Semiconductor component and method of manufacture
    3.
    发明授权
    Semiconductor component and method of manufacture 有权
    半导体元件及制造方法

    公开(公告)号:US08034685B1

    公开(公告)日:2011-10-11

    申请号:US12771869

    申请日:2010-04-30

    IPC分类号: H01L21/336

    摘要: A semiconductor component that includes gate electrodes and shield electrodes and a method of manufacturing the semiconductor component. A semiconductor material has a device region, a gate contact region, a termination region, and a drain contact region. One or more device trenches is formed in the device region and one or more termination trenches is formed in the edge termination region. Shield electrodes are formed in portions of the device trenches that are adjacent their floors. A gate dielectric material is formed on the sidewalls of the trenches in the device region and gate electrodes are formed over and electrically isolated from the shield electrodes. A gate electrode in at least one of the trenches is connected to at least one shield electrode in the trenches.

    摘要翻译: 包括栅电极和屏蔽电极的半导体部件和制造半导体部件的方法。 半导体材料具有器件区域,栅极接触区域,端接区域和漏极接触区域。 在器件区域中形成一个或多个器件沟槽,并且在边缘端接区域中形成一个或多个端接沟槽。 屏蔽电极形成在与其底板相邻的器件沟槽的部分中。 栅极电介质材料形成在器件区域中的沟槽的侧壁上,并且栅电极形成在屏蔽电极之上并与屏蔽电极电隔离。 至少一个沟槽中的栅电极连接到沟槽中的至少一个屏蔽电极。

    SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
    5.
    发明申请
    SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE 有权
    半导体元件及其制造方法

    公开(公告)号:US20110266613A1

    公开(公告)日:2011-11-03

    申请号:US12771869

    申请日:2010-04-30

    IPC分类号: H01L27/06 H01L21/336

    摘要: A semiconductor component that includes gate electrodes and shield electrodes and a method of manufacturing the semiconductor component. A semiconductor material has a device region, a gate contact region, a termination region, and a drain contact region. One or more device trenches is formed in the device region and one or more termination trenches is formed in the edge termination region. Shield electrodes are formed in portions of the device trenches that are adjacent their floors. A gate dielectric material is formed on the sidewalls of the trenches in the device region and gate electrodes are formed over and electrically isolated from the shield electrodes. A gate electrode in at least one of the trenches is connected to at least one shield electrode in the trenches.

    摘要翻译: 包括栅电极和屏蔽电极的半导体部件和制造半导体部件的方法。 半导体材料具有器件区域,栅极接触区域,端接区域和漏极接触区域。 在器件区域中形成一个或多个器件沟槽,并且在边缘端接区域中形成一个或多个端接沟槽。 屏蔽电极形成在与其底板相邻的器件沟槽的部分中。 栅极电介质材料形成在器件区域中的沟槽的侧壁上,并且栅电极形成在屏蔽电极之上并与屏蔽电极电隔离。 至少一个沟槽中的栅电极连接到沟槽中的至少一个屏蔽电极。

    Semiconductor component and method of manufacture
    7.
    发明授权
    Semiconductor component and method of manufacture 有权
    半导体元件及制造方法

    公开(公告)号:US08415739B2

    公开(公告)日:2013-04-09

    申请号:US12271106

    申请日:2008-11-14

    IPC分类号: H01L21/336

    摘要: A semiconductor component that includes an edge termination structure and a method of manufacturing the semiconductor component. A semiconductor material has a semiconductor device region and an edge termination region. One or more device trenches may be formed in the semiconductor device region and one or more termination trenches is formed in the edge termination region. A source electrode is formed in a portion of a termination trench adjacent its floor and a floating electrode termination structure is formed in the portion of the termination trench adjacent its mouth. A second termination trench may be formed in the edge termination region and a non-floating electrode may be formed in the second termination trench. Alternatively, the second termination trench may be omitted and a trench-less non-floating electrode may be formed in the edge termination region.

    摘要翻译: 一种包括边缘终端结构的半导体部件和制造半导体部件的方法。 半导体材料具有半导体器件区域和边缘终止区域。 一个或多个器件沟槽可以形成在半导体器件区域中,并且在边缘终止区域中形成一个或多个端接沟槽。 源极电极形成在靠近其底板的终端沟槽的一部分中,并且在靠近其端口的端接沟槽的部分中形成浮动电极端接结构。 可以在边缘终止区域中形成第二终止沟槽,并且可以在第二终端沟槽中形成非浮置电极。 或者,可以省略第二终端沟槽,并且可以在边缘终止区域中形成无沟槽非浮动电极。