SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
    半导体存储器件及其制造方法

    公开(公告)号:US20140327066A1

    公开(公告)日:2014-11-06

    申请号:US14335401

    申请日:2014-07-18

    Abstract: In a non-volatile memory in which writing/erasing is performed by changing a total charge amount by injecting electrons and holes into a silicon nitride film serving as a charge accumulation layer, in order to realize a high efficiency of a hole injection from a gate electrode, the gate electrode of a memory cell comprises a laminated structure made of a plurality of polysilicon films with different impurity concentrations, for example, a two-layered structure comprising a p-type polysilicon film with a low impurity concentration and a p|-type polysilicon film with a high impurity concentration deposited thereon.

    Abstract translation: 在通过将电子和空穴注入到用作电荷累积层的氮化硅膜中来改变总电荷量进行写/擦除的非易失性存储器中,为了实现从栅极的空穴注入的高效率 电极,存储单元的栅电极包括由具有不同杂质浓度的多个多晶硅膜制成的层压结构,例如包括具有低杂质浓度的p型多晶硅膜和具有较低杂质浓度的双层结构的双层结构 沉积有高杂质浓度的多晶硅膜。

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