公开(公告)号：US3783348A

公开(公告)日：1974-01-01

申请号：US3783348D

申请日：1972-10-30

Applicant: RCA CORP

Inventor： SWARTZ G ,  CHAMBERLAIN R

IPC: H01L23/433 ,  H01L23/488 ,  H01L23/66 ,  H01L3/00 ,  H01L5/00

CPC classification number: H01L23/66 ,  H01L23/4334 ,  H01L23/488 ,  H01L2224/09181 ,  H01L2224/45144 ,  H01L2924/00

Abstract: A semiconductor assembly is presented which uses an encapsulated semiconductor device with a substantially U-shaped contact ribbon bonded thereto. The contact ribbon has elbows which extend beyond the surface of the semiconductor device. Upon the application of direct, downward pressure at the ends of the contact ribbon, the downward pressure is transferred to and absorbed by the encapsulating material. This assembly allows for very short lead length to the semiconductor device while at the same time shielding the semiconductor device from direct pressure.

Abstract translation: 提出了一种半导体组件，其使用具有与其结合的大致U形接触带的封装半导体器件。 接触带具有延伸超出半导体器件表面的弯头。 当在接触带的端部施加直接的向下的压力时，向下的压力被转移并被封装材料吸收。 该组件允许半导体器件的引线长度非常短，同时屏蔽半导体器件免受直接压力。

公开(公告)号：US3753053A

公开(公告)日：1973-08-14

申请号：US3753053D

申请日：1972-10-30

Applicant: RCA CORP

Inventor： SWARTZ G

IPC: H01L23/12 ,  H01L23/36 ,  H01L23/48 ,  H01L23/488 ,  H01L3/00 ,  H01K5/00

CPC classification number: H01L24/72 ,  H01L23/36 ,  H01L23/488 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12036 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A semiconductor assembly for use with a high frequency semiconductor device is presented which uses at least one standoff having a conductive surface which overhangs the semiconductor device and which has pressure-absorbing contacts mounted thereon thereby protecting the semiconductor from direct pressure while providing for electrical contact to the semiconductor and allowing for very short leads from the stand-off to the semiconductor device.

Abstract translation: 提出了一种与高频半导体器件一起使用的半导体组件，其使用至少一个具有突出于半导体器件的导电表面并具有安装在其上的压力吸收触点的支架，从而保护半导体免受直接压力，同时提供电气 接触半导体并且允许从支架到半导体器件的非常短的引线。