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19 条记录 (耗时 0.026 秒)

    Methods of grinding workpieces comprising superabrasive materials
    2.
    发明授权
    Methods of grinding workpieces comprising superabrasive materials 有权
    研磨包含超级磨料的工件的方法

    公开(公告)号：US09056380B2

    公开(公告)日：2015-06-16

    申请号：US13210722

    申请日：2011-08-16

    申请人： Rachana Upadhyay ,  Srinivasan Ramanath ,  Christopher Arcona ,  John E. Gillespie

    发明人： Rachana Upadhyay ,  Srinivasan Ramanath ,  Christopher Arcona ,  John E. Gillespie

    IPC分类号： B24B1/00 ,  B24B5/18 ,  B24D18/00 ,  B24D3/06 ,  B24D3/20

    CPC分类号： B24B1/00 ,  B24B5/18

    摘要： A method of grinding a superabrasive workpiece includes placing a bonded abrasive article in contact with a superabrasive workpiece, wherein the bonded abrasive article comprises a body including abrasive grains contained within a bond material, and the superabrasive workpiece has an average Vickers hardness of at least about 1 GPa, and removing material from the superabrasive workpiece at an average specific grinding energy (SGE) of not greater than about 350 J/mm3, at an average material removal (MRR) rate of at least about 8 mm3/sec for a centerless grinding operation.

    摘要翻译： 研磨超磨料工件的方法包括将结合的磨料制品放置成与超级磨料工件接触，其中粘合的磨料制品包括包含粘合材料内的磨料颗粒的主体，超硬磨料工件的平均维氏硬度为至少约 并且以不大于约350J / mm 3的平均特定研磨能（SGE）从超研磨工件去除材料，对于无心磨削，平均材料去除（MRR）速率为至少约8mm 3 /秒 操作。

    METHODS OF GRINDING WORKPIECES COMPRISING SUPERABRASIVE MATERIALS
    3.
    发明申请
    METHODS OF GRINDING WORKPIECES COMPRISING SUPERABRASIVE MATERIALS 有权
    研磨包含超级材料的工件的方法

    公开(公告)号：US20120040589A1

    公开(公告)日：2012-02-16

    申请号：US13210722

    申请日：2011-08-16

    申请人： Rachana Upadhyay ,  Srinivasan Ramanath ,  Christopher Arcona ,  John E. Gillespie

    发明人： Rachana Upadhyay ,  Srinivasan Ramanath ,  Christopher Arcona ,  John E. Gillespie

    IPC分类号： B24B1/00

    CPC分类号： B24B1/00 ,  B24B5/18

    摘要： A method of grinding a superabrasive workpiece includes placing a bonded abrasive article in contact with a superabrasive workpiece, wherein the bonded abrasive article comprises a body including abrasive grains contained within a bond material, and the superabrasive workpiece has an average Vickers hardness of at least about 1 GPa, and removing material from the superabrasive workpiece at an average specific grinding energy (SGE) of not greater than about 350 J/mm3, at an average material removal (MRR) rate of at least about 8 mm3/sec for a centerless grinding operation.

    摘要翻译： 研磨超磨料工件的方法包括将结合的磨料制品放置成与超级磨料工件接触，其中粘合的磨料制品包括包含粘合材料内的磨料颗粒的主体，超硬磨料工件的平均维氏硬度为至少约 并且以不大于约350J / mm 3的平均特定研磨能（SGE）从超研磨工件去除材料，对于无心磨削，平均材料去除率（MRR）为至少约8mm 3 /秒 操作。

    Modified Microgrinding Process
    8.
    发明申请
    Modified Microgrinding Process 审中-公开
    改性微研磨工艺

    公开(公告)号：US20140094094A1

    公开(公告)日：2014-04-03

    申请号：US14030843

    申请日：2013-09-18

    申请人： Robert A. Rizzuto ,  Ajay Krishnan ,  Christopher Arcona ,  Anand Tanikella

    发明人： Robert A. Rizzuto ,  Ajay Krishnan ,  Christopher Arcona ,  Anand Tanikella

    IPC分类号： B24B7/22

    CPC分类号： B24B7/228 ,  B24B7/17 ,  B24B37/08 ,  B24B57/02

    摘要： A method of forming a substrate is performed by grinding a substrate using abrasives so that both major surfaces of the substrate achieve desired flatness, smoothness, or both. In an embodiment, a coarser abrasive is used to grind one major surface, while a finer abrasive is simultaneously used to grind the other major surface. A single grinding step can used to produce a substrate having opposing surfaces of different surface roughnesses. This may help to eliminate a typical second downstream fine polishing step used in the prior art. Embodiments can be used with a wide variety of substrates, including sapphire, silicon carbide and gallium nitride single crystal structures grown by various techniques.

    摘要翻译： 通过使用研磨剂研磨衬底来进行形成衬底的方法，使得衬底的两个主表面实现期望的平坦度，平滑度或两者。 在一个实施方案中，使用较粗的研磨剂研磨一个主表面，同时使用较细磨料研磨另一主表面。 可以使用单个研磨步骤来生产具有不同表面粗糙度的相对表面的基材。 这可能有助于消除现有技术中使用的典型的第二下游精细抛光步骤。 实施例可以用于各种各样的基板，包括通过各种技术生长的蓝宝石，碳化硅和氮化镓单晶结构。

    SYSTEM AND METHOD FOR IMPROVED HAND TOOL OPERATION
    9.
    发明申请
    SYSTEM AND METHOD FOR IMPROVED HAND TOOL OPERATION 有权
    改进手工操作的系统和方法

    公开(公告)号：US20080032601A1

    公开(公告)日：2008-02-07

    申请号：US11833636

    申请日：2007-08-03

    申请人： Christopher Arcona ,  Douglas Wakefield ,  Brahmanandam Tanikella

    发明人： Christopher Arcona ,  Douglas Wakefield ,  Brahmanandam Tanikella

    IPC分类号： B24B49/08

    CPC分类号： B24B23/00 ,  B24B49/00 ,  B25F5/00 ,  Y10T137/0396 ,  Y10T137/87225

    摘要： Systems and methods for improved operation of hand tools are disclosed. Sensors may be configured to monitor one or more operational parameters of a hand tool and collected data may be communicated to the hand tool operator. The data may be compared to predetermined limits for an operational parameter to enable real-time operational diagnostics and quantitative control. Data can be collected across a manufacturing facility and analyzed to help account for variations in technique and skill among operators. An understanding of relationships between monitored operational parameters can lead to improved consistency among finished products and reduction in manufacturing costs. Data may also be stored for future recall and analysis.

    摘要翻译： 公开了用于改进手动工具操作的系统和方法。 传感器可以被配置为监视手动工具的一个或多个操作参数，并且收集的数据可以被传送到手动工具操作者。 数据可以与操作参数的预定限制进行比较，以实现实时操作诊断和定量控制。 数据可以跨越制造工厂收集并分析，以帮助解释操作员之间技术和技能的变化。 了解监控的操作参数之间的关系可以提高成品的一致性和降低制造成本。 也可以存储数据以供将来召回和分析。

    Bow compensated lapping
    10.
    发明授权
    Bow compensated lapping 失效
    弓补偿研磨

    公开(公告)号：US06346029B1

    公开(公告)日：2002-02-12

    申请号：US09712024

    申请日：2000-11-13

    申请人： Mark Anthony Church ,  Alain M. Desouches ,  Christopher Arcona ,  George M. Moorefield, II

    发明人： Mark Anthony Church ,  Alain M. Desouches ,  Christopher Arcona ,  George M. Moorefield, II

    IPC分类号： B24B100

    CPC分类号： G11B5/39 ,  B24B37/048 ,  B24B49/00 ,  G11B5/1871 ,  G11B5/3103 ,  G11B5/3173

    摘要： A method and apparatus for controlling the amount of row distortion before and dynamically during the lapping process used to manufacture sliders for magnetic storage devices. A wafer quadrant of slider rows is bonded to an extender tool held in a carrier assembly and an actuator is used to laterally apply force to the extender tool such that it changes the profile of the wafer quadrant, and thus the foremost slider row. Multiple arms may be defined in the extender tool, permitting independent engagement with and application of the lateral force by the actuator. Bending moments in each arm are then efficiently and controllably transferred into a beam in the extender tool which is proximate to the point where the wafer quadrant is bonded.

    摘要翻译： 一种用于在用于制造磁存储装置的滑块的研磨过程之前和动态地控制行失真量的方法和装置。 滑块列的晶片象限被结合到保持在载体组件中的延伸器工具上，并且致动器用于向延伸器工具横向施加力，使得其改变晶片象限的轮廓，并因此改变最前面的滑块排。 可以在扩展器工具中限定多个臂，从而允许与致动器的侧向力的独立接合和施加。 然后将每个臂中的弯曲力矩有效地和可控制地转移到靠近晶片象限结合的点的扩展器工具中的梁中。