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公开(公告)号:US08878286B2
公开(公告)日:2014-11-04
申请号:US13895197
申请日:2013-05-15
申请人: Gordon M. Grivna , Zia Hossain , Kirk K. Huang , Balaji Padmanabhan , Francine Y. Robb , Prasad Venkatraman
发明人: Gordon M. Grivna , Zia Hossain , Kirk K. Huang , Balaji Padmanabhan , Francine Y. Robb , Prasad Venkatraman
IPC分类号: H01L29/66 , H01L29/78 , H01L29/45 , H01L29/40 , H01L29/423 , H01L29/08 , H01L29/417
CPC分类号: H01L29/7845 , H01L29/0869 , H01L29/407 , H01L29/41766 , H01L29/42368 , H01L29/42376 , H01L29/456 , H01L29/66666 , H01L29/66727 , H01L29/66734 , H01L29/7811 , H01L29/7813 , H01L29/7827 , H01L29/7842 , H01L29/7848
摘要: In one embodiment, a vertical insulated-gate field effect transistor includes a feature embedded within a control electrode. The feature is placed within the control electrode to induce stress within predetermined regions of the transistor.
摘要翻译: 在一个实施例中,垂直绝缘栅场效应晶体管包括嵌入在控制电极内的特征。 该特征被放置在控制电极内以在晶体管的预定区域内引起应力。
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公开(公告)号:US20120313161A1
公开(公告)日:2012-12-13
申请号:US13159255
申请日:2011-06-13
申请人: Gordon M. Grivna , Zia Hossain , Kirk K. Huang , Balaji Padmanabhan , Francine Y. Robb , Prasad Venkatraman
发明人: Gordon M. Grivna , Zia Hossain , Kirk K. Huang , Balaji Padmanabhan , Francine Y. Robb , Prasad Venkatraman
IPC分类号: H01L29/78 , H01L21/336
CPC分类号: H01L29/7845 , H01L29/0869 , H01L29/407 , H01L29/41766 , H01L29/42368 , H01L29/42376 , H01L29/456 , H01L29/66666 , H01L29/66727 , H01L29/66734 , H01L29/7811 , H01L29/7813 , H01L29/7827 , H01L29/7842 , H01L29/7848
摘要: In one embodiment, a vertical insulated-gate field effect transistor includes a feature embedded within a control electrode. The feature is placed within the control electrode to induce stress within predetermined regions of the transistor.
摘要翻译: 在一个实施例中,垂直绝缘栅场效应晶体管包括嵌入在控制电极内的特征。 该特征被放置在控制电极内以在晶体管的预定区域内引起应力。
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公开(公告)号:US08034685B1
公开(公告)日:2011-10-11
申请号:US12771869
申请日:2010-04-30
申请人: Prasad Venkatraman , Zia Hossain , Kirk K. Huang
发明人: Prasad Venkatraman , Zia Hossain , Kirk K. Huang
IPC分类号: H01L21/336
CPC分类号: H01L29/7813 , H01L29/0638 , H01L29/407 , H01L29/41766 , H01L29/42368 , H01L29/4238 , H01L29/456 , H01L29/4933 , H01L29/66727 , H01L29/66734 , H01L29/7811
摘要: A semiconductor component that includes gate electrodes and shield electrodes and a method of manufacturing the semiconductor component. A semiconductor material has a device region, a gate contact region, a termination region, and a drain contact region. One or more device trenches is formed in the device region and one or more termination trenches is formed in the edge termination region. Shield electrodes are formed in portions of the device trenches that are adjacent their floors. A gate dielectric material is formed on the sidewalls of the trenches in the device region and gate electrodes are formed over and electrically isolated from the shield electrodes. A gate electrode in at least one of the trenches is connected to at least one shield electrode in the trenches.
摘要翻译: 包括栅电极和屏蔽电极的半导体部件和制造半导体部件的方法。 半导体材料具有器件区域,栅极接触区域,端接区域和漏极接触区域。 在器件区域中形成一个或多个器件沟槽,并且在边缘端接区域中形成一个或多个端接沟槽。 屏蔽电极形成在与其底板相邻的器件沟槽的部分中。 栅极电介质材料形成在器件区域中的沟槽的侧壁上,并且栅电极形成在屏蔽电极之上并与屏蔽电极电隔离。 至少一个沟槽中的栅电极连接到沟槽中的至少一个屏蔽电极。
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公开(公告)号:US20130248982A1
公开(公告)日:2013-09-26
申请号:US13895197
申请日:2013-05-15
申请人: Gordon M. Grivna , Zia Hossain , Kirk K. Huang , Balaji Padmanabhan , Francine Y. Robb , Prasad Venkatraman
发明人: Gordon M. Grivna , Zia Hossain , Kirk K. Huang , Balaji Padmanabhan , Francine Y. Robb , Prasad Venkatraman
CPC分类号: H01L29/7845 , H01L29/0869 , H01L29/407 , H01L29/41766 , H01L29/42368 , H01L29/42376 , H01L29/456 , H01L29/66666 , H01L29/66727 , H01L29/66734 , H01L29/7811 , H01L29/7813 , H01L29/7827 , H01L29/7842 , H01L29/7848
摘要: In one embodiment, a vertical insulated-gate field effect transistor includes a feature embedded within a control electrode. The feature is placed within the control electrode to induce stress within predetermined regions of the transistor.
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公开(公告)号:US20110266613A1
公开(公告)日:2011-11-03
申请号:US12771869
申请日:2010-04-30
申请人: Prasad Venkatraman , Zia Hossain , Kirk K. Huang
发明人: Prasad Venkatraman , Zia Hossain , Kirk K. Huang
IPC分类号: H01L27/06 , H01L21/336
CPC分类号: H01L29/7813 , H01L29/0638 , H01L29/407 , H01L29/41766 , H01L29/42368 , H01L29/4238 , H01L29/456 , H01L29/4933 , H01L29/66727 , H01L29/66734 , H01L29/7811
摘要: A semiconductor component that includes gate electrodes and shield electrodes and a method of manufacturing the semiconductor component. A semiconductor material has a device region, a gate contact region, a termination region, and a drain contact region. One or more device trenches is formed in the device region and one or more termination trenches is formed in the edge termination region. Shield electrodes are formed in portions of the device trenches that are adjacent their floors. A gate dielectric material is formed on the sidewalls of the trenches in the device region and gate electrodes are formed over and electrically isolated from the shield electrodes. A gate electrode in at least one of the trenches is connected to at least one shield electrode in the trenches.
摘要翻译: 包括栅电极和屏蔽电极的半导体部件和制造半导体部件的方法。 半导体材料具有器件区域,栅极接触区域,端接区域和漏极接触区域。 在器件区域中形成一个或多个器件沟槽,并且在边缘端接区域中形成一个或多个端接沟槽。 屏蔽电极形成在与其底板相邻的器件沟槽的部分中。 栅极电介质材料形成在器件区域中的沟槽的侧壁上,并且栅电极形成在屏蔽电极之上并与屏蔽电极电隔离。 至少一个沟槽中的栅电极连接到沟槽中的至少一个屏蔽电极。
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公开(公告)号:US08466513B2
公开(公告)日:2013-06-18
申请号:US13159255
申请日:2011-06-13
申请人: Gordon M. Grivna , Zia Hossain , Kirk K. Huang , Balaji Padmanabhan , Francine Y. Robb , Prasad Venkatraman
发明人: Gordon M. Grivna , Zia Hossain , Kirk K. Huang , Balaji Padmanabhan , Francine Y. Robb , Prasad Venkatraman
IPC分类号: H01L29/66
CPC分类号: H01L29/7845 , H01L29/0869 , H01L29/407 , H01L29/41766 , H01L29/42368 , H01L29/42376 , H01L29/456 , H01L29/66666 , H01L29/66727 , H01L29/66734 , H01L29/7811 , H01L29/7813 , H01L29/7827 , H01L29/7842 , H01L29/7848
摘要: In one embodiment, a vertical insulated-gate field effect transistor includes a feature embedded within a control electrode. The feature is placed within the control electrode to induce stress within predetermined regions of the transistor.
摘要翻译: 在一个实施例中,垂直绝缘栅场效应晶体管包括嵌入在控制电极内的特征。 该特征被放置在控制电极内以在晶体管的预定区域内引起应力。
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公开(公告)号:US08415739B2
公开(公告)日:2013-04-09
申请号:US12271106
申请日:2008-11-14
申请人: Prasad Venkatraman , Zia Hossain
发明人: Prasad Venkatraman , Zia Hossain
IPC分类号: H01L21/336
CPC分类号: H01L29/7813 , H01L29/0638 , H01L29/402 , H01L29/407 , H01L29/41766 , H01L29/456 , H01L29/4933 , H01L29/66727 , H01L29/66734 , H01L29/7811
摘要: A semiconductor component that includes an edge termination structure and a method of manufacturing the semiconductor component. A semiconductor material has a semiconductor device region and an edge termination region. One or more device trenches may be formed in the semiconductor device region and one or more termination trenches is formed in the edge termination region. A source electrode is formed in a portion of a termination trench adjacent its floor and a floating electrode termination structure is formed in the portion of the termination trench adjacent its mouth. A second termination trench may be formed in the edge termination region and a non-floating electrode may be formed in the second termination trench. Alternatively, the second termination trench may be omitted and a trench-less non-floating electrode may be formed in the edge termination region.
摘要翻译: 一种包括边缘终端结构的半导体部件和制造半导体部件的方法。 半导体材料具有半导体器件区域和边缘终止区域。 一个或多个器件沟槽可以形成在半导体器件区域中,并且在边缘终止区域中形成一个或多个端接沟槽。 源极电极形成在靠近其底板的终端沟槽的一部分中,并且在靠近其端口的端接沟槽的部分中形成浮动电极端接结构。 可以在边缘终止区域中形成第二终止沟槽,并且可以在第二终端沟槽中形成非浮置电极。 或者,可以省略第二终端沟槽,并且可以在边缘终止区域中形成无沟槽非浮动电极。
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公开(公告)号:US08207035B2
公开(公告)日:2012-06-26
申请号:US12696816
申请日:2010-01-29
IPC分类号: H01L21/336
CPC分类号: H01L29/7813 , H01L21/823487 , H01L21/823885 , H01L27/088 , H01L27/0922 , H01L29/0878 , H01L29/66734
摘要: In one embodiment, a vertical power transistor is formed on a semiconductor substrate with other transistors. A portion of the semiconductor layer underlying the vertical power transistor is doped to provide a low on-resistance for the vertical power transistor.
摘要翻译: 在一个实施例中,在具有其它晶体管的半导体衬底上形成垂直功率晶体管。 垂直功率晶体管下面的半导体层的一部分被掺杂以为垂直功率晶体管提供低导通电阻。
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公开(公告)号:US08748262B2
公开(公告)日:2014-06-10
申请号:US13458732
申请日:2012-04-27
IPC分类号: H01L21/336
CPC分类号: H01L29/7813 , H01L21/823487 , H01L21/823885 , H01L27/088 , H01L27/0922 , H01L29/0878 , H01L29/66734
摘要: In one embodiment, a vertical power transistor is formed on a semiconductor substrate with other transistors. A portion of the semiconductor layer underlying the vertical power transistor is doped to provide a low on-resistance for the vertical power transistor.
摘要翻译: 在一个实施例中,在具有其它晶体管的半导体衬底上形成垂直功率晶体管。 垂直功率晶体管下面的半导体层的一部分被掺杂以为垂直功率晶体管提供低导通电阻。
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公开(公告)号:US20120211827A1
公开(公告)日:2012-08-23
申请号:US13458732
申请日:2012-04-27
IPC分类号: H01L29/78 , H01L21/336
CPC分类号: H01L29/7813 , H01L21/823487 , H01L21/823885 , H01L27/088 , H01L27/0922 , H01L29/0878 , H01L29/66734
摘要: In one embodiment, a vertical power transistor is formed on a semiconductor substrate with other transistors. A portion of the semiconductor layer underlying the vertical power transistor is doped to provide a low on-resistance for the vertical power transistor.
摘要翻译: 在一个实施例中,在具有其它晶体管的半导体衬底上形成垂直功率晶体管。 垂直功率晶体管下面的半导体层的一部分被掺杂以为垂直功率晶体管提供低导通电阻。
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