Mobile micromechanical element with shock controlled rotation
    2.
    发明授权
    Mobile micromechanical element with shock controlled rotation 有权
    具有冲击控制旋转的移动微机械元件

    公开(公告)号:US07708454B2

    公开(公告)日:2010-05-04

    申请号:US11767710

    申请日:2007-06-25

    IPC分类号: G04B17/20 G04B15/00

    CPC分类号: G04B15/14 G04B15/08

    摘要: The mobile element includes a central rigid zone (2) provided with arms (6) extending radially from the central zone (2) towards a peripheral zone including teeth (8). The arms (6) are flexible to allow a small tangential and/or radial movement of the teeth (8) in order to absorb shocks. The invention is characterized in that the arms (6) are curved and bend gradually towards an orientation tangential to the rotation of the mobile element, in that the thickness of the arms gradually decreases, and finally, in that the ends of the arms form the teeth.

    摘要翻译: 移动元件包括设置有从中心区域(2)径向延伸到包括齿(8)的周边区域的臂(6)的中心刚性区域(2)。 臂(6)是柔性的,以允许齿(8)的小切向和/或径向运动,以便吸收冲击。 本发明的特征在于,臂(6)弯曲并朝着与移动元件的旋转相切的定向逐渐弯曲,其中臂的厚度逐渐减小,最后,由于臂的端部形成 牙齿

    Method of manufacturing multi-level, silicon, micromechanical parts and parts thereby obtained
    4.
    发明授权
    Method of manufacturing multi-level, silicon, micromechanical parts and parts thereby obtained 有权
    由此得到多级,硅,微机械部件和部件的制造方法

    公开(公告)号:US08501584B2

    公开(公告)日:2013-08-06

    申请号:US12514352

    申请日:2007-11-01

    摘要: The process comprises the following steps: a) a first element (3) or a plurality of said first elements (3) is/are machined in a first silicon wafer (1) keeping said elements (3) joined together via material bridges (5); b) step a) is repeated with a second silicon wafer (2) in order to machine a second element (4), differing in shape from that of the first element (3), or a plurality of said second elements (4); c) the first and second elements (3, 4) or the first and second wafers (1, 2) are applied, face to face, with the aid of positioning means (6, 7); d) the assembly formed in step c) undergoes oxidation; and e) the parts (10) are separated form the wafers (1, 2). Micromechanical timepiece parts obtained according to the process.

    摘要翻译: 该方法包括以下步骤:a)在第一硅晶片(1)中加工第一元件(3)或多个所述第一元件(3),以使所述元件(3)通过材料桥(5)连接在一起 ); b)用第二硅晶片(2)重复步骤a),以便加工与第一元件(3)的形状不同的第二元件(4)或多个所述第二元件(4); c)第一和第二元件(3,4)或第一和第二晶片(1,2)通过定位装置(6,7)面对面地施加; d)步骤c)中形成的组件经历氧化; 和e)部件(10)从晶片(1,2)分离。 根据工艺获得的微型钟表件。

    METHOD OF MANUFACTURING MULTI-LEVEL, SILICON, MICROMECHANICAL PARTS AND PARTS THEREBY OBTAINED
    5.
    发明申请
    METHOD OF MANUFACTURING MULTI-LEVEL, SILICON, MICROMECHANICAL PARTS AND PARTS THEREBY OBTAINED 有权
    制造多层次,硅,微量元件和获得的部件的方法

    公开(公告)号:US20100054092A1

    公开(公告)日:2010-03-04

    申请号:US12514352

    申请日:2007-11-01

    IPC分类号: G04B29/00 G04D3/00

    摘要: The process comprises the following steps:a) a first element (3) or a plurality of said first elements (3) is/are machined in a first silicon wafer (1) keeping said elements (3) joined together via material bridges (5); b) step a) is repeated with a second silicon wafer (2) in order to machine a second element (4), differing in shape from that of the first element (3), or a plurality of said second elements (4); c) the first and second elements (3, 4) or the first and second wafers (1, 2) are applied, face to face, with the aid of positioning means (6, 7); d) the assembly formed in step c) undergoes oxidation; and e) the parts (10) are separated form the wafers (1, 2). Micromechanical timepiece parts obtained according to the process.

    摘要翻译: 该方法包括以下步骤:a)在第一硅晶片(1)中加工第一元件(3)或多个所述第一元件(3),以使所述元件(3)通过材料桥(5)连接在一起 ); b)用第二硅晶片(2)重复步骤a),以便加工与第一元件(3)的形状不同的第二元件(4)或多个所述第二元件(4); c)第一和第二元件(3,4)或第一和第二晶片(1,2)通过定位装置(6,7)面对面地施加; d)步骤c)中形成的组件经历氧化; 和e)部件(10)从晶片(1,2)分离。 根据工艺获得的微型钟表零件。

    MOBILE MICROMECHANICAL ELEMENT WITH SHOCK CONTROLLED ROTATION
    6.
    发明申请
    MOBILE MICROMECHANICAL ELEMENT WITH SHOCK CONTROLLED ROTATION 有权
    具有震动控制旋转的移动微电子元件

    公开(公告)号:US20080008051A1

    公开(公告)日:2008-01-10

    申请号:US11767710

    申请日:2007-06-25

    IPC分类号: G04B15/14

    CPC分类号: G04B15/14 G04B15/08

    摘要: The mobile element includes a central rigid zone (2) provided with arms (6) extending radially from the central zone (2) towards a peripheral zone including teeth (8). The arms (6) are flexible to allow a small tangential and/or radial movement of the teeth (8) in order to absorb shocks. The invention is characterized in that the arms (6) are curved and bend gradually towards an orientation tangential to the rotation of the mobile element, in that the thickness of the arms gradually decreases, and finally, in that the ends of the arms form the teeth.

    摘要翻译: 移动元件包括设置有从中心区域(2)径向延伸到包括齿(8)的周边区域的臂(6)的中心刚性区域(2)。 臂(6)是柔性的,以允许齿(8)的小切向和/或径向运动,以便吸收冲击。 本发明的特征在于,臂(6)弯曲并朝着与移动元件的旋转相切的定向逐渐弯曲,其中臂的厚度逐渐减小,最后,由于臂的端部形成 牙齿

    Assembly of a part that is brittle
    8.
    发明授权
    Assembly of a part that is brittle 有权
    组装一个脆弱的部分

    公开(公告)号:US08944676B2

    公开(公告)日:2015-02-03

    申请号:US13271337

    申请日:2011-10-12

    IPC分类号: G04B13/02 G04B15/14 G04B17/32

    摘要: An assembly including a member made of a first material, which is axially driven into a circular aperture of a part made of a second material that is brittle, using an intermediate part made of a third material and mounted between the member and the part is disclosed. The intermediate part is a continuous cylinder including a hole for receiving the member so that the intermediate part absorbs radially and in a uniform manner, at least part of the axial driving force of the member. The part includes pierced holes forming elastic deformation units distributed around the circular aperture thereof for absorbing any of the radial force not absorbed by the intermediate part, so as to secure the assembly in a non-destructive manner for the part.

    摘要翻译: 公开了一种组件,其包括由第一材料构成的构件,其被使用由第三材料制成的中间部件轴向地驱动到由脆性的第二材料制成的部件的圆形孔中,并安装在构件和部件之间 。 中间部分是连续的圆柱体,其包括用于接收构件的孔,使得中间部件径向和均匀地吸收构件的轴向驱动力的至少一部分。 该部件包括形成围绕其圆形孔分布的弹性变形单元的穿孔,用于吸收中间部分未被吸收的任何径向力,从而以非破坏性方式固定组件。