公开(公告)号：US3772575A

公开(公告)日：1973-11-13

申请号：US3772575D

申请日：1971-04-28

Applicant: RCA CORP

Inventor： HEGARTY B ,  TREVAIL L

IPC: H01L21/00 ,  H01L21/60 ,  H01L23/485 ,  H01L29/00 ,  H01L1/12 ,  H01L1/14 ,  H01L13/00

CPC classification number: H01L21/00 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/81 ,  H01L29/00 ,  H01L2224/0401 ,  H01L2224/06051 ,  H01L2224/13099 ,  H01L2224/14051 ,  H01L2224/141 ,  H01L2224/16238 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01072 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An improved method of flip-chip mounting a semiconductor device, such as a transistor, on a pattern of electrical conductors carried on an insulating substrate, comprising providing the device chip with a glass protective layer and on the glass layer metallized bonding pads adjacent to the corners of the chip. Each of the bonding pads includes a relatively wide portion adapted to contain a relatively high mound of solder, and a second portion of a relatively narrow width capable of holding only a thin layer of solder. The thin solder layers overlie heat-generating P-N junction portions of the device. The conductors on the substrate have solder-wettable portions of larger areas than the bonding pads on the chip. Solder balls are placed on the wide portions of the bonding pads and melted to reflow the solder. The chip is then placed face down over the conductors on the substrate and the solder is again reflowed so that the relatively high mounds collapse to the thickness of the thin solder layer portions and the relatively thin solder layer portions are joined directly to the substrate conductors.

Abstract translation: 一种将半导体器件（例如晶体管）倒装芯片安装在承载在绝缘衬底上的电导体图案上的改进方法，包括向器件芯片提供玻璃保护层，并在玻璃层上与金属化接合焊盘相邻的金属化接合焊盘 芯片的角落。 每个接合焊盘包括适于容纳相对较高的焊料堆的相对较宽的部分，以及能够仅保持一薄层焊料的较窄宽度的第二部分。 薄的焊料层覆盖器件的发热P-N结部分。 衬底上的导体具有比芯片上的接合焊盘更大的区域的可焊接部分。 将焊球放置在焊盘的宽部分上并熔化以回流焊料。 然后将芯片面朝下地放置在衬底上的导体上，并且焊料再次回流，使得相对较高的土堆塌陷至薄焊料层部分的厚度，并且相对较薄的焊料层部分直接接合到衬底导体。

公开(公告)号：US3823469A

公开(公告)日：1974-07-16

申请号：US39166573

申请日：1973-08-27

Applicant: RCA CORP

Inventor： HEGARTY B ,  TREVAIL L

IPC: H01L21/00 ,  H01L21/60 ,  H01L23/485 ,  H01L29/00 ,  B01J17/00

CPC classification number: H01L21/00 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/81 ,  H01L29/00 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/13012 ,  H01L2224/13099 ,  H01L2224/1401 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An improved method of flip-chip mounting a semiconductor device, such as a transistor, on a pattern of electrical conductors carried on an insulating substrate, comprising providing the device chip with a glass protective layer and on the glass layer metallized bonding pads adjacent to the corners of the chip. Each of the bonding pads includes a relatively wide portion adapted to contain a relatively high mound of solder, and a second portion of a relatively narrow width capable of holding only a thin layer of solder. The thin solder layers overlie heat-generating P-N junction portions of the device. The conductors on the substrate have solder-wettable portions of larger areas than the bonding pads on the chip. Solder balls are placed on the wide portions of the bonding pads and melted to reflow the solder. The chip is then placed face down over the conductors on the substrate and the solder is again reflowed so that the relatively high mounds collapse to the thickness of the thin solder layer portions and the relatively thin solder layer portions are joined directly to the substrate conductors.

Abstract translation: 一种将半导体器件（例如晶体管）倒装芯片安装在承载在绝缘衬底上的电导体图案上的改进方法，包括向器件芯片提供玻璃保护层，并在玻璃层上与金属化接合焊盘相邻的金属化接合焊盘 芯片的角落。 每个接合焊盘包括适于容纳相对较高的焊料堆的相对较宽的部分，以及能够仅保持一薄层焊料的较窄宽度的第二部分。 薄的焊料层覆盖器件的发热P-N结部分。 衬底上的导体具有比芯片上的接合焊盘更大的区域的可焊接部分。 将焊球放置在焊盘的宽部分上并熔化以回流焊料。 然后将芯片面朝下地放置在衬底上的导体上，并且焊料再次回流，使得相对较高的土堆塌陷至薄焊料层部分的厚度，并且相对较薄的焊料层部分直接接合到衬底导体。