摘要:
Various embodiments are disclosed relating filter calibration with cell re-use. According to an example embodiment, an apparatus includes a first circuit, including a variable circuit element. The first circuit is adapted to output an output frequency signal during a calibration mode and to operate as a filter during a filter mode. A control circuit is coupled to the first circuit and is adapted to receive a reference frequency signal and to calibrate the first circuit by adjusting the variable circuit element based on the reference frequency signal and the output frequency signal during the calibration mode. The calibrated first circuit is configured to then operate as a filter during the filter mode.
摘要:
A multiple stage band pass filter of a Radio Frequency (RF) Integrated Circuit is provided with a low pass mixer output filter coupled to receive a down sampled analog information signal, a buffer coupled to an output of the low pass mixer output filter, a low pass buffer output filter coupled to an output of the buffer and a plurality of band pass filters coupled to an output of the low pass buffer output filter.
摘要:
A multiple stage band pass filter of a Radio Frequency (RF) Integrated Circuit is provided with a low pass mixer output filter coupled to receive a down sampled analog information signal, a buffer coupled to an output of the low pass mixer output filter, a low pass buffer output filter coupled to an output of the buffer and a plurality of band pass filters coupled to an output of the low pass buffer output filter.
摘要:
A dual-band input transceiver block is formed to operably receive one of a 2.4 GHz radio frequency signal or a 5.0 GHz radio frequency transceiver signal in a manner that minimizes duplication of circuitry and creates a combined circuit path for RF front end input stages for much of the input stage. More specifically, the embodiments of the present invention include separate amplification and mixing stages whose outputs are combined by a stabilized load with circuitry for removing a common mode feedback signal. As such, downstream components, such as amplifiers, filters, analog-to-digital converters, and other input path circuit elements, are not duplicated and may be used regardless of whether the dual-band transceiver is operating in a first or second frequency band. Operation is, in the described embodiment, only one frequency input at a time though the invention is not limited to such operation. More specifically, a first input section is operably coupled to receive a first local oscillation input and a first frequency band signal input. A second input section is coupled to receive a second local oscillation input and a second frequency band signal input. Outputs of the first and second input sections are produced to a stabilized load with a common mode feedback block for removing a common mode feedback signal. As such, an output signal is produced having a regulated DC level and having any common mode feedback signal eliminated there from.
摘要:
A dual-band input transceiver block is formed to operably receive one of a 2.4 GHz radio frequency signal or a 5.0 GHz radio frequency transceiver signal in a manner that minimizes duplication of circuitry and creates a combined circuit path for RF front end input stages for much of the input stage. The embodiments include separate amplification and mixing stages whose outputs are combined by a stabilized load with circuitry for removing a common mode feedback signal. A first input section is operably coupled to receive a first local oscillation input and a first frequency band signal input. A second input section is coupled to receive a second local oscillation input and a second frequency band signal input. Outputs of the first and second input sections are produced to a stabilized load with a common mode feedback block for removing a common mode feedback signal.
摘要:
Off-chip LC circuit for lowest ground and VDD impedance for power amplifier. A novel approach is made by which a chip to PCB (Printer Circuit Board) interface may be made such that the ground and VDD potential levels are effectively brought onto the die of the chip such that a true ground potential is maintained within the chip. This off-chip LC circuit operates cooperatively with an on-chip decoupling capacitor to reduce the overall effective inductance of the bond wires employed to bring signal and voltage levels from the die to the chip exterior. This circuit ensures a relatively low impedance for a PA (Power Amplifier) that is implemented within chip thereby providing for improved performance.
摘要:
According to an example embodiment, an apparatus is provided in a wireless transceiver. The apparatus may include a circuit configured to generate a first frequency signal (e.g., a VCO signal). A local oscillator (LO) generator may be provided that includes a frequency divider to divide the first frequency signal, and an image rejection mixer configured to mix the first frequency signal with an output of the frequency divider to generate an LO signal. In this manner, the LO generator may generate a desired LO signal while substantially rejecting or suppressing an unwanted sideband or image signal, according to an example embodiment.
摘要:
Off-chip LC circuit for lowest ground and VDD impedance for power amplifier. A novel approach is made by which a chip to PCB (Printer Circuit Board) interface may be made such that the ground and VDD potential levels are effectively brought onto the die of the chip such that a true ground potential is maintained within the chip. This off-chip LC circuit operates cooperatively with an on-chip decoupling capacitor to reduce the overall effective inductance of the bond wires employed to bring signal and voltage levels from the die to the chip exterior. This circuit ensures a relatively low impedance for a PA (Power Amplifier) that is implemented within chip thereby providing for improved performance.
摘要:
Off-chip LC circuit for lowest ground and VDD impedance for power amplifier. A novel approach is made by which a chip to PCB (Printer Circuit Board) interface may be made such that the ground and VDD potential levels are effectively brought onto the die of the chip such that a true ground potential is maintained within the chip. This off-chip LC circuit operates cooperatively with an on-chip decoupling capacitor to reduce the overall effective inductance of the bond wires employed to bring signal and voltage levels from the die to the chip exterior. This circuit ensures a relatively low impedance for a PA (Power Amplifier) that is implemented within chip thereby providing for improved performance.
摘要:
A transceiver front end includes a transmit/receive (T/R) switch, a first balun, a second balun, a low noise amplifier, a power amplifier, and compensation circuitry. The T/R switch is operably coupled to an antenna for receiving inbound radio frequency (RF) signals and for transmitting outbound RF signals. The first balun includes a single ended winding and a differential winding, where the single ended winding is operably coupled to the T/R switch. The second balun includes a single ended winding and a differential winding, where the single ended winding is operably coupled to the T/R switch. The low noise amplifier is operably coupled the differential winding of the first balun. The power amplifier is operably coupled to the differential winding of the second balun. The compensation circuitry is operably coupled to the first balun to compensate for at least one of phase imbalance, amplitude imbalance, and impedance imbalance of the first balun.