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公开(公告)号：US08458501B2
公开(公告)日：2013-06-04
申请号：US12844372
申请日：2010-07-27
申请人： Pradip Bose , Alper Buyuktosunoglu , Christopher J. Gonzalez , Moinuddin K. Qureshi , Victor Zyuban
发明人： Pradip Bose , Alper Buyuktosunoglu , Christopher J. Gonzalez , Moinuddin K. Qureshi , Victor Zyuban
CPC分类号： G06F1/3206 , G06F1/324 , G06F1/3296 , Y02D10/126
摘要： A mechanism is provided for approximating data switching activity in a data processing system. A data switching activity identification mechanism in the data processing system receives an identification of a set of data storage devices and a set of bits in the set of data storage devices in the data processing system to be monitored for the data switching activity. The data switching activity identification mechanism sums a count of the identified bits that have changed state for the data storage device along with other counts of the identified bits that have changed state for other data storage devices in the set of data storage devices to form an approximation of data switching activity. A power manager in the data processing system then adjusts a set of operational parameters associated with the data processing system using the approximation of data switching activity.
摘要翻译： 提供了一种用于近似数据处理系统中的数据交换活动的机制。 数据处理系统中的数据交换活动识别机制在数据处理系统中接收数据存储设备的集合的标识和数据存储设备中的一组位，以对数据交换活动进行监控。 数据交换活动识别机制对数据存储装置的已改变状态的已识别比特的计数与数据存储装置中的其他数据存储装置的已改变状态的识别比特的其他计数相加以形成近似值 的数据交换活动。 数据处理系统中的电源管理器然后使用数据交换活动的近似来调整与数据处理系统相关联的一组操作参数。
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公开(公告)号：US20120030481A1
公开(公告)日：2012-02-02
申请号：US12844372
申请日：2010-07-27
申请人： Pradip Bose , Alper Buyuktosunoglu , Christopher J. Gonzalez , Moinuddin K. Qureshi , Victor Zyuban
发明人： Pradip Bose , Alper Buyuktosunoglu , Christopher J. Gonzalez , Moinuddin K. Qureshi , Victor Zyuban
IPC分类号： G06F1/26
CPC分类号： G06F1/3206 , G06F1/324 , G06F1/3296 , Y02D10/126
摘要： A mechanism is provided for approximating data switching activity in a data processing system. A data switching activity identification mechanism in the data processing system receives an identification of a set of data storage devices and a set of bits in the set of data storage devices in the data processing system to be monitored for the data switching activity. The data switching activity identification mechanism sums a count of the identified bits that have changed state for the data storage device along with other counts of the identified bits that have changed state for other data storage devices in the set of data storage devices to form an approximation of data switching activity. A power manager in the data processing system then adjusts a set of operational parameters associated with the data processing system using the approximation of data switching activity.
摘要翻译： 提供了一种用于近似数据处理系统中的数据交换活动的机制。 数据处理系统中的数据交换活动识别机制在数据处理系统中接收数据存储设备的集合的标识和数据存储设备中的一组位，以对数据交换活动进行监控。 数据交换活动识别机制对数据存储装置的已改变状态的已识别比特的计数与数据存储装置中的其他数据存储装置的已改变状态的识别比特的其他计数相加以形成近似值 的数据交换活动。 数据处理系统中的电源管理器然后使用数据交换活动的近似来调整与数据处理系统相关联的一组操作参数。
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3.发明申请ADAPTIVE WORKLOAD BASED OPTIMIZATIONS COUPLED WITH A HETEROGENEOUS CURRENT-AWARE BASELINE DESIGN TO MITIGATE CURRENT DELIVERY LIMITATIONS IN INTEGRATED CIRCUITS 有权基于自适应工作负载的优化与异构电流基准设计相结合，以减轻集成电路中的电流传输限制公开(公告)号：US20140195996A1
公开(公告)日：2014-07-10
申请号：US13526252
申请日：2012-06-18
IPC分类号： G06F17/50
CPC分类号： G06F17/5072 , G06F17/5036
摘要： A dynamic system coupled with “pre-Silicon” design methodologies and “post-Silicon” current optimizing programming methodologies to improve and optimize current delivery into a chip, which is limited by the physical properties of the connections (e.g., Controlled Collapse Chip Connection or C4s). The mechanism consists of measuring or estimating power consumption at a certain granularity within a chip, converting the power information into C4 current information using a method, and triggering throttling mechanisms (including token based throttling) where applicable to limit the current delivery per C4 beyond pre-established limits or periods. Design aids are used to allocate C4s throughout the chip based on the current delivery requirements. The system coupled with design and programming methodologies improve and optimize current delivery is extendable to connections across layers in a multilayer 3D chip stack.
摘要翻译： 与“前置硅”设计方法和“后硅”当前优化编程方法相结合的动态系统，以改进和优化当前传输到芯片的传输，这受到连接的物理特性的限制（例如，受控崩溃芯片连接或 C4s）。 该机制包括测量或估计芯片内特定粒度的功耗，使用一种方法将功率信息转换为C4当前信息，并在适用的情况下触发限流机制（包括基于令牌的限制），以限制每个C4超过预先的当前传输 - 建立的限制或期限。 设计辅助工具用于根据当前交付要求在整个芯片上分配C4。 该系统与设计和编程方法相结合，改进并优化电流传递可扩展到多层3D芯片堆叠中的层间连接。
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4.发明申请Token-Based Current Control to Mitigate Current Delivery Limitations in Integrated Circuits 有权基于令牌的电流控制，以缓解集成电路中的当前传输限制公开(公告)号：US20140082574A1
公开(公告)日：2014-03-20
申请号：US13526153
申请日：2012-06-18
IPC分类号： G06F17/50
CPC分类号： G06F17/5054 , G06F9/455 , G06F9/46 , G06F9/5044 , G06F15/177 , G06F17/5022 , G06F17/5045 , G06F2212/1041 , G06F2217/78
摘要： A dynamic system coupled with “pre-Silicon” design methodologies and “post-Silicon” current optimizing programming methodologies to improve and optimize current delivery into a chip, which is limited by the physical properties of the connections (e.g., Controlled Collapse Chip Connection or C4s). The mechanism consists of measuring or estimating power consumption at a certain granularity within a chip, converting the power information into C4 current information using a method, and triggering throttling mechanisms (including token based throttling) where applicable to limit the current delivery per C4 beyond pre-established limits or periods. Design aids are used to allocate C4s throughout the chip based on the current delivery requirements. The system coupled with design and programming methodologies improve and optimize current delivery is extendable to connections across layers in a multilayer 3D chip stack.
摘要翻译： 与“前置硅”设计方法和“后硅”当前优化编程方法相结合的动态系统，以改进和优化当前传输到芯片的传输，这受到连接的物理特性的限制（例如，受控崩溃芯片连接或 C4s）。 该机制包括测量或估计芯片内特定粒度的功耗，使用一种方法将功率信息转换为C4当前信息，并在适用的情况下触发限流机制（包括基于令牌的限制），以限制每个C4超过预先的当前传输 - 建立的限制或期限。 设计辅助工具用于根据当前交付要求在整个芯片上分配C4。 该系统与设计和编程方法相结合，改进并优化电流传递可扩展到多层3D芯片堆叠中的层间连接。
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5.发明申请ADAPTIVE WORKLOAD BASED OPTIMIZATIONS TO MITIGATE CURRENT DELIVERY LIMITATIONS IN INTEGRATED CIRCUITS 有权基于自适应工作负载的优化，以减轻集成电路中的当前交付限制公开(公告)号：US20130339762A1
公开(公告)日：2013-12-19
申请号：US13526230
申请日：2012-06-18
CPC分类号： H01L23/00 , G06F11/00 , G06F11/3062 , H01L23/50 , H01L25/065 , H01L2224/16145 , H01L2224/16225
摘要： A dynamic system coupled with “pre-Silicon” design methodologies and “post-Silicon” current optimizing programming methodologies to improve and optimize current delivery into a chip, which is limited by the physical properties of the connections (e.g., Controlled Collapse Chip Connection or C4s). The mechanism consists of measuring or estimating power consumption at a certain granularity within a chip, converting the power information into C4 current information using a method, and triggering throttling mechanisms (including token based throttling) where applicable to limit the current delivery per C4 beyond pre-established limits or periods. Design aids are used to allocate C4s throughout the chip based on the current delivery requirements. The system coupled with design and programming methodologies improve and optimize current delivery is extendable to connections across layers in a multilayer 3D chip stack.
摘要翻译： 与“前置硅”设计方法和“后硅”当前优化编程方法相结合的动态系统，以改进和优化当前传输到芯片的传输，这受到连接的物理特性的限制（例如，受控崩溃芯片连接或 C4s）。 该机制包括测量或估计芯片内特定粒度的功耗，使用一种方法将功率信息转换为C4当前信息，并在适用的情况下触发节流机制（包括基于令牌的节流），以限制每个C4的当前传输超过预先 - 建立的限制或期限。 设计辅助工具用于根据当前交付要求在整个芯片上分配C4。 该系统与设计和编程方法相结合，改进并优化电流传递可扩展到多层3D芯片堆叠中的层间连接。
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6.发明授权Adaptive workload based optimizations coupled with a heterogeneous current-aware baseline design to mitigate current delivery limitations in integrated circuits 有权基于自适应工作负载的优化与异构电流感知基线设计相结合，以减轻集成电路中的当前传输限制公开(公告)号：US08914764B2
公开(公告)日：2014-12-16
申请号：US13526252
申请日：2012-06-18
CPC分类号： G06F17/5072 , G06F17/5036
摘要： A dynamic system coupled with “pre-Silicon” design methodologies and “post-Silicon” current optimizing programming methodologies to improve and optimize current delivery into a chip, which is limited by the physical properties of the connections (e.g., Controlled Collapse Chip Connection or C4s). The mechanism consists of measuring or estimating power consumption at a certain granularity within a chip, converting the power information into C4 current information using a method, and triggering throttling mechanisms (including token based throttling) where applicable to limit the current delivery per C4 beyond pre-established limits or periods. Design aids are used to allocate C4s throughout the chip based on the current delivery requirements. The system coupled with design and programming methodologies improve and optimize current delivery is extendable to connections across layers in a multilayer 3D chip stack.
摘要翻译： 与“前置硅”设计方法和“后硅”当前优化编程方法相结合的动态系统，以改进和优化当前传输到芯片的传输，这受到连接的物理特性的限制（例如，受控崩溃芯片连接或 C4s）。 该机制包括测量或估计芯片内特定粒度的功耗，使用一种方法将功率信息转换为C4当前信息，并在适用的情况下触发限流机制（包括基于令牌的限制），以限制每个C4超过预先的当前传输 - 建立的限制或期限。 设计辅助工具用于根据当前的交付要求在整个芯片上分配C4。 该系统与设计和编程方法相结合，改进并优化电流传递可扩展到多层3D芯片堆叠中的层间连接。
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7.发明授权Current-aware floorplanning to overcome current delivery limitations in integrated circuits 有权电流识别布局规划，以克服集成电路中的当前传输限制公开(公告)号：US08863068B2
公开(公告)日：2014-10-14
申请号：US13526194
申请日：2012-06-18
IPC分类号： G06F17/50
CPC分类号： G06F17/5072 , G06F17/50 , G06F2217/78
摘要： A dynamic system coupled with “pre-Silicon” design methodologies and “post-Silicon” current optimizing programming methodologies to improve and optimize current delivery into a chip, which is limited by the physical properties of the connections (e.g., Controlled Collapse Chip Connection or C4s). The mechanism consists of measuring or estimating power consumption at a certain granularity within a chip, converting the power information into C4 current information using a method, and triggering throttling mechanisms (including token based throttling) where applicable to limit the current delivery per C4 beyond pre-established limits or periods. Design aids are used to allocate C4s throughout the chip based on the current delivery requirements. The system coupled with design and programming methodologies improve and optimize current delivery is extendable to connections across layers in a multilayer 3D chip stack.
摘要翻译： 与“前置硅”设计方法和“后硅”当前优化编程方法相结合的动态系统，以改进和优化当前传输到芯片的传输，这受到连接的物理特性的限制（例如，受控崩溃芯片连接或 C4s）。 该机制包括测量或估计芯片内特定粒度的功耗，使用一种方法将功率信息转换为C4当前信息，并在适用的情况下触发限流机制（包括基于令牌的限制），以限制每个C4超过预先的当前传输 - 建立的限制或期限。 设计辅助工具用于根据当前交付要求在整个芯片上分配C4。 该系统与设计和编程方法相结合，改进并优化电流传递可扩展到多层3D芯片堆叠中的层间连接。
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8.发明授权Token-based current control to mitigate current delivery limitations in integrated circuits 有权基于令牌的电流控制，以减轻集成电路中的当前传输限制公开(公告)号：US08826216B2
公开(公告)日：2014-09-02
申请号：US13526153
申请日：2012-06-18
CPC分类号： G06F17/5054 , G06F9/455 , G06F9/46 , G06F9/5044 , G06F15/177 , G06F17/5022 , G06F17/5045 , G06F2212/1041 , G06F2217/78
摘要： A system and method of operating an integrated circuit (IC) having a fixed layout of one or more blocks having one or more current sources therein that draw electrical current from a power source. The method includes dynamically issuing to a block configured to perform operations responsive to an instruction received at the block, a reserve amount of tokens; determining for each issuance of instruction to the block whether that block's reserve token amount exceeds zero; and one of: issuing the instruction to the block if the token reserve for that block is greater than one, and decrementing, after issuance of the instruction, by one token the block's reserve token amount, or, preventing issuance of an instruction to the block. In the method, each block may be initialized to have: a reserve token amount of zero, a token expiration period; a token generation cycle and a token generation amount.
摘要翻译： 一种具有固定布局的集成电路（IC）的系统和方法，所述集成电路（IC）具有一个或多个具有一个或多个电流源的块，其中所述一个或多个块来自电源。 所述方法包括动态地发布到被配置为响应于在所述块处接收的指令执行操作的块，标记的保留量; 确定每个向块的指令的发出是否该块的储备标记量超过零; 其中之一是：如果该块的令牌保留大于1，则向块发出指令，并且在发出指令之后递减一个令牌块的保留令牌量，或者阻止向块发出指令 。 在该方法中，每个块可以被初始化为具有：保留令牌量为零，令牌到期期间; 令牌生成周期和令牌生成量。
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9.发明授权Adaptive workload based optimizations to mitigate current delivery limitations in integrated circuits 有权基于自适应工作负载的优化，以减轻集成电路中的当前传输限制公开(公告)号：US08683418B2
公开(公告)日：2014-03-25
申请号：US13526230
申请日：2012-06-18
CPC分类号： H01L23/00 , G06F11/00 , G06F11/3062 , H01L23/50 , H01L25/065 , H01L2224/16145 , H01L2224/16225
摘要： A dynamic system coupled with “pre-Silicon” design methodologies and “post-Silicon” current optimizing programming methodologies to improve and optimize current delivery into a chip, which is limited by the physical properties of the connections (e.g., Controlled Collapse Chip Connection or C4s). The mechanism consists of measuring or estimating power consumption at a certain granularity within a chip, converting the power information into C4 current information using a method, and triggering throttling mechanisms (including token based throttling) where applicable to limit the current delivery per C4 beyond pre-established limits or periods. Design aids are used to allocate C4s throughout the chip based on the current delivery requirements. The system coupled with design and programming methodologies improve and optimize current delivery is extendable to connections across layers in a multilayer 3D chip stack.
摘要翻译： 与“前置硅”设计方法和“后硅”当前优化编程方法相结合的动态系统，以改进和优化当前传输到芯片的传输，这受到连接的物理特性的限制（例如，受控崩溃芯片连接或 C4s）。 该机制包括测量或估计芯片内特定粒度的功耗，使用一种方法将功率信息转换为C4当前信息，并在适用的情况下触发限流机制（包括基于令牌的限制），以限制每个C4超过预先的当前传输 - 建立的限制或期限。 设计辅助工具用于根据当前的交付要求在整个芯片上分配C4。 该系统与设计和编程方法相结合，改进并优化电流传递可扩展到多层3D芯片堆叠中的层间连接。
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10.发明申请公开(公告)号：US20140082580A1
公开(公告)日：2014-03-20
申请号：US13526194
申请日：2012-06-18
IPC分类号： G06F17/50
CPC分类号： G06F17/5072 , G06F17/50 , G06F2217/78
摘要： A dynamic system coupled with “pre-Silicon” design methodologies and “post-Silicon” current optimizing programming methodologies to improve and optimize current delivery into a chip, which is limited by the physical properties of the connections (e.g., Controlled Collapse Chip Connection or C4s). The mechanism consists of measuring or estimating power consumption at a certain granularity within a chip, converting the power information into C4 current information using a method, and triggering throttling mechanisms (including token based throttling) where applicable to limit the current delivery per C4 beyond pre-established limits or periods. Design aids are used to allocate C4s throughout the chip based on the current delivery requirements. The system coupled with design and programming methodologies improve and optimize current delivery is extendable to connections across layers in a multilayer 3D chip stack.
摘要翻译： 与“前置硅”设计方法和“后硅”当前优化编程方法相结合的动态系统，以改进和优化当前传输到芯片的传输，这受到连接的物理特性的限制（例如，受控崩溃芯片连接或 C4s）。 该机制包括测量或估计芯片内特定粒度的功耗，使用一种方法将功率信息转换为C4当前信息，并在适用的情况下触发限流机制（包括基于令牌的限制），以限制每个C4超过预先的当前传输 - 建立的限制或期限。 设计辅助工具用于根据当前的交付要求在整个芯片上分配C4。 该系统与设计和编程方法相结合，改进并优化电流传递可扩展到多层3D芯片堆叠中的层间连接。
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