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公开(公告)号：US20230055905A1
公开(公告)日：2023-02-23
申请号：US17408040
申请日：2021-08-20
申请人： Raytheon Company
发明人： John A. Logan , Clay T. Long , Adam E. Peczalski
摘要： A bulk acoustic wave (BAW) resonator includes a piezoelectric layer oriented so that an N-polar surface forms a frontside surface that faces away from the substrate while a metal-polar surface forms the backside surface and faces toward the substrate. A process for the manufacture of a bulk acoustic wave (BAW) resonator includes orienting a piezoelectric layer on a substrate so that an N-polar surface forms a frontside surface that faces away from the substrate while a metal-polar surface forms the backside surface and faces toward the substrate; etching a via though the backside of the substrate to the metal-polar surface of the piezoelectric layer; and removing etch residue from a sidewall of the resonator cavity.
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公开(公告)号：US11848662B2
公开(公告)日：2023-12-19
申请号：US17018897
申请日：2020-09-11
申请人： Raytheon Company
IPC分类号： H03H9/54 , H01L21/02 , H01L29/20 , H01L29/205 , H01L29/66 , H01L29/778 , H03F3/195 , H03H3/02 , H03H9/56 , H04B1/10 , H10N39/00 , H04B1/06
CPC分类号： H03H9/545 , H01L21/0254 , H01L21/02378 , H01L29/2003 , H01L29/205 , H01L29/66462 , H01L29/7786 , H03F3/195 , H03H3/02 , H03H9/562 , H03H9/568 , H04B1/10 , H10N39/00 , H03F2200/294 , H03F2200/451 , H04B1/06
摘要： Embodiments of a single-chip ScAIN tunable filter bank include a plurality of switching elements, and a plurality of channel filters integrated on a monolithic platform. The monolithic platform may comprise a single crystal base and each of the switching elements may comprise at least one of a scandium aluminum nitride (ScAIN) or other Group III-Nitride transistor structure fabricated on the single crystal base. In these embodiments, each channel filter comprises a multi-layered ScAIN structure comprising one or more a single-crystal epitaxial ScAIN layers fabricated on the single crystal base. The ScAIN layers for each channel filter may be based on desired frequency characteristics of an associated one of the RF channels.
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公开(公告)号：US20220085795A1
公开(公告)日：2022-03-17
申请号：US17018897
申请日：2020-09-11
申请人： Raytheon Company
IPC分类号： H03H9/54 , H01L27/20 , H01L29/20 , H01L29/205 , H01L29/778 , H03H9/56 , H01L21/02 , H01L29/66 , H03H3/02 , H03F3/195
摘要： Embodiments of a single-chip ScAIN tunable filter bank include a plurality of switching elements, and a plurality of channel filters integrated on a monolithic platform. The monolithic platform may comprise a single crystal base and each of the switching elements may comprise at least one of a scandium aluminum nitride (ScAIN) or other Group III-Nitride transistor structure fabricated on the single crystal base. In these embodiments, each channel filter comprises a multi-layered ScAIN structure comprising one or more a single-crystal epitaxial ScAIN layers fabricated on the single crystal base. The ScAIN layers for each channel filter may be based on desired frequency characteristics of an associated one of the RF channels.
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公开(公告)号：US11942919B2
公开(公告)日：2024-03-26
申请号：US17145665
申请日：2021-01-11
申请人： Raytheon Company
CPC分类号： H03H9/02133 , H03H3/04 , H03H9/02031 , H03H9/02102 , H03H9/174 , H03H9/176 , H03H2003/023 , H03H2003/0407
摘要： A strain compensated heterostructure comprising a substrate comprising silicon carbide material; a first epitaxial layer comprising single-crystal aluminum nitride material formed on a top surface of the substrate; a second epitaxial layer formed on the first epitaxial layer opposite the top surface of the substrate, the second epitaxial layer comprising single-crystal scandium aluminum nitride material; and a third epitaxial layer formed on the second epitaxial layer opposite the first epitaxial layer, the third layer comprising single-crystal aluminum nitride material.
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公开(公告)号：US20220224306A1
公开(公告)日：2022-07-14
申请号：US17145665
申请日：2021-01-11
申请人： Raytheon Company
摘要： A strain compensated heterostructure comprising a substrate comprising silicon carbide material; a first epitaxial layer comprising single-crystal aluminum nitride material formed on a top surface of the substrate; a second epitaxial layer formed on the first epitaxial layer opposite the top surface of the substrate, the second epitaxial layer comprising single-crystal scandium aluminum nitride material; and a third epitaxial layer formed on the second epitaxial layer opposite the first epitaxial layer, the third layer comprising single-crystal aluminum nitride material.
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