摘要:
Example embodiments provide methods of transparently migrating a reliable transport layer connection between a user and a first base station and a second base station in a wireless network. The method includes receiving at least one transport layer connection state information parameter from the first base station at the second base station. The second base station then determines at least one new transport layer connection parameter based on the at least one transferred transport layer connection state information parameter and at least one network condition at the second base station.
摘要:
An active session mobility solution for point-to-point protocol (PPP) in accordance with the present invention provides fast and smooth handoff by reducing tunneling overhead on tunneling mechanisms, such as P-P tunneling from a serving Source (e.g., a PPP termination device) to a new serving Target (e.g., a PPP termination device). In the active session mobility solution of the present invention, PPP session can be migrated even if not all phases have been completed (e.g., LCP, PAP/CHAP completed but not IPCP and CCP). In such cases, the incomplete phases will be negotiated at the PPP of the Target PPP.
摘要:
The present invention provides a method of wireless telecommunication in a distributed network comprised of a plurality of access points. The method includes receiving information indicating that a dormant call session is to be activated. The method also includes providing an identifier indicative of the dormant call session. The identifier includes information indicative of an access point having information indicative of a state of the call session stored thereon.
摘要:
A method and equipment is used to transmit and/or receive time delay-intolerant information over a communication system. The information is transmitted in aggregated form. A plurality of packets representing time delay-intolerant information is combined to form an aggregate packet. The aggregate packet is formed based on user service requirements while maintaining time delay requirements of the information. The size of the aggregated is formed from a negotiation between the transmitting equipment and receiving equipment. Because of the use of an aggregated packet less scheduling of packets is done and the aggregated packet can be transmitted at a rate different than the fixed rate of the time delay-intolerant information. The equipment comprises transmit equipment and receive equipment. The transmit equipment contains an aggregator that combines a plurality of packets based on user service requirements. The packets to be transmitted are retrieved at the fixed rate of the time delay-intolerant information. The size of the aggregate packet can be determined on a static or dynamic basis. The receiving equipment contains a de-aggregator circuit that receives aggregated packets and generates individual packets from the received aggregated packet. The generated individual packets are retrieved from the de-aggregator at the fixed rate of the time delay-intolerant information.
摘要:
In the method, a source base station sends first information to a target base station. The first information indicates a sequence number of a first data unit in a sequence of data units undelivered to the mobile station by the source base station. The source base station also sends the target base station second information. The second information indicates data units, after the first undelivered data unit in the sequence, that have been delivered to the mobile station by the source base station. The second information may further indicate portions of the first undelivered data unit that have been delivered to the mobile station by the source base station.
摘要:
A method for making a semiconductor device is provided which includes (a) providing a layer stack comprising a semiconductor layer (211) and a dielectric layer (209) disposed between the substrate and the semiconductor layer, (b) creating a trench (210) which extends through the semiconductor layer and which exposes a portion of the dielectric layer, the trench having a sidewall, (c) creating a spacer structure (221) which comprises a first material and which is adjacent to the sidewall of the trench, and (d) forming a stressor layer (223) which comprises a second material and which is disposed on the bottom of the trench.
摘要:
A process of forming an electronic device can include patterning a semiconductor layer to define an opening. After patterning the semiconductor layer, the opening can have a bottom, and the semiconductor layer can have a sidewall and a surface. The surface is spaced apart from the bottom of the opening. The sidewall can extend from the surface towards the bottom of the opening. The process can also include forming a layer over the semiconductor layer and within the opening, and removing a part of the first layer from within the opening. After removing the part of the layer, a remaining portion of the layer may lie within the opening and adjacent to the bottom and the sidewall, and the remaining portion of the layer may be spaced apart from the surface. In another aspect, the electronic device can include a field isolation region including the first layer.
摘要:
A system for detecting non-linear distortion comprises an error detector and logic. The error detector is configured to estimate signal errors associated with signals communicated across a telecommunication line. The logic is configured to track the signal errors and to detect whether the signals are subject to non-linear distortion based on a history of the signal errors.
摘要:
A system for canceling impulse noise comprises an adaptive impulse canceler and a combiner. The adaptive impulse canceler is configured to receive a common mode component of a received signal and to detect a noise impulse in the common mode component. The impulse canceler is further configured to provide, based on the noise impulse in the common mode component, an impulse noise estimation for a differential mode component of the received signal. The combiner is configured to receive the differential mode component and the impulse noise estimation and to subtract the impulse noise estimation from the differential mode component.
摘要:
A method for making a semiconductor structure (10) includes providing a wafer with a structure (16) having a sidewall, forming a sidewall spacer (22) adjacent to the sidewall, and forming a layer of material (28) over the wafer including over the sidewall spacer and over the structure having the sidewall. The method further includes etching the layer, wherein the etching (i) leaves at least portions of the sidewall spacer exposed and (ii) leaves a portion of the layer located over the structure having a sidewall. The portion of the layer located over the structure having a sidewall is reduced in thickness by the etching. Subsequent to etching the layer, the method includes removing the sidewall spacer.