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1.发明授权Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method 失效具有线性结构聚合物掺杂交联网络混合物的液体热界面及相关方法公开(公告)号：US07808099B2
公开(公告)日：2010-10-05
申请号：US12115809
申请日：2008-05-06
申请人： Randall J. Bertrand , Mark S. Chace , David L. Gardell , George J. Lawson , Yvonne Morris , Charles L. Reynolds , Jiali Wu
发明人： Randall J. Bertrand , Mark S. Chace , David L. Gardell , George J. Lawson , Yvonne Morris , Charles L. Reynolds , Jiali Wu
IPC分类号： H01L23/10
摘要： A liquid thermal interface (LTI) including a mixture of a linearly structured polymer doped with crosslinked networks and related method are presented. The LTI exhibits reduced liquid polymer macromolecule mobility, and thus increased surface tension. An embodiment of the method includes mixing a crosslinker with a linearly structured polymer to form a mixture, wherein the crosslinker includes a base agent including a vinyl-terminated or branched polydimethylsiloxane, and a curing agent including a hydrogen-terminated polydimethylsiloxane; and curing the mixture. The crosslinker functions as cages to block linear or branched linear macromolecules and prevents them from sliding into each other, thus increasing surface tension of the resulting LTI.
摘要翻译： 提出了包含掺杂有交联网络的线性结构聚合物的混合物的液体热界面（LTI）和相关方法。 LTI表现出降低的液体聚合物大分子迁移率，从而增加表面张力。 该方法的一个实施方案包括将交联剂与线形结构聚合物混合以形成混合物，其中交联剂包括包含乙烯基封端或支化聚二甲基硅氧烷的基础试剂和包含氢封端的聚二甲基硅氧烷的固化剂; 并固化混合物。 交联剂用作笼子以阻断线性或分支的线性大分子并防止它们彼此滑动，从而增加所得LTI的表面张力。
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2.发明申请LIQUID THERMAL INTERFACE HAVING MIXTURE OF LINEARLY STRUCTURED POLYMER DOPED CROSSLINKED NETWORKS AND RELATED METHOD 失效具有线性结构聚合物掺杂交联网络的混合物的液体热界面及相关方法公开(公告)号：US20090281254A1
公开(公告)日：2009-11-12
申请号：US12115809
申请日：2008-05-06
申请人： Randall J. Bertrand , Mark S. Chace , David L. Gardell , George J. Lawson , Yvonne Morris , Charles L. Reynolds , Jiali Wu
发明人： Randall J. Bertrand , Mark S. Chace , David L. Gardell , George J. Lawson , Yvonne Morris , Charles L. Reynolds , Jiali Wu
IPC分类号： C08G77/38
摘要： A liquid thermal interface (LTI) including a mixture of a linearly structured polymer doped with crosslinked networks and related method are presented. The LTI exhibits reduced liquid polymer macromolecule mobility, and thus increased surface tension. An embodiment of the method includes mixing a crosslinker with a linearly structured polymer to form a mixture, wherein the crosslinker includes a base agent including a vinyl-terminated or branched polydimethylsiloxane, and a curing agent including a hydrogen-terminated polydimethylsiloxane; and curing the mixture. The crosslinker functions as cages to block linear or branched linear macromolecules and prevents them from sliding into each other, thus increasing surface tension of the resulting LTI.
摘要翻译： 提出了包含掺杂有交联网络的线性结构聚合物的混合物的液体热界面（LTI）和相关方法。 LTI表现出降低的液体聚合物大分子迁移率，从而增加表面张力。 该方法的一个实施方案包括将交联剂与线形结构聚合物混合以形成混合物，其中交联剂包括包含乙烯基封端或支化聚二甲基硅氧烷的基础试剂和包含氢封端的聚二甲基硅氧烷的固化剂; 并固化混合物。 交联剂用作笼子以阻断线性或分支的线性大分子并防止它们彼此滑动，从而增加所得LTI的表面张力。
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3.发明授权Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly 有权增强的热氧化稳定性热界面组合物及其在微电子组件中的应用公开(公告)号：US07964542B2
公开(公告)日：2011-06-21
申请号：US11330922
申请日：2006-01-12
申请人： Krishna G. Sachdev , Harbans Singh Sachdev, legal representative , Mark S. Chace , Normand Cote , David L. Gardell , Jeffrey D. Gelorme , Sushumna Iruvanti , G. John Lawson , Tuknekah M. Noble
发明人： Krishna G. Sachdev , Mark S. Chace , Normand Cote , David L. Gardell , Jeffrey D. Gelorme , Sushumna Iruvanti , G. John Lawson , Tuknekah M. Noble
IPC分类号： C10M141/10 , C10M137/04 , C10M129/68
CPC分类号： C10M129/10 , C09K5/10 , C10M137/02 , C10M2205/0285 , C10M2207/024 , C10M2207/026 , C10M2215/064 , C10M2223/049 , C10N2230/08 , C10N2230/10 , C10N2240/201
摘要： Liquid compositions containing a specific hindered phenol or a hindered phenol in combination with an aromatic phosphite are provided which are used as a thermal interface between a heatsink and a chip during a test procedure for electronic components which compositions enhance the thermal conductivity between the heatsink and the chip, are easily removed from the heatsink and the chip after the test procedure without any deleterious residue and which allow the use of high temperatures for extended periods during the test procedure without any significant degradation of the composition. A method for using the compositions in electronic component test procedures such as burn-in procedures is also provided.
摘要翻译： 提供了含有特定受阻酚或受阻酚与芳族亚磷酸酯组合的液体组合物，其用于在电子部件的测试过程期间用作散热器和芯片之间的热界面，该组合物增强了散热器和 芯片，在测试程序之后容易地从散热器和芯片上移除而没有任何有害的残留物，并且允许在测试过程中长时间使用高温而没有组合物的任何显着降解。 还提供了一种在诸如老化程序的电子部件测试程序中使用组合物的方法。
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4.发明申请Liquid Recovery, Collection Method And Apparatus In A Non-Recirculating Test And Burn-In Application 失效液体回收，收集方法和设备在非循环测试和老化应用公开(公告)号：US20080116921A1
公开(公告)日：2008-05-22
申请号：US11551735
申请日：2006-10-23
申请人： Normand Cote , Peter J. Demko , David L. Gardell , Jeffrey D. Gelorme , Marco D. Knox , George J. Lawson , Kathryn C. Rivera
发明人： Normand Cote , Peter J. Demko , David L. Gardell , Jeffrey D. Gelorme , Marco D. Knox , George J. Lawson , Kathryn C. Rivera
IPC分类号： G01R31/02
CPC分类号： G01R31/2877
摘要： A heat sink for use in the burn-in of an I/C chip, which chip has a generally “flat” surface. The heat sink has a “flat” surface with micro-channels therein, positioned to open and close in and out of contact against the flat surface of an I/C chip being burned-in. At least one liquid opening communicates with said essentially flat surface on the heat sink to continuously apply liquid between the heat sink and the chip. A liquid inlet is provided to supply liquid to said at least one liquid opening. A recovery channel is positioned to recover liquid from between the heat sink and the chip, and an exhaust member is provided to carry liquid from said recovery channel to the exterior of the heat sink. The invention also includes a method of burning-in a chip.
摘要翻译： 用于I / C芯片老化的散热器，该芯片具有通常“平坦”的表面。 散热器具有在其中具有微通道的“平坦”表面，定位成打开和关闭与被烧入的I / C芯片的平坦表面的接触和接触。 至少一个液体开口与散热器上的所述基本平坦的表面连通，以在散热器和芯片之间连续地施加液体。 提供液体入口以将液体供应到所述至少一个液体开口。 定位回收通道以从散热器和芯片之间回收液体，并且提供排气构件以将液体从所述回收通道运送到散热器的外部。 本发明还包括一种烧入芯片的方法。
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5.发明授权Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application 失效非循环测试和老化应用中的液体回收，收集方法和设备公开(公告)号：US07567090B2
公开(公告)日：2009-07-28
申请号：US11551735
申请日：2006-10-23
申请人： Normand Cote , Peter J. Demko , David L. Gardell , Jeffrey D. Gelorme , Marc D. Knox , George J. Lawson , Kathryn C. Rivera
发明人： Normand Cote , Peter J. Demko , David L. Gardell , Jeffrey D. Gelorme , Marc D. Knox , George J. Lawson , Kathryn C. Rivera
IPC分类号： G01R31/02
CPC分类号： G01R31/2877
摘要： A heat sink for use in the burn-in of an I/C chip, which chip has a generally “flat” surface. The heat sink has a “flat” surface with micro-channels therein, positioned to open and close in and out of contact against the flat surface of an I/C chip being burned-in. At least one liquid opening communicates with said essentially flat surface on the heat sink to continuously apply liquid between the heat sink and the chip. A liquid inlet is provided to supply liquid to said at least one liquid opening. A recovery channel is positioned to recover liquid from between the heat sink and the chip, and an exhaust member is provided to carry liquid from said recovery channel to the exterior of the heat sink. The invention also includes a method of burning-in a chip.
摘要翻译： 用于I / C芯片老化的散热器，该芯片具有通常“平坦”的表面。 散热器具有在其中具有微通道的“平坦”表面，定位成打开和关闭与被烧入的I / C芯片的平坦表面的接触和接触。 至少一个液体开口与散热器上的所述基本平坦的表面连通，以在散热器和芯片之间连续地施加液体。 提供液体入口以将液体供应到所述至少一个液体开口。 定位回收通道以从散热器和芯片之间回收液体，并且提供排气构件以将液体从所述回收通道运送到散热器的外部。 本发明还包括一种烧入芯片的方法。
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6.发明授权公开(公告)号：US06720789B1
公开(公告)日：2004-04-13
申请号：US10366157
申请日：2003-02-13
IPC分类号： G01R3102
CPC分类号： G01R31/2886
摘要： A method and system for testing wafers, and particularly a wafer test system employing probes to provide for electrical contact with a device under test (DUT) which is located on a wafer. More particularly, also provided is a method and system for implementing wafer tests where the probes first contact a simulated wafer which incorporates an array of spaced load cells to determine the optimum probe overdrive. The DUT is then tested at the optimum overdrive.
摘要翻译： 一种用于测试晶片的方法和系统，特别是采用探针来提供与被测器件（DUT）的电接触的晶片测试系统。 更具体地，还提供了一种用于实施晶片测试的方法和系统，其中探针首先接触包含间隔开的负载传感器阵列的模拟晶片以确定最佳探针过驱动。 然后在最佳过驱动下测试DUT。
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公开(公告)号：US06504392B2
公开(公告)日：2003-01-07
申请号：US09277233
申请日：1999-03-26
IPC分类号： G01R3102
CPC分类号： G01R1/0458
摘要： A socket for testing or burning-in electronic components has a cover including a heat sink and a sensor. The heat sink and sensor are spring loaded so they make direct, temporary contact to an electronic component in the socket during burn-in. A heat transferring device is coupled to each heat sink. The heat transferring device uses input from the sensor to provide heat or cooling to each heat sink to individually control the temperature of each component. The heat transferring device can be an electric heater or a cooling device, such as a fan. Both can also be used. A plurality of these sockets are used in a forced air convective oven for burning-in a plurality of electronic components at one time. The oven provides oven heating and cooling for all components while the socket heater and sensor provide individual temperature control for each component.
摘要翻译： 用于测试或燃烧电子部件的插座具有包括散热器和传感器的盖。 散热器和传感器是弹簧加载的，因此它们在老化期间与插座中的电子部件直接临时接触。 传热装置连接到每个散热器。 传热装置使用来自传感器的输入来向每个散热器提供热量或冷却，以分别控制每个部件的温度。 传热装置可以是电加热器或诸如风扇的冷却装置。 两者也可以使用。 多个这样的插座用于强制空气对流烘箱，用于一次燃烧多个电子部件。 烤箱为所有组件提供烤箱加热和冷却，而插座加热器和传感器为每个组件提供单独的温度控制。
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公开(公告)号：US6050326A
公开(公告)日：2000-04-18
申请号：US76270
申请日：1998-05-12
CPC分类号： F28D19/04 , F28F5/00 , H01L23/36 , F28D2021/0028 , F28F2215/14 , H01L2924/0002
摘要： A heat dissipation apparatus for cooling one or more electronic devices. The apparatus utilizes a moving heat sink a portion of which is in contact with the device to be cooled. The moving heat sink may be in the form of a rotating disk, moving belt or strip. The heat sink may be made from various materials such as metals or plastics.
摘要翻译： 一种用于冷却一个或多个电子设备的散热装置。 该装置利用移动的散热器，其一部分与要冷却的装置接触。 移动散热器可以是旋转盘，移动带或带的形式。 散热器可以由诸如金属或塑料的各种材料制成。
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公开(公告)号：US5252062A
公开(公告)日：1993-10-12
申请号：US961290
申请日：1992-10-15
CPC分类号： F27D99/0073 , F27B11/00
摘要： The subject invention encompasses a thermal processing furnace having an elongated cylindrical processing chamber surrounding a tower assembly capable of receiving one or more articles to be processed. A pedestal assembly supports the tower assembly and contains a quartz door thereon which is axially translatable relative to the processing chamber into an inserted position where the tower assembly is inserted into the processing chamber. A quartz flange located along the perimeter of an opening at the end of the processing chamber contacts the quartz door forming a quartz seal therewith when the pedestal assembly is moved into the inserted position. A scavenger cavity is located at the end of the chamber having the opening therein and is in fluid flow relationship with the contact area between the quartz flange and the quartz door forming a quartz seal. Gas from within the processing chamber which may leak through the quartz seal is captured by the scavenger cavity and evacuated by an evacuation means.
摘要翻译： 本发明包括一种热处理炉，其具有围绕能够接收一个或多个待处理物品的塔架组件的细长圆柱形处理室。 基座组件支撑塔架组件并且在其上包含石英门，其上相对于处理室可轴向平移到塔架组件插入处理室中的插入位置。 在基座组件移动到插入位置时，位于处理室端部处的开口周边的石英凸缘与石英门接触，形成石英密封。 清除腔位于其中具有开口的室的端部处，并且与石英凸缘和石英门之间的接触面积形成流体流动关系，形成石英密封。 来自处理室内的可能通过石英密封泄漏的气体被清除腔捕获并被抽空装置排空。
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公开(公告)号：US08836356B2
公开(公告)日：2014-09-16
申请号：US13323001
申请日：2011-12-12
IPC分类号： G01R31/10
CPC分类号： G01R1/067 , G01R31/00 , G01R31/2863 , G01R31/2874 , G01R31/2891
摘要： A vertical probe assembly includes an upper die; a lower die; a plurality of probes, the probes including an electrically conductive material, wherein the probes extend from the upper die through the lower die; and an air channel located between the upper die and the lower die, such that airflow through the air channel passes through the plurality of probes.
摘要翻译： 垂直探针组件包括上模; 下模 多个探针，所述探针包括导电材料，其中所述探针从所述上模延伸穿过所述下模; 以及位于上模和下模之间的空气通道，使得通过空气通道的气流穿过多个探针。
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