公开(公告)号：US20160240455A1

公开(公告)日：2016-08-18

申请号：US14625452

申请日：2015-02-18

Applicant: QUALCOMM Incorporated

Inventor： Sun YUN ,  Rajneesh KUMAR ,  Houssam Wafic JOMAA ,  Joan Rey V. BUOT

IPC: H01L23/367 ,  H01L23/528 ,  H01L25/07 ,  H01L23/373

CPC classification number: H01L23/3675 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L25/072 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/3511

Abstract: Some examples of the disclosure include a semiconductor package having a heat spreader, an outer perimeter portion attached to the bottom of the heat spreader along the perimeter and having a plurality of electrical pathways, a package substrate located below and spaced from the outer perimeter portion and having a plurality of electrical pathways, a plurality of connection points located between the outer perimeter component and the package substrate to provide connection points coupling the plurality of electrical pathways of the outer perimeter portion to the plurality of electrical pathways in the package substrate, and a cavity formed on the bottom of the heat spreader inside the outer perimeter portion.

Abstract translation: 本公开的一些示例包括具有散热器的半导体封装，沿着周边附接到散热器底部并具有多个电路径的外周边部分，位于外周部分下方并与外周部分隔开的封装基板， 具有多个电路径，多个连接点，位于所述外周边部件和所述封装衬底之间，以提供连接点，所述连接点将所述外周边部分的所述多个电通路连接到所述封装衬底中的所述多个电路径，以及 在外周部分内的散热器底部形成的空腔。

公开(公告)号：US20150333004A1

公开(公告)日：2015-11-19

申请号：US14276763

申请日：2014-05-13

Applicant: QUALCOMM Incorporated

Inventor： Houssam Wafic JOMAA ,  Omar James BCHIR ,  Kuiwon KANG ,  Chin-Kwan KIM

IPC: H01L23/522 ,  H01L21/768

CPC classification number: H01L23/5226 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76877 ,  H01L21/76895 ,  H01L23/5383 ,  H01L23/5384 ,  H01L2221/68345 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods and apparatus for formation of a semiconductor substrate with photoactive dielectric material, embedded traces, a padless skip via extending through two dielectric layers, and a coreless package are provided. In one embodiment, a method for forming a core having a copper layer; laminating the copper layer a photoactive dielectric layer; forming a plurality of trace patterns in the photoactive dielectric layer; plating the plurality of trace patterns to form a plurality of traces; forming an insulating dielectric layer on the photoactive dielectric layer; forming a via through the insulating dielectric layer and the photoactive dielectric layer; forming additional routing patterns on the insulating dielectric layer; removing the core; and applying a solder mask.

Abstract translation: 提供了用光电介质材料形成半导体衬底的方法和装置，嵌入迹线，延伸穿过两个电介质层的无衬垫跳过和无芯封装。 在一个实施例中，一种形成具有铜层的芯的方法; 将铜层层压成光电介质层; 在光电介质层中形成多个迹线图案; 电镀所述多个迹线图案以形成多个迹线; 在光电介质层上形成绝缘介电层; 通过绝缘介电层和光电介质层形成通孔; 在所述绝缘介电层上形成额外的布线图案; 去除核心; 并施加焊接掩模。