公开(公告)号：US20230352382A1

公开(公告)日：2023-11-02

申请号：US18170678

申请日：2023-02-17

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Takashi KARASHIMA

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L23/16

CPC classification number: H01L23/49816 ,  H01L23/49822 ,  H01L24/48 ,  H01L23/3128 ,  H01L23/16 ,  H01L2224/48227 ,  H01L2224/32225 ,  H01L24/32 ,  H01L2224/73265 ,  H01L24/73

Abstract: A wiring substrate includes a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer, a third conductive layer, a third insulating layer, and a fourth conductive layer. Given that an occupancy ratio of a first conductive pattern in the first conductive layer is a first occupancy ratio, an occupancy ratio of a second conductive pattern in the second conductive layer is a second occupancy ratio, an occupancy ratio of a third conductive pattern in the third conductive layer is a third occupancy ratio, and an occupancy ratio of a fourth conductive pattern in the fourth conductive layer is a fourth occupancy ratio, each of the first occupancy ratio and the third occupancy ratio is greater than each of the second occupancy ratio and the fourth occupancy ratio.

公开(公告)号：US20160343755A1

公开(公告)日：2016-11-24

申请号：US15095033

申请日：2016-04-09

Applicant: Renesas Electronics Corporation

Inventor： Takashi KARASHIMA ,  Yumi Imamura ,  Yosuke Imazeki

IPC: H01L27/146 ,  H01L23/13 ,  H01L23/40 ,  H01L23/498 ,  H01L23/373 ,  H01L23/367 ,  H01L23/06 ,  H01L23/15

CPC classification number: H01L23/40 ,  H01L23/055 ,  H01L23/10 ,  H01L23/36 ,  H01L23/38 ,  H01L23/4093 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/562 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An object of the present invention is to improve the reliability of a semiconductor device having an imaging function.A semiconductor device includes a package having a cavity and terminals (TE1), a semiconductor chip that has an imaging unit and is arranged in the cavity, and a cap material with which the cavity is sealed and which has translucency. In addition, the semiconductor device includes a mounting board that has a through-hole and terminals (TE2) and is arranged so as to electrically couple the terminals (TE1) to the terminals (TE2), a heat transfer member that is inserted into the through-hole and is coupled to the package, and a heat sink coupled to the heat transfer member.

Abstract translation: 半导体器件包括具有空腔的封装和端子（TE1），具有成像单元并且布置在空腔中的半导体芯片，以及封装有空腔并具有半透明性的盖材料。 此外，半导体器件包括具有通孔和端子（TE2）的安装板，并且被布置成将端子（TE1）电连接到端子（TE2），将传热构件插入到 并且耦合到所述封装，以及联接到所述传热构件的散热器。