公开(公告)号：US11870774B2

公开(公告)日：2024-01-09

申请号：US17316962

申请日：2021-05-11

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： Hong-Hai Dai ,  Yang Li ,  Dong-Yu He ,  Jiayuan Tan

IPC: H04L9/40 ,  G06F21/32

CPC classification number: H04L63/0861 ,  G06F21/32 ,  H04L63/0428 ,  H04L63/166

Abstract: A method for authentication data transmission and a system thereof are provided. The method is operated in a computer system that is connected to a biometric device, and a secure channel is established there-between according to a security protocol. The computer system can receive encrypted biometric feature data from the biometric device based on a request. In a secure environment built in the computer system, the biometric feature data is decrypted and biometric features can be extracted. A comparison result is generated after comparing the biometric features with feature data in a database. The comparison result can be transmitted to the biometric device. The comparison result is then encrypted in the biometric device according to the security protocol. The biometric device can therefore transmit the encrypted comparison result to the computer system via the secure channel.

公开(公告)号：US20230232543A1

公开(公告)日：2023-07-20

申请号：US17742510

申请日：2022-05-12

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： Hai-Tao Li ,  Hong-Hai Dai

IPC: H05K3/36 ,  H05K3/34 ,  H05K1/02 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K3/361 ,  H05K3/3436 ,  H05K3/3426 ,  H05K1/0268 ,  H05K1/147 ,  H05K1/111 ,  H05K2201/094

Abstract: A die package structure and a method for fabricating the same are provided. The method includes: fixing a first die on a package base; aligning first hollow pads of a flexible printed circuit board with first pads of the first die, and fixing the flexible printed circuit board; soldering the first hollow pads to the first pads; fixing a second die on the flexible printed circuit board to overlap with the first die; folding the flexible printed circuit board, such that second hollow pads of the flexible printed circuit board are aligned with second pads of the second die, and signal test pads of the flexible printed circuit board are exposed; fixing the flexible printed circuit board on the second die; soldering the second hollow pads to the second pads; soldering metal wires to the signal test soldering pads; and soldering package pins to the metal wires.

公开(公告)号：US12089346B2

公开(公告)日：2024-09-10

申请号：US17742510

申请日：2022-05-12

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： Hai-Tao Li ,  Hong-Hai Dai

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/361 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/147 ,  H05K1/189 ,  H05K3/3426 ,  H05K3/3436 ,  H05K2201/056 ,  H05K2201/094

Abstract: A die package structure and a method for fabricating the same are provided. The method includes: fixing a first die on a package base; aligning first hollow pads of a flexible printed circuit board with first pads of the first die, and fixing the flexible printed circuit board; soldering the first hollow pads to the first pads; fixing a second die on the flexible printed circuit board to overlap with the first die; folding the flexible printed circuit board, such that second hollow pads of the flexible printed circuit board are aligned with second pads of the second die, and signal test pads of the flexible printed circuit board are exposed; fixing the flexible printed circuit board on the second die; soldering the second hollow pads to the second pads; soldering metal wires to the signal test soldering pads; and soldering package pins to the metal wires.

公开(公告)号：US20210390166A1

公开(公告)日：2021-12-16

申请号：US17039322

申请日：2020-09-30

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： Song Li ,  Hong-Hai Dai ,  Fu-Juan Cen

IPC: G06F21/32 ,  G10L17/24

Abstract: An electronic component for an electronic device with a locking function and an unlocking method thereof are provided. The unlocking method includes: receiving a first sound extraction request by a first processing circuit when the electronic device is in a locked mode; determining, by the first processing circuit, whether a first voice input signal is received after receiving the first sound extraction request; determining, by the first processing circuit when the first processing circuit receives the first voice input signal, whether first voice data included in the first voice input signal matches first preset voice data; and transmitting, by the first processing circuit, the first voice input signal to the second processing circuit when the first voice data matches the first preset voice data, to trigger the second processing circuit to determine whether second voice data included in the first voice input signal matches second preset voice data.