公开(公告)号：US20210051247A1

公开(公告)日：2021-02-18

申请号：US16659641

申请日：2019-10-22

Applicant: PRIMAX ELECTRONICS LTD.

Inventor： CHIN-DING LAI

IPC: H04N5/225 ,  H02N2/02 ,  H02N2/06

Abstract: A camera module includes a substrate, a sensing chip, a lens module and a piezoelectric plate. The sensing chip is electrically connected with the substrate. The sensing chip includes a sensing region. The sensing chip is covered by the lens module. The sensing chip is arranged between the substrate and the lens module. When an external light beam passes through the lens module and projected on the sensing region, the sensing chip generates an image. The piezoelectric plate is arranged between the substrate and the lens module. When an electric power is provided to the piezoelectric plate, the piezoelectric plate is subjected to deformation, so that the lens group focuses on the sensing region. The present invention also provides a calibration method for the camera module.

公开(公告)号：US20160021283A1

公开(公告)日：2016-01-21

申请号：US14548986

申请日：2014-11-20

Applicant: Primax Electronics Ltd.

Inventor： CHIN-DING LAI

IPC: H04N5/225 ,  H04N5/232

CPC classification number: H04N5/2257 ,  H04N5/2171

Abstract: A camera module includes a sensing chip, a lens module and a gluing element. The gluing element is disposed on the sensing chip and located at a side of the sensing region. The lens module covers the sensing chip. A lens assembly of the lens module is aligned with the sensing region. When the camera module is subject to a vibration, the particles within the camera module are moved to and adsorbed on the gluing element. Consequently, the camera module o can reduce the possibility of falling down the particles on the sensing region.

Abstract translation: 相机模块包括感测芯片，透镜模块和胶合元件。 粘合元件设置在感测芯片上并且位于感测区域的一侧。 镜头模块覆盖感测芯片。 透镜模块的透镜组件与感测区域对准。 当相机模块受到振动时，照相机模块内的颗粒被移动并吸附在胶合元件上。 因此，相机模块o可以降低在感测区域上掉落颗粒的可能性。

公开(公告)号：US20170201660A1

公开(公告)日：2017-07-13

申请号：US15077829

申请日：2016-03-22

Applicant: Primax Electronics Ltd.

Inventor： CHIN-DING LAI ,  TA-SHENG YU ,  HAN-KAI WANG

IPC: H04N5/225 ,  H05K3/36 ,  H05K1/11 ,  H04N5/232 ,  H05K1/14

CPC classification number: H04N5/2257 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/23241 ,  H05K1/117 ,  H05K1/141 ,  H05K1/144 ,  H05K3/363 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/056 ,  H05K2201/10121

Abstract: A camera module includes a lens assembly, a power device with a first circuit board, a second circuit board and a welding element. The first circuit board is partially bent, and thus an electrical contact of the first circuit board is exposed to a lateral side of the power device. The second circuit board includes a conductive hole corresponding to the electrical contact. The conductive hole is exposed to a lateral side of the second circuit board. The welding element is installed on the lateral side of the power device and the lateral side of the second circuit board. The welding element is contacted with the electrical contact and the conductive hole, so that the first circuit board and the second circuit board are electrically connected with each other.