公开(公告)号：US06910615B2

公开(公告)日：2005-06-28

申请号：US10400944

申请日：2003-03-27

申请人： Peter A. Gruber ,  Minkailu A Jalloh ,  Chon Cheong Lei

发明人： Peter A. Gruber ,  Minkailu A Jalloh ,  Chon Cheong Lei

IPC分类号： B23K1/00 ,  B23K1/008 ,  H01L21/56 ,  H01L21/60 ,  H01L21/66 ,  H01L21/68 ,  H05K3/22 ,  H05K3/26 ,  H05K3/34 ,  B23K31/02 ,  B23K37/00

CPC分类号： H01L21/6835 ,  B23K1/0016 ,  B23K1/008 ,  H01L21/563 ,  H01L22/14 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K3/225 ,  H05K3/26 ,  H05K3/341 ,  H05K3/3463 ,  H05K2203/047 ,  H05K2203/1476 ,  H05K2203/162 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2224/05599

摘要： In a solder reflow type building of modular electrical apparatus involving integrated circuit and discrete components, fabrication operations are arranged to include the providing of a general type series of steps for each component element involving a reflow or joining step at the highest joining temperature, immediately followed by a solder flux cleaning step and immediately followed by a testing of the entire module constructed thus far. There is provided a further specific type operation for each different type of component element that includes the providing of a loop for the introduction of a replacement for any broken discrete component with joining being achieved with use of a lower fusion temperature solder, flux cleaning and testing at each joining followed by reinsertion into the module. There is further provided an operation at the encapsulation stage of the module building for introducing underfill between the component and supporting carrier.

摘要翻译： 在涉及集成电路和分立组件的模块化电气设备的回流焊接建筑物中，制造操作被布置为包括为在最高接合温度下涉及回流或接合步骤的每个部件元件提供一般类型的一系列步骤，紧接着 通过焊剂清洁步骤，并立即进行到目前为止构成的整个模块的测试。 为每个不同类型的元件提供了另外的特定类型的操作，包括提供一个环，用于引入任何破损的分立元件的替换，使用较低的熔融温度焊料，焊剂清洁和测试 在每次连接之后重新插入模块。 在模块建筑物的封装阶段进一步提供了在组件和支撑载体之间引入底部填充物的操作。