element may be located between the plane of the shallow cavity walls and an external surface of the conductive housing wall.
摘要:
An electronic device may have a housing in which an antenna and a proximity sensor formed from flex circuit structures are mounted. The flex circuit structures may include first and second flex circuit layers. The first and second flex circuit layers may include metal antenna structures and metal proximity sensor electrode structures. Solder may be used to attach electrical components to the flex circuit layers and may be used to electrically connect metal structures on the first and second flex circuit layers to each other. The first and second flex circuit layers may be laminated together using a compressive fixture. The compressive fixture may have a first fixture with a convex surface and a second fixture with a concave surface so that the laminated flex circuit layers are provided with a bend.
摘要:
An electronic device may have a housing in which an antenna and a proximity sensor formed from flex circuit structures are mounted. The flex circuit structures may include first and second flex circuit layers. The first and second flex circuit layers may include metal antenna structures and metal proximity sensor electrode structures. Solder may be used to attach electrical components to the flex circuit layers and may be used to electrically connect metal structures on the first and second flex circuit layers to each other. The first and second flex circuit layers may be laminated together using a compressive fixture. The compressive fixture may have a first fixture with a convex surface and a second fixture with a concave surface so that the laminated flex circuit layers are provided with a bend.
摘要:
Methods and apparatuses are provided for determining a transmission power cap for one or more devices based at least in part on pathloss measurements to one or more access points received from the one or more devices. A common transmission power cap can also be computed for assigning to devices communicating with an access point, and the transmission power cap for a given device can be adjusted when the transmission power is at or a threshold level from the common power cap to conserve signaling in the wireless network. Adjustment of the transmission power cap can additionally or alternatively be based on a received power at an access point related to signals from the device, an interference report from one or more access points, and/or the like.
摘要:
Logo antennas are provided for electronic devices such as portable computers. An electronic device may have a housing with conductive housing walls. A logo antenna may be formed from an antenna resonating element such as a patch antenna resonating element, a monopole antenna resonating element, or other antenna resonating element structure. A conductive cavity may be placed behind the antenna resonating element. A dielectric antenna window that serves as a logo may be used to cover the antenna resonating element. The dielectric antenna window may be mounted in an opening in the conductive housing walls. A positive antenna feed terminal may be coupled to the antenna resonating element. A ground antenna feed terminal may be coupled to the cavity and portions of the conductive housing walls. The dielectric antenna window may be shaped in the form of a logo.