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公开(公告)号：US09942994B2
公开(公告)日：2018-04-10
申请号：US14750384
申请日：2015-06-25
Applicant: RF Micro Devices, Inc.
Inventor： Thomas Scott Morris , Ulrik Riis Madsen , Donald Joseph Leahy
IPC: H01L23/552 , H05K3/40 , H01L23/498 , H05K1/11 , H05K9/00 , H05K3/30 , H01L21/56 , H01L23/00
CPC classification number: H05K3/4038 , H01L21/561 , H01L23/49827 , H01L23/552 , H01L24/97 , H01L2924/1461 , H05K1/115 , H05K3/301 , H05K9/0024 , H05K2201/0715 , Y10T29/49165 , H01L2924/00
Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.
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公开(公告)号：US20150296631A1
公开(公告)日：2015-10-15
申请号：US14750384
申请日：2015-06-25
Applicant: RF Micro Devices, Inc.
Inventor： Thomas Scott Morris , Ulrik Riis Madsen , Donald Joseph Leahy
CPC classification number: H05K3/4038 , H01L21/561 , H01L23/49827 , H01L23/552 , H01L24/97 , H01L2924/1461 , H05K1/115 , H05K3/301 , H05K9/0024 , H05K2201/0715 , Y10T29/49165 , H01L2924/00
Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.
Abstract translation: 在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。 最初在单个元模块上形成不同模块的电路。 每个模块将具有其中形成电路的一个或多个组件区域。 对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。 然后在元模块上的所有模块上形成单体，例如包覆模体。 至少与要被屏蔽的每个组件区域相关联的导电垂直互连访问结构（通孔）然后通过切割，钻孔或类似操作通过身体暴露。 接下来，将电磁屏蔽材料施加到待屏蔽的每个部件区域的主体的外表面并与暴露的导电通孔接触。
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公开(公告)号：US09420704B2
公开(公告)日：2016-08-16
申请号：US14447847
申请日：2014-07-31
Applicant: RF Micro Devices, Inc.
Inventor： Thomas Scott Morris , Ulrik Riis Madsen , Donald Joseph Leahy
IPC: H01L23/58 , H05K3/40 , H01L23/498 , H01L23/552 , H05K1/11 , H05K9/00 , H05K3/30 , H01L21/56 , H01L23/00
CPC classification number: H05K3/4038 , H01L21/561 , H01L23/49827 , H01L23/552 , H01L24/97 , H01L2924/1461 , H05K1/115 , H05K3/301 , H05K9/0024 , H05K2201/0715 , Y10T29/49165 , H01L2924/00
Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.
Abstract translation: 在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。 最初在单个元模块上形成不同模块的电路。 每个模块将具有其中形成电路的一个或多个组件区域。 对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。 然后在元模块上的所有模块上形成单体，例如包覆模体。 至少与要被屏蔽的每个组件区域相关联的导电垂直互连访问结构（通孔）然后通过切割，钻孔或类似操作通过身体暴露。 接下来，将电磁屏蔽材料施加到待屏蔽的每个部件区域的主体的外表面并与暴露的导电通孔接触。
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公开(公告)号：US20140340859A1
公开(公告)日：2014-11-20
申请号：US14447847
申请日：2014-07-31
Applicant: RF Micro Devices, Inc.
Inventor： Thomas Scott Morris , Ulrik Riis Madsen , Donald Joseph Leahy
CPC classification number: H05K3/4038 , H01L21/561 , H01L23/49827 , H01L23/552 , H01L24/97 , H01L2924/1461 , H05K1/115 , H05K3/301 , H05K9/0024 , H05K2201/0715 , Y10T29/49165 , H01L2924/00
Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.
Abstract translation: 在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。 最初在单个元模块上形成不同模块的电路。 每个模块将具有其中形成电路的一个或多个组件区域。 对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。 然后在元模块上的所有模块上形成单体，例如包覆模体。 至少与要被屏蔽的每个组件区域相关联的导电垂直互连访问结构（通孔）然后通过切割，钻孔或类似操作通过身体暴露。 接下来，将电磁屏蔽材料施加到要屏蔽的每个部件区域的主体的外表面并与暴露的导电通孔接触。
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