公开(公告)号：US06261077B1

公开(公告)日：2001-07-17

申请号：US09246416

申请日：1999-02-08

申请人： Raymond J. Bishop ,  Michael A. Everett ,  Arvind Chari ,  Timothy A. Ferris

发明人： Raymond J. Bishop ,  Michael A. Everett ,  Arvind Chari ,  Timothy A. Ferris

IPC分类号： B29C3508

CPC分类号： B29C41/46 ,  B29C64/135 ,  B29C2791/008 ,  B29K2995/0073 ,  B33Y30/00

摘要： A rapid prototyping and manufacturing (e.g. stereolithography) apparatus includes a secondary frame located within a primary frame of the system. The secondary frame defines an enclosure for housing a number of peripheral heat-producing components and peripheral vibration-producing components. The heat generated by these peripheral heat-producing components is substantially isolated in the enclosure and is removed from the primary frame so as not to cause an undesired impact on other components within the main frame. The secondary frame preferably sits directly on the floor or other surface without touching the primary frame, thus substantially avoiding transmittance of vibration from components in the enclosure to the primary frame of the system.

摘要翻译： 快速原型制造（例如立体光刻）装置包括位于系统的主框架内的辅助框架。 辅助框架限定了用于容纳多个周边发热部件和周边振动产生部件的外壳。 由这些外围制热部件产生的热量在外壳中基本隔离，并从主框架上移除，以免对主框架内的其他部件造成不希望的冲击。 辅助框架优选地直接位于地板或其他表面上而不接触主框架，从而基本上避免振动从外壳中的组件到系统的主框架的透射。

公开(公告)号：US6153142A

公开(公告)日：2000-11-28

申请号：US247113

申请日：1999-02-08

申请人： Arvind Chari ,  Joseph F. Schoelen ,  Raymond J. Bishop

发明人： Arvind Chari ,  Joseph F. Schoelen ,  Raymond J. Bishop

IPC分类号： B29C41/46 ,  B29C41/52 ,  B29C67/00 ,  B29C35/08 ,  B29C41/02

CPC分类号： B29C67/0092 ,  B29C41/46 ,  B29C41/52 ,  B29K2995/0073

摘要： A rapid prototyping and manufacturing (e.g. stereolithography) method and apparatus for making three-dimensional objects with enhanced control of the temperature of the build environment. A modulated control signal is supplied to a heating element based on a difference between a desired build temperature and a detected temperature. The modulated signal result in the heater supplying, on average, more energy to the build chamber when the temperature difference is large and supplying, on average, less energy to the build chamber when the difference is small. The detection of the build chamber temperature may occur at one or more locations. If multiple locations are used, the detected temperatures may be averaged, or otherwise combined, to derive a single difference value that will be used to control the heater. Alternatively, the multiple detected temperatures may be used to produce multiple difference values that can in turn be used to control the quantity of heat applied directly to different locations in the build environment by either using multiple heaters or multiple controllable ducts.

摘要翻译： 快速成型和制造（例如立体光刻）方法和装置，用于通过增强对构建环境的温度的控制来制造三维物体。 基于期望的构建温度和检测到的温度之间的差异，将调制的控制信号提供给加热元件。 当温度差大时，调制信号导致加热器平均向供应室供应更多的能量，并且当差异较小时向加热室供应较少的能量。 构建室温度的检测可以在一个或多个位置处发生。 如果使用多个位置，则可以对检测到的温度进行平均或以其他方式组合，以得到将用于控制加热器的单个差值。 或者，可以使用多个检测到的温度来产生多个差值，其可以用于通过使用多个加热器或多个可控管道来控制直接施加在构建环境中的不同位置的热量。

公开(公告)号：US08871608B2

公开(公告)日：2014-10-28

申请号：US13425877

申请日：2012-03-21

申请人： Venkatesan Murali ,  Arvind Chari ,  Gopal Prabhu ,  Christopher J. Petti

发明人： Venkatesan Murali ,  Arvind Chari ,  Gopal Prabhu ,  Christopher J. Petti

IPC分类号： H01L31/0232

CPC分类号： H01L27/14632 ,  H01L21/6835 ,  H01L27/1464 ,  H01L27/14687 ,  H01L31/103 ,  H01L31/1896 ,  Y02E10/50

摘要： A method for fabricating a backside-illuminated sensor includes providing a thin film semiconductor lamina having a first conductivity, and forming a doped region having a second conductivity within the lamina and at a front surface of the lamina. The lamina may be provided as a free-standing lamina, or may be provided as a semiconductor donor body from which the lamina is cleaved. An electrical connection is formed to the doped region. A temporary carrier is contacted to the back surface of the semiconductor and later removed. A backside-illuminated sensor is fabricated from the semiconductor lamina, in which the thickness of the semiconductor lamina remains substantially unchanged during the fabrication process.

摘要翻译： 一种用于制造背面照射传感器的方法包括提供具有第一导电性的薄膜半导体薄片，以及在薄层内和薄片的前表面处形成具有第二导电性的掺杂区域。 层可以提供为独立的层，或者可以提供为半导体施主体，层从其中被切割。 与掺杂区形成电连接。 临时载体与半导体的后表面接触并稍后移除。 背面照明的传感器由半导体层制成，其中半导体层的厚度在制造过程中保持基本上不变。

公开(公告)号：US06711451B2

公开(公告)日：2004-03-23

申请号：US10191033

申请日：2002-07-02

申请人： Mark Hastert ,  Arvind Chari

发明人： Mark Hastert ,  Arvind Chari

IPC分类号： G06F1900

CPC分类号： G06F19/00 ,  B29C64/106 ,  G05B2219/49026 ,  G06F1/28 ,  G06F1/305

摘要： A power management system for a selective deposition modeling apparatus for maintaining the power consumption of the apparatus within the limits of conventional power available in most all office environments. The apparatus has a plurality of power drawing components, each component having a activation power rating wherein the accumulative total of all the power ratings exceeds a baseline power consumption value for the apparatus. The system prevents a baseline power consumption value from being exceeded by determining which components can be activated while leaving others inactivated.

摘要翻译： 一种用于选择性沉积建模装置的电力管理系统，用于将装置的功率消耗保持在大多数所有办公环境中可用的常规功率的限度内。 该装置具有多个功率耗尽部件，每个部件具有启动功率额定值，其中所有功率额定值的累积总和超过该设备的基准功耗值。 该系统通过确定哪些组件可以被激活而使其他人失效，从而防止超出基准功耗值。

公开(公告)号：US08629061B2

公开(公告)日：2014-01-14

申请号：US13490460

申请日：2012-06-07

申请人： Venkatesan Murali ,  Arvind Chari ,  Gopal Prabhu

发明人： Venkatesan Murali ,  Arvind Chari ,  Gopal Prabhu

IPC分类号： H01L21/768

CPC分类号： H01L21/76898 ,  H01L21/2007 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/147 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2224/16

摘要： An interposer is fabricated from a lamina. A donor body is provided, ions are implanted into a first surface of the donor body to define a cleave plane, a temporary carrier is separably contacted to the donor body, and the lamina is cleaved from the donor body. The lamina has front surface and a back surface, with a thickness from the front surface to the back surface. A via hole is formed in the lamina, where the via hole extends through the thickness of the lamina. The temporary carrier is removed from the lamina, and the lamina may be fabricated into an interposer for three-dimensional integrated circuit packages.

摘要翻译： 插层由薄片制成。 提供供体，离子被植入供体体的第一表面以限定劈平面，临时载体与供体本体分离接触，并且层从供体体上切下。 薄片具有前表面和后表面，其厚度从前表面到后表面。 通孔形成在层板中，通孔延伸穿过层的厚度。 将临时载体从薄片上移除，并将薄片制成三维集成电路封装的插入件。

公开(公告)号：US20130203205A1

公开(公告)日：2013-08-08

申请号：US13425877

申请日：2012-03-21

申请人： Venkatesan Murali ,  Arvind Chari ,  Gopal Prabhu ,  Christopher J. Petti

发明人： Venkatesan Murali ,  Arvind Chari ,  Gopal Prabhu ,  Christopher J. Petti

IPC分类号： H01L31/0232

CPC分类号： H01L27/14632 ,  H01L21/6835 ,  H01L27/1464 ,  H01L27/14687 ,  H01L31/103 ,  H01L31/1896 ,  Y02E10/50

摘要： A method for fabricating a backside-illuminated sensor includes providing a thin film semiconductor lamina having a first conductivity, and forming a doped region having a second conductivity within the lamina and at a front surface of the lamina. The lamina may be provided as a free-standing lamina, or may be provided as a semiconductor donor body from which the lamina is cleaved. An electrical connection is formed to the doped region. A temporary carrier is contacted to the back surface of the semiconductor and later removed. A backside-illuminated sensor is fabricated from the semiconductor lamina, in which the thickness of the semiconductor lamina remains substantially unchanged during the fabrication process.

摘要翻译： 一种用于制造背面照射传感器的方法包括提供具有第一导电性的薄膜半导体薄片，以及在薄层内和薄片的前表面处形成具有第二导电性的掺杂区域。 层可以提供为独立的层，或者可以提供为半导体施主体，层从其中被切割。 与掺杂区形成电连接。 临时载体与半导体的后表面接触并稍后移除。 背面照明的传感器由半导体层制成，其中半导体层的厚度在制造过程中保持基本上不变。

公开(公告)号：US20130203251A1

公开(公告)日：2013-08-08

申请号：US13490460

申请日：2012-06-07

申请人： Venkatesan Murali ,  Arvind Chari ,  Gopal Prabhu

发明人： Venkatesan Murali ,  Arvind Chari ,  Gopal Prabhu

IPC分类号： H01L21/768

CPC分类号： H01L21/76898 ,  H01L21/2007 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/147 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2224/16

摘要： An interposer is fabricated from a lamina. A donor body is provided, ions are implanted into a first surface of the donor body to define a cleave plane, a temporary carrier is separably contacted to the donor body, and the lamina is cleaved from the donor body. The lamina has front surface and a back surface, with a thickness from the front surface to the back surface. A via hole is formed in the lamina, where the via hole extends through the thickness of the lamina. The temporary carrier is removed from the lamina, and the lamina may be fabricated into an interposer for three-dimensional integrated circuit packages.

摘要翻译： 插层由薄片制成。 提供供体，离子被植入供体体的第一表面以限定劈平面，临时载体与供体本体分离接触，并且层从供体体上切下。 薄片具有从前表面到后表面的前表面和后表面。 通孔形成在层板中，通孔延伸穿过层的厚度。 将临时载体从薄片上移除，并将薄片制成三维集成电路封装的插入件。

公开(公告)号：US6129884A

公开(公告)日：2000-10-10

申请号：US246501

申请日：1999-02-08

申请人： Ross D. Beers ,  Arvind Chari ,  Jouni P. Partanen ,  Nansheng Tang

发明人： Ross D. Beers ,  Arvind Chari ,  Jouni P. Partanen ,  Nansheng Tang

IPC分类号： B29C67/00 ,  B29C35/08 ,  B29C41/02

CPC分类号： B29C67/0066 ,  B29K2995/0073

摘要： A rapid prototyping and manufacturing (e.g. stereolithography) method and apparatus for producing three-dimensional objects by selectively subjecting a liquid or other fluid-like material to a beam of prescribed stimulation. In a preferred embodiment a source of prescribed stimulation is controlled to reduce or inhibit the production of the prescribed stimulation during at least some periods when the prescribed stimulation is not needed to expose the material. In another preferred embodiment, the source of stimulation is controlled to vary the quantity of prescribed stimulation that is produced and allowed to reach the material. In an additional preferred embodiment, control of laser output occurs based on a combination of supplying a regulated amount of voltage to an AOM in conjunction with temporary sensing of laser power and a known desired power to attain. In a further preferred embodiment, a quantity of prescribed stimulation may be set by consideration of desired solidification depths to be used, beam profile characteristics, material properties, and scanning speed limitations for different data types. In a still further preferred embodiment, a transition between selected consecutive exposure vectors is performed by scanning one or more interposed non-exposure vectors with the beam inhibited from reaching the building material.

摘要翻译： 用于通过选择性地使液体或其它流体状材料经受规定刺激的波束来制造三维物体的快速成型和制造（例如立体光刻）方法和装置。 在优选实施例中，在不需要规定的刺激以暴露材料的至少一些时期期间，控制规定刺激源以减少或抑制规定的刺激的产生。 在另一优选实施例中，控制刺激源以改变产生并被允许到达材料的规定刺激的量。 在另外的优选实施例中，激光输出的控制基于将调节量的电压提供给AOM并结合临时感测激光功率和已知的所需功率来实现的组合。 在另外的优选实施例中，可以通过考虑要使用的期望凝固深度，束轮廓特征，材料特性和不同数据类型的扫描速度限制来设定规定刺激的量。 在另一个优选实施例中，通过扫描一个或多个插入的非曝光向量，阻止所述光束到达建筑材料，来执行所选择的连续曝光向量之间的转变。