HOUSING MECHANISM FOR ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME
    1.
    发明申请
    HOUSING MECHANISM FOR ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME 失效
    用于电子设备的住房机构及其制造方法

    公开(公告)号:US20070171603A1

    公开(公告)日:2007-07-26

    申请号:US11610086

    申请日:2006-12-13

    IPC分类号: H05K5/00

    CPC分类号: H04M1/0202 H04M1/18

    摘要: An exemplary housing mechanism (100) for an electronic device includes a front cover (10), a back cover (20), and an elastic sealing element (12). The front cover has a projecting edge (18) defined thereon. The back cover has a recessed edge (26) defined therein. The elastic sealing element has a tip portion (122) and is formed or sealed together with the front cover. The projecting edge of the front cover and the tip portion of the elastic sealing element are configured to be press fit into the recessed edge of the back cover.

    摘要翻译: 用于电子设备的示例性壳体机构(100)包括前盖(10),后盖(20)和弹性密封元件(12)。 前盖具有限定在其上的突出边缘(18)。 后盖具有限定在其中的凹入边缘(26)。 弹性密封元件具有尖端部分(122)并且与前盖形成或密封在一起。 前盖的突出边缘和弹性密封元件的前端部被配置成压配合到后盖的凹进边缘中。