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公开(公告)号：US20220394859A1
公开(公告)日：2022-12-08
申请号：US17887629
申请日：2022-08-15
发明人： FU-YUN SHEN , MING-JAAN HO , HSIAO-TING HSU , LIN-JIE GAO
摘要： A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.
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公开(公告)号：US20220336230A1
公开(公告)日：2022-10-20
申请号：US17764262
申请日：2019-09-27
发明人： MAN-ZHI PENG , RUI-WU LIU , SI XIONG , LIN-JIE GAO
IPC分类号： H01L21/48 , H01L23/498 , H01L23/00
摘要： An interposer, which is used to connect two circuit boards, includes an inner structure (10), an outer structure (20), and a protective layer (50). The inner structure (10) includes a first base layer (11) and a first wiring layer (131) formed on the first base layer (11). The outer structure (20) includes a second base layer (21) and a second wiring layer (231) formed on the second base layer (21). An end portion of at least wiring line of the first wiring layer (131) and the second wiring layer (231) extends to a sidewall of the interposer (100). An end of another wiring line extends to the other sidewall of the interposer (100). The first wiring layer (131) is electrically connected to the second wiring layer (231) by a conductive blind hole (41).
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公开(公告)号：US20200077513A1
公开(公告)日：2020-03-05
申请号：US16452237
申请日：2019-06-25
发明人： TZU-CHIEN YEH , LIN-JIE GAO
摘要： A rigid-flex circuit board includes a core substrate, a first adhesive layer, and a first outer conductive circuit layer. The core substrate includes a first and a second base layer, a first and a second conductive circuit layer respectively on the first and second base layer, and an insulating layer between the first and second base layer. The first and second conductive circuit layer are embedded in the insulating layer. The first adhesive layer is on the first base layer and defines a first opening which exposes the first opening. The first outer conductive circuit layer is on the first adhesive layer and defines an opening aligned with the first opening. A portion of the core substrate located within the first opening is defined as a flexible board section, and the portions of the core substrate located outside of the first opening are defined as a hard board section.
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4.发明申请公开(公告)号：US20220039266A1
公开(公告)日：2022-02-03
申请号：US17027927
申请日：2020-09-22
发明人： LIN-JIE GAO , YONG-CHAO WEI
摘要： A circuit board includes a multilayer wiring board including a first wiring board and a second wiring board. A receiving cavity penetrates the second wiring board and corresponds to at least one connecting pad of the first wiring board. The receiving cavity includes a receiving portion penetrating the second wiring board and a plurality of recessed portions. Each recessed portion penetrates the second wiring board and is recessed from an inner wall defining the receiving portion. A width of each recessed portion gradually increases from a surface of the second wiring board facing the first wiring board toward a surface of the second wiring board facing away from the first wiring board. An electronic component is received in the receiving cavity and electrically connected to the at least one connecting pad. An adhesive fills in a gap between the electronic component and the second wiring board.
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公开(公告)号：US20220037270A1
公开(公告)日：2022-02-03
申请号：US17000660
申请日：2020-08-24
发明人： YONG-CHAO WEI , LIN-JIE GAO , WEI-LIANG WU
IPC分类号： H01L23/66 , H01L23/552 , H01L23/367 , H01Q1/22 , H01L21/48 , H01L23/498
摘要： A package circuit structure includes a metal board including a first surface and a second surface, a plurality of embedded components, an insulating layer, and two antenna circuit boards. At least one first groove is recessed from the first surface. At least one second groove is recessed from the second surface. The first groove and the second groove are spaced with each other along a first direction perpendicular to a thickness direction of the metal board. Each embedded component is mounted in the first groove or the second groove. The insulating layer covers the first surface and the second surface and fills the first groove and the second groove. The antenna circuit boards are respectively stacked on two opposite sides of the insulating layer. Each antenna circuit board includes at least one antenna and at least one ground wiring. The metal board is electrically connected to each ground wiring.
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公开(公告)号：US20220338348A1
公开(公告)日：2022-10-20
申请号：US17335059
申请日：2021-05-31
申请人： Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , GARUDA TECHNOLOGY CO., LTD.
发明人： LIN-JIE GAO , YONG-CHAO WEI
摘要： A method for manufacturing a circuit board embeds a portion of an outer circuit layer in an outer dielectric layer which increases contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the finished circuit board.
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公开(公告)号：US20230199954A1
公开(公告)日：2023-06-22
申请号：US18111738
申请日：2023-02-20
申请人： Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , GARUDA TECHNOLOGY CO., LTD.
发明人： LIN-JIE GAO , YONG-CHAO WEI
CPC分类号： H05K1/114 , H05K3/0041 , H05K1/056 , H05K3/3452 , H05K3/421 , H05K2203/0415 , H05K2201/0191 , H05K2201/09036 , H05K2201/09509 , H05K2201/0358 , H05K2201/0195
摘要： A circuit board includes an inner circuit substrate and an outer circuit substrate electrically connected to the inner circuit substrate. The outer circuit substrate includes an outer dielectric layer and an outer circuit layer facing the inner circuit substrate embedded in the outer dielectric layer. A portion of the outer circuit layer facing away from the inner circuit substrate protruding from the outer dielectric layer. The circuit board can increase contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the circuit board.
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