公开(公告)号：US20230083920A1

公开(公告)日：2023-03-16

申请号：US17930087

申请日：2022-09-07

Applicant: ROHM CO., LTD.

Inventor： Yusuke HARADA ,  Hiroyuki SHINKAI

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/36

Abstract: A semiconductor device includes an electrically insulating substrate including a substrate main surface and a substrate back surface facing opposite to each other in a thickness direction and at least one substrate side surface facing a direction intersecting the thickness direction, a semiconductor element arranged at a side of the substrate main surface, a heat-dissipating conductive portion that is provided at a position overlapping with at least a portion of the semiconductor element when viewed from the thickness direction and is exposed from the substrate back surface, a sealing resin that seals the semiconductor element while covering the substrate main surface, and at least one wiring portion that is connected to the heat-dissipating conductive portion, extends from the heat-dissipating conductive portion to the substrate side surface while being exposed from the substrate back surface, and is exposed from the substrate side surface.

公开(公告)号：US20180019177A1

公开(公告)日：2018-01-18

申请号：US15646311

申请日：2017-07-11

Applicant: ROHM CO., LTD.

Inventor： Yusuke HARADA ,  Yasuhiro FUWA

IPC: H01L23/36 ,  H01L21/768 ,  H01L23/29 ,  H01L23/498

CPC classification number: H01L23/36 ,  H01L21/486 ,  H01L21/76871 ,  H01L23/13 ,  H01L23/29 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5389

Abstract: An electronic component includes a substrate having a principal surface, a chip arranged at the principal surface of the substrate, a sealing resin sealing the chip on the principal surface of the substrate, and a heat dissipation member formed on the sealing resin.

公开(公告)号：US20210225755A1

公开(公告)日：2021-07-22

申请号：US17225840

申请日：2021-04-08

Applicant: Rohm Co., Ltd.

Inventor： Yusuke HARADA ,  Mamoru YAMAGAMI

IPC: H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31

Abstract: A semiconductor device includes a semiconductor element, an internal electrode connected to the semiconductor element, a sealing resin covering the semiconductor element and a portion of the internal electrode, and an external electrode exposed from the sealing resin and connected to the internal electrode. The internal electrode includes a wiring layer and a columnar portion, where the wiring layer has a wiring layer front surface facing the back surface of the semiconductor element and a wiring layer back surface facing opposite from the wiring layer front surface in the thickness direction. The columnar portion protrudes in the thickness direction from the wiring layer front surface. The columnar portion has an exposed side surface facing in a direction perpendicular to the thickness direction. The external electrode includes a first cover portion covering the exposed side surface.

公开(公告)号：US20240332101A1

公开(公告)日：2024-10-03

申请号：US18743964

申请日：2024-06-14

Applicant: ROHM CO., LTD.

Inventor： Yusuke HARADA

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/29 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2924/1815

Abstract: This semiconductor device comprises: a semiconductor element having an element surface, and an element rear surface on the opposite side from the element surface; an electrically conducting portion extending outward of the element rear surface from a position facing the element rear surface, and being electrically connected to the semiconductor element; and a sealing resin having a first sealing portion to which the electrically conducting portion is provided, and a second sealing portion that cooperates with the first sealing portion to seal the semiconductor element including the electrically conductive portion. The first sealing portion is constituted by a first material, and the second sealing portion is constituted by a second material. The Young's modulus of the second material is less than the Young's modulus of the first material.

公开(公告)号：US20190287890A1

公开(公告)日：2019-09-19

申请号：US16354540

申请日：2019-03-15

Applicant: Rohm Co., Ltd.

Inventor： Yusuke HARADA ,  Mamoru YAMAGAMI

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device includes a semiconductor element, an internal electrode connected to the semiconductor element, a sealing resin covering the semiconductor element and a portion of the internal electrode, and an external electrode exposed from the sealing resin and connected to the internal electrode. The internal electrode includes a wiring layer and a columnar portion, where the wiring layer has a wiring layer front surface facing the back surface of the semiconductor element and a wiring layer back surface facing opposite from the wiring layer front surface in the thickness direction. The columnar portion protrudes in the thickness direction from the wiring layer front surface. The columnar portion has an exposed side surface facing in a direction perpendicular to the thickness direction. The external electrode includes a first cover portion covering the exposed side surface.

公开(公告)号：US20230207444A1

公开(公告)日：2023-06-29

申请号：US18171156

申请日：2023-02-17

Applicant: Rohm Co., Ltd.

Inventor： Yusuke HARADA ,  Mamoru YAMAGAMI

IPC: H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/49861 ,  H01L21/568 ,  H01L21/4857 ,  H01L23/3107

Abstract: A semiconductor device includes a semiconductor element, an internal electrode connected to the semiconductor element, a sealing resin covering the semiconductor element and a portion of the internal electrode, and an external electrode exposed from the sealing resin and connected to the internal electrode. The internal electrode includes a wiring layer and a columnar portion, where the wiring layer has a wiring layer front surface facing the back surface of the semiconductor element and a wiring layer back surface facing opposite from the wiring layer front surface in the thickness direction. The columnar portion protrudes in the thickness direction from the wiring layer front surface. The columnar portion has an exposed side surface facing in a direction perpendicular to the thickness direction. The external electrode includes a first cover portion covering the exposed side surface.