Laser-based integrated circuit testing techniques

    公开(公告)号:US10324131B1

    公开(公告)日:2019-06-18

    申请号:US15872281

    申请日:2018-01-16

    Abstract: The present disclosure provide techniques for semiconductor testing, and more particularly, to systems and methods for laser-based fault isolation and design for testability (DFT) diagnosis techniques. In one embodiment, an integrated chip (IC) testing apparatus, includes an input pin; a decompressor connected to the input pin; a plurality of scan chains, each scan chain of the plurality of scan chains comprising a plurality of scan cells; a plurality of scan chain control elements, each scan chain control element of the plurality of scan chain control elements being connected between the decompressor and a respective scan chain of the plurality of scan chains, wherein each scan chain control element is configured to enable or disable test data from flowing from the compressor to the respective scan chain; a compressor connected to an output of each scan chain of the plurality of scan chains; and an output pin connected to the compressor.

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