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公开(公告)号：US06346029B1
公开(公告)日：2002-02-12
申请号：US09712024
申请日：2000-11-13
IPC分类号： B24B100
CPC分类号： G11B5/39 , B24B37/048 , B24B49/00 , G11B5/1871 , G11B5/3103 , G11B5/3173
摘要： A method and apparatus for controlling the amount of row distortion before and dynamically during the lapping process used to manufacture sliders for magnetic storage devices. A wafer quadrant of slider rows is bonded to an extender tool held in a carrier assembly and an actuator is used to laterally apply force to the extender tool such that it changes the profile of the wafer quadrant, and thus the foremost slider row. Multiple arms may be defined in the extender tool, permitting independent engagement with and application of the lateral force by the actuator. Bending moments in each arm are then efficiently and controllably transferred into a beam in the extender tool which is proximate to the point where the wafer quadrant is bonded.
摘要翻译： 一种用于在用于制造磁存储装置的滑块的研磨过程之前和动态地控制行失真量的方法和装置。 滑块列的晶片象限被结合到保持在载体组件中的延伸器工具上，并且致动器用于向延伸器工具横向施加力，使得其改变晶片象限的轮廓，并因此改变最前面的滑块排。 可以在扩展器工具中限定多个臂，从而允许与致动器的侧向力的独立接合和施加。 然后将每个臂中的弯曲力矩有效地和可控制地转移到靠近晶片象限结合的点的扩展器工具中的梁中。
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公开(公告)号：US06174218B1
公开(公告)日：2001-01-16
申请号：US09295696
申请日：1999-04-21
IPC分类号： B24B4900
CPC分类号： G11B5/39 , B24B37/048 , B24B49/00 , G11B5/1871 , G11B5/3103 , G11B5/3173
摘要： A method and apparatus for controlling the amount of row distortion before and dynamically during the lapping process used to manufacture sliders for magnetic storage devices. A wafer quadrant of slider rows is bonded to an extender tool held in a carrier assembly and an actuator is used to laterally apply force to the extender tool such that it changes the profile of the wafer quadrant, and thus the foremost slider row. Multiple arms may be defined in the extender tool, permitting independent engagement with and application of the lateral force by the actuator. Bending moments in each arm are then efficiently and controllably transferred into a beam in the extender tool which is proximate to the point where the wafer quadrant is bonded.
摘要翻译： 一种用于在用于制造磁存储装置的滑块的研磨过程之前和动态地控制行失真量的方法和装置。 滑块列的晶片象限被结合到保持在载体组件中的延伸器工具上，并且致动器用于向延伸器工具横向施加力，使得其改变晶片象限的轮廓，并因此改变最前面的滑块排。 可以在扩展器工具中限定多个臂，从而允许与致动器的侧向力的独立接合和施加。 然后将每个臂中的弯曲力矩有效地和可控制地转移到靠近晶片象限结合的点的扩展器工具中的梁中。
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公开(公告)号：US07972196B2
公开(公告)日：2011-07-05
申请号：US12145901
申请日：2008-06-25
申请人： Brahmanandam V. Tanikella , Christopher Arcona , David I. Gindhart , Christopher D. Jones , Matthew A. Simpson
发明人： Brahmanandam V. Tanikella , Christopher Arcona , David I. Gindhart , Christopher D. Jones , Matthew A. Simpson
IPC分类号： B24B49/00
摘要： A method of changing the crystallographic orientation of a single crystal body is disclosed that includes the steps of characterizing a crystallographic orientation of the single crystal body and calculating a misorientation angle between a select crystallographic direction of the single crystal body and a projection of the crystallographic direction along a plane of a first exterior major surface of the single crystal body. The method further includes removing material from at least a portion of the first exterior major surface to change the misorientation angle.
摘要翻译： 公开了改变单晶体的晶体取向的方法，其包括以下步骤：表征单晶体的晶体取向并计算单晶体的选择晶体学方向与晶体学方向的投影之间的取向角 沿着单晶体的第一外表面的平面。 该方法还包括从第一外部主表面的至少一部分去除材料以改变取向角。
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公开(公告)号：US08992645B2
公开(公告)日：2015-03-31
申请号：US13210815
申请日：2011-08-16
CPC分类号： B24D5/02 , B24D3/06 , B24D3/28 , B24D18/0009
摘要： An abrasive article including a bonded abrasive having a body formed of abrasive grains contained within a bond material, wherein the body grinds a superabrasive workpiece having an average Vickers hardness of at least about 5 GPa at an average specific grinding energy (SGE) of not greater than about 350 J/mm3, at a material removal rate of at least about 8 mm3/sec, and wherein grinding is a centerless grinding operation.
摘要翻译： 一种磨料制品，包括具有包含在粘合材料内的磨粒形成的主体的粘合磨料，其中所述主体研磨平均维氏硬度为至少约5GPa的平均维氏硬度，平均特定研磨能（SGE）不大于 大约350J / mm3，材料去除率至少约为8mm 3 / sec，其中研磨是无心磨削操作。
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公开(公告)号：US20140094094A1
公开(公告)日：2014-04-03
申请号：US14030843
申请日：2013-09-18
IPC分类号： B24B7/22
摘要： A method of forming a substrate is performed by grinding a substrate using abrasives so that both major surfaces of the substrate achieve desired flatness, smoothness, or both. In an embodiment, a coarser abrasive is used to grind one major surface, while a finer abrasive is simultaneously used to grind the other major surface. A single grinding step can used to produce a substrate having opposing surfaces of different surface roughnesses. This may help to eliminate a typical second downstream fine polishing step used in the prior art. Embodiments can be used with a wide variety of substrates, including sapphire, silicon carbide and gallium nitride single crystal structures grown by various techniques.
摘要翻译： 通过使用研磨剂研磨衬底来进行形成衬底的方法，使得衬底的两个主表面实现期望的平坦度，平滑度或两者。 在一个实施方案中，使用较粗的研磨剂研磨一个主表面，同时使用较细磨料研磨另一主表面。 可以使用单个研磨步骤来生产具有不同表面粗糙度的相对表面的基材。 这可能有助于消除现有技术中使用的典型的第二下游精细抛光步骤。 实施例可以用于各种各样的基板，包括通过各种技术生长的蓝宝石，碳化硅和氮化镓单晶结构。
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公开(公告)号：US20080032601A1
公开(公告)日：2008-02-07
申请号：US11833636
申请日：2007-08-03
IPC分类号： B24B49/08
CPC分类号： B24B23/00 , B24B49/00 , B25F5/00 , Y10T137/0396 , Y10T137/87225
摘要： Systems and methods for improved operation of hand tools are disclosed. Sensors may be configured to monitor one or more operational parameters of a hand tool and collected data may be communicated to the hand tool operator. The data may be compared to predetermined limits for an operational parameter to enable real-time operational diagnostics and quantitative control. Data can be collected across a manufacturing facility and analyzed to help account for variations in technique and skill among operators. An understanding of relationships between monitored operational parameters can lead to improved consistency among finished products and reduction in manufacturing costs. Data may also be stored for future recall and analysis.
摘要翻译： 公开了用于改进手动工具操作的系统和方法。 传感器可以被配置为监视手动工具的一个或多个操作参数，并且收集的数据可以被传送到手动工具操作者。 数据可以与操作参数的预定限制进行比较，以实现实时操作诊断和定量控制。 数据可以跨越制造工厂收集并分析，以帮助解释操作员之间技术和技能的变化。 了解监控的操作参数之间的关系可以提高成品的一致性和降低制造成本。 也可以存储数据以供将来召回和分析。
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公开(公告)号：US09056380B2
公开(公告)日：2015-06-16
申请号：US13210722
申请日：2011-08-16
摘要： A method of grinding a superabrasive workpiece includes placing a bonded abrasive article in contact with a superabrasive workpiece, wherein the bonded abrasive article comprises a body including abrasive grains contained within a bond material, and the superabrasive workpiece has an average Vickers hardness of at least about 1 GPa, and removing material from the superabrasive workpiece at an average specific grinding energy (SGE) of not greater than about 350 J/mm3, at an average material removal (MRR) rate of at least about 8 mm3/sec for a centerless grinding operation.
摘要翻译： 研磨超磨料工件的方法包括将结合的磨料制品放置成与超级磨料工件接触，其中粘合的磨料制品包括包含粘合材料内的磨料颗粒的主体，超硬磨料工件的平均维氏硬度为至少约 并且以不大于约350J / mm 3的平均特定研磨能（SGE）从超研磨工件去除材料，对于无心磨削，平均材料去除（MRR）速率为至少约8mm 3 /秒 操作。
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公开(公告)号：US20140150766A1
公开(公告)日：2014-06-05
申请号：US13930577
申请日：2013-06-28
申请人： Wei Che , Avanti Jain , Christopher Arcona , Yinggang Tian , Paul W. Rehrig
发明人： Wei Che , Avanti Jain , Christopher Arcona , Yinggang Tian , Paul W. Rehrig
CPC分类号： B28D5/045 , B24B27/0633 , B28D1/124 , C09K3/1409 , C09K3/1445
摘要： A method of conducting a cutting operation on a workpiece including providing an abrasive article having a substrate having an elongated body, a tacking layer overlying the substrate, and a first type of abrasive particle contained in the tacking layer, the method further including moving the abrasive article and a workpiece relative to each other, the workpiece including a material selected from the group consisting of a ceramic, a semiconductive material, an insulating material, a glass, a natural material, organic material, and a combination thereof.
摘要翻译： 一种在工件上进行切割操作的方法，包括提供具有基材的磨料制品，所述基材具有细长体，覆盖在基底上的粘合层以及包含在粘合层中的第一类型磨料颗粒，该方法还包括使磨料 制品和工件相对于彼此，所述工件包括选自陶瓷，半导体材料，绝缘材料，玻璃，天然材料，有机材料及其组合的材料。
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公开(公告)号：US20140017984A1
公开(公告)日：2014-01-16
申请号：US13930223
申请日：2013-06-28
申请人： Paul W. Rehrig , Yinggang Tian , Wei Che , Arup K. Khaund , Thomas Puthanangady , Christopher Arcona , Srinivasan Ramanath
发明人： Paul W. Rehrig , Yinggang Tian , Wei Che , Arup K. Khaund , Thomas Puthanangady , Christopher Arcona , Srinivasan Ramanath
CPC分类号： B23D61/185 , B23D65/00 , B24D3/002 , B24D11/00 , B24D11/001 , B28D1/06 , B28D5/042 , B28D5/045
摘要： An abrasive article including a substrate having an elongated body, a tacking layer overlying the substrate, a first type of abrasive particle overlying the tacking layer, a second type of abrasive particle different than the first type of abrasive particles overlying the tacking layer, and a bonding layer overlying at least a portion of one of the first type of abrasive particle and the second type of abrasive particle and the tacking layer.
摘要翻译： 一种磨料制品，包括具有细长体的衬底，覆盖衬底的粘合层，覆盖在粘合层上的第一类型磨料颗粒，与覆盖在粘合层上的第一类磨料颗粒不同的第二类磨料颗粒，以及 粘合层覆盖第一类型磨料颗粒和第二类磨料颗粒和粘合层中的至少一部分的至少一部分。
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公开(公告)号：US20120040589A1
公开(公告)日：2012-02-16
申请号：US13210722
申请日：2011-08-16
IPC分类号： B24B1/00
摘要： A method of grinding a superabrasive workpiece includes placing a bonded abrasive article in contact with a superabrasive workpiece, wherein the bonded abrasive article comprises a body including abrasive grains contained within a bond material, and the superabrasive workpiece has an average Vickers hardness of at least about 1 GPa, and removing material from the superabrasive workpiece at an average specific grinding energy (SGE) of not greater than about 350 J/mm3, at an average material removal (MRR) rate of at least about 8 mm3/sec for a centerless grinding operation.
摘要翻译： 研磨超磨料工件的方法包括将结合的磨料制品放置成与超级磨料工件接触，其中粘合的磨料制品包括包含粘合材料内的磨料颗粒的主体，超硬磨料工件的平均维氏硬度为至少约 并且以不大于约350J / mm 3的平均特定研磨能（SGE）从超研磨工件去除材料，对于无心磨削，平均材料去除率（MRR）为至少约8mm 3 /秒 操作。
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