公开(公告)号：US20120066903A1

公开(公告)日：2012-03-22

申请号：US13306811

申请日：2011-11-29

申请人： RUI-WU LIU ,  YUNG-WEI LAI ,  SHING-TZA LIOU

发明人： RUI-WU LIU ,  YUNG-WEI LAI ,  SHING-TZA LIOU

IPC分类号： H05K3/42

CPC分类号： H05K3/4084 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/10598 ,  H05K2203/0165 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A method for manufacturing a FPCB substrate includes the following steps. First, a FPCB material including an insulation layer and an electrically conductive layer formed on the insulation layer is provided. The electrically conductive layer has a first surface and an opposite second surface. The insulation layer has a third surface and an opposite fourth surface. The third surface comes into contact with the second surface. Secondly, a through hole extends from the first surface to the fourth surface is formed. The through hole includes a metal hole in the electrically conductive layer and an insulation hole in the insulation layer. Thirdly, the insulation hole is enlarged to expose a portion of the electrically conductive layer around the metal hole. Finally, the exposed portion is bent to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer.

摘要翻译： FPCB基板的制造方法包括以下步骤。 首先，提供一种包含绝缘层和形成在绝缘层上的导电层的FPCB材料。 导电层具有第一表面和相对的第二表面。 绝缘层具有第三表面和相对的第四表面。 第三表面与第二表面接触。 其次，形成从第一表面延伸到第四表面的通孔。 通孔包括导电层中的金属孔和绝缘层中的绝缘孔。 第三，扩大绝缘孔，使金属孔周围的一部分导电层露出。 最后，暴露部分被弯曲以形成通过扩大的绝缘孔并从绝缘层的第四表面突出的钩。

公开(公告)号：US20130118009A1

公开(公告)日：2013-05-16

申请号：US13658780

申请日：2012-10-23

申请人： RUI-WU LIU

发明人： RUI-WU LIU

IPC分类号： H05K3/30

CPC分类号： H05K3/4038 ,  H05K3/06 ,  H05K2203/0323 ,  H05K2203/1572 ,  Y10T29/49146

摘要： A method for manufacturing a printed circuit board includes the following steps. First, a first copper foil having first and second surfaces is provided. Second, the first copper foil is etched to remove portions of the first copper foil to convert the first copper foil into an intermediate structure having a substrate and first protrusions. Each first protrusion is exposed at the first surface. Third, a first insulation material fills into gaps between the first protrusions. Fourth, a second copper foil is laminated on the first surface. Fifth, the intermediate structure is etched from the second surface to remove portions of substrate to convert the substrate into second protrusions. Sixth, a second insulation material is infilled into gaps between the second protrusions. Seventh, a third copper foil is laminated on the second surface. Finally, the copper foils are patterned to be second and third patterns.

摘要翻译： 印刷电路板的制造方法包括以下步骤。 首先，提供具有第一和第二表面的第一铜箔。 其次，蚀刻第一铜箔以去除第一铜箔的部分，以将第一铜箔转换为具有基板和第一突起的中间结构。 每个第一突起在第一表面处露出。 第三，第一绝缘材料填充在第一突起之间的间隙中。 第四，在第一表面层叠第二铜箔。 第五，从第二表面蚀刻中间结构以去除衬底的部分，以将衬底转换成第二突起。 第六，第二绝缘材料填充到第二突起之间的间隙中。 第七，在第二表面上层叠第三铜箔。 最后，将铜箔图案化为第二和第三图案。