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    Reflector packages and methods for packaging of a semiconductor light emitting device
    2.
    发明申请
    Reflector packages and methods for packaging of a semiconductor light emitting device 有权
    用于封装半导体发光器件的反射器封装和方法

    公开(公告)号：US20050221518A1

    公开(公告)日：2005-10-06

    申请号：US11044779

    申请日：2005-01-27

    申请人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

    IPC分类号： H01L21/00 ,  H01L33/52 ,  H01L33/58

    CPC分类号： H01L33/58 ,  H01L33/52

    摘要： Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.

    摘要翻译： 将半导体发光器件封装在具有位于其下侧和上侧壁之间的护城河的反射器中的方法，所述上壁和下侧壁限定反射腔，包括将密封剂材料分配到包括其中的发光器件的反射腔中以覆盖 并且在反射腔中形成密封材料的凸弯月面，其从护城河的边缘延伸而不接触反射器的上侧壁。 反射腔中的密封材料固化。 还提供了用于其的封装的半导体发光器件和反射器。

    PACKAGED LIGHT EMITTING DEVICES
    4.
    发明申请
    PACKAGED LIGHT EMITTING DEVICES 有权
    包装发光装置

    公开(公告)号：US20070290218A1

    公开(公告)日：2007-12-20

    申请号：US11849530

    申请日：2007-09-04

    申请人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

    IPC分类号： H01L33/00

    CPC分类号： H01L33/58 ,  H01L33/52 ,  H01L33/60 ,  H01L2924/181 ,  H01L2924/00012

    摘要： Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity.

    摘要翻译： 包装半导体发光器件包括具有限定反射腔的下侧壁部分的反射器。 发光器件位于反射腔中。 具有第一折射率的第一量固化的密封剂材料设置在包括发光器件的反射腔中。 在第一量的固化的密封剂材料上提供第二量的具有与第一折射率不同的第二折射率的固化的密封剂材料。 选择第一和第二折射率以在反射腔中提供掩埋透镜。

    Methods for packaging of a semiconductor light emitting device
    5.
    发明授权
    Methods for packaging of a semiconductor light emitting device 有权
    包装半导体发光器件的方法

    公开(公告)号：US07326583B2

    公开(公告)日：2008-02-05

    申请号：US11044779

    申请日：2005-01-27

    申请人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    IPC分类号： H01L21/00

    CPC分类号： H01L33/58 ,  H01L33/52

    摘要： Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.

    摘要翻译： 将半导体发光器件封装在具有位于其下侧和上侧壁之间的护城河的反射器中的方法，所述上壁和下侧壁限定反射腔，包括将密封剂材料分配到包括其中的发光器件的反射腔中以覆盖 并且在反射腔中形成密封材料的凸弯月面，其从护城河的边缘延伸而不接触反射器的上侧壁。 反射腔中的密封材料固化。 还提供了用于其的封装的半导体发光器件和反射器。

    Packaged light emitting devices
    8.
    发明授权
    Packaged light emitting devices 有权
    封装发光器件

    公开(公告)号：US08154043B2

    公开(公告)日：2012-04-10

    申请号：US13080968

    申请日：2011-04-06

    申请人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    IPC分类号： H01L33/50 ,  H01L33/60 ,  H01L33/58

    CPC分类号： H01L33/58 ,  H01L33/52 ,  H01L33/60 ,  H01L2924/181 ,  H01L2924/00012

    摘要： Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity.

    摘要翻译： 包装半导体发光器件包括具有限定反射腔的下侧壁部分的反射器。 发光器件位于反射腔中。 具有第一折射率的第一量固化的密封剂材料设置在包括发光器件的反射腔中。 在第一量的固化的密封剂材料上提供第二量的具有与第一折射率不同的第二折射率的固化的密封剂材料。 选择第一和第二折射率以在反射腔中提供掩埋透镜。

    Packaged Light Emitting Devices
    9.
    发明申请
    Packaged Light Emitting Devices 有权
    封装发光装置

    公开(公告)号：US20110180834A1

    公开(公告)日：2011-07-28

    申请号：US13080968

    申请日：2011-04-06

    申请人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    IPC分类号： H01L33/50 ,  H01L33/60 ,  H01L33/58

    CPC分类号： H01L33/58 ,  H01L33/52 ,  H01L33/60 ,  H01L2924/181 ,  H01L2924/00012

    摘要： Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity.

    摘要翻译： 包装半导体发光器件包括具有限定反射腔的下侧壁部分的反射器。 发光器件位于反射腔中。 具有第一折射率的第一量固化的密封剂材料设置在包括发光器件的反射腔中。 在第一量的固化的密封剂材料上提供第二量的具有与第一折射率不同的第二折射率的固化的密封剂材料。 选择第一和第二折射率以在反射腔中提供掩埋透镜。

    Packaged light emitting devices
    10.
    发明授权
    Packaged light emitting devices 有权
    封装发光器件

    公开(公告)号：US07928456B2

    公开(公告)日：2011-04-19

    申请号：US11849530

    申请日：2007-09-04

    申请人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    IPC分类号： H01L33/00

    CPC分类号： H01L33/58 ,  H01L33/52 ,  H01L33/60 ,  H01L2924/181 ,  H01L2924/00012

    摘要： Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity.

    摘要翻译： 包装半导体发光器件包括具有限定反射腔的下侧壁部分的反射器。 发光器件位于反射腔中。 具有第一折射率的第一量固化的密封剂材料设置在包括发光器件的反射腔中。 在第一量的固化的密封剂材料上提供第二量的具有与第一折射率不同的第二折射率的固化的密封剂材料。 选择第一和第二折射率以在反射腔中提供掩埋透镜。