公开(公告)号：US20210273558A1

公开(公告)日：2021-09-02

申请号：US16741318

申请日：2020-01-13

Applicant: RAYTHEON COMPANY

Inventor： Boris S. Jacobson ,  Steven D. Bernstein ,  Steven M. Lardizabal ,  Jason Adams ,  Jeffrey R. Laroche

IPC: H02M1/44 ,  H01F27/28 ,  H05K1/16 ,  H01F27/36 ,  H02M1/42

Abstract: A power converter assembly is provided and includes high quality factor (Q) shield-to-transistor integrated low-inductance capacitor elements to divert common mode (CM) currents, high Q shield-to-shield integrated low-inductance capacitor elements to compliment line-to-line filter capacitors and high Q baseplate integrated low-inductance capacitor elements to attenuate residual CM currents.

公开(公告)号：US10340812B2

公开(公告)日：2019-07-02

申请号：US15703455

申请日：2017-09-13

Applicant: Raytheon Company

Inventor： Boris S. Jacobson ,  Steven D. Bernstein ,  Steven M. Lardizabal ,  Jason Adams ,  Jeffrey R. Laroche

IPC: H02M3/335 ,  H02M7/00 ,  H01F27/28 ,  H01F27/42 ,  H02M7/04 ,  H02M1/00

Abstract: A modular high-power converter system includes an electronic power distribution unit configured to output an analog current (AC) voltage to a power bus, and at least one Transmit or Receive Integrated Microwave Module (T/RIMM) that includes a voltage converter unit and a transmitter and receiver (T/R) unit. The voltage converter unit includes at least one analog-to-digital converter (ADC) to convert the AC voltage into a direct current (DC) voltage having a first DC voltage level. The transmitter and receiver (T/R) unit includes a modular-based DC/DC converter to convert the DC voltage into a second DC voltage having a second voltage. The modular-based DC/DC converter includes a modular power converter unit configured to generate the second DC voltage. The modular converter unit is configured to be independently interchangeable with a different modular converter unit.

公开(公告)号：US10566896B2

公开(公告)日：2020-02-18

申请号：US16055792

申请日：2018-08-06

Applicant: RAYTHEON COMPANY

Inventor： Boris S. Jacobson ,  Steven D. Bernstein ,  Steven M. Lardizabal ,  Jason Adams ,  Jeffrey R. Laroche

IPC: H02M1/44 ,  H01F27/28 ,  H01F27/36 ,  H05K1/16 ,  H02M1/42

Abstract: A power converter assembly is provided and includes high quality factor (Q) shield-to-transistor integrated low-inductance capacitor elements to divert common mode (CM) currents, high Q shield-to-shield integrated low-inductance capacitor elements to compliment line-to-line filter capacitors and high Q baseplate integrated low-inductance capacitor elements to attenuate residual CM currents.

公开(公告)号：US20190149039A1

公开(公告)日：2019-05-16

申请号：US16055792

申请日：2018-08-06

Applicant: RAYTHEON COMPANY

Inventor： Boris S. Jacobson ,  Steven D. Bernstein ,  Steven M. Lardizabal ,  Jason Adams ,  Jeffrey R. Laroche

IPC: H02M1/44 ,  H01F27/28 ,  H01F27/36 ,  H05K1/16 ,  H02M1/42

CPC classification number: H02M1/44 ,  H01F27/2804 ,  H01F27/2885 ,  H01F27/365 ,  H01F2027/2809 ,  H01F2027/2819 ,  H02M1/4258 ,  H05K1/165 ,  H05K2201/086

Abstract: A power converter assembly is provided and includes high quality factor (Q) shield-to-transistor integrated low-inductance capacitor elements to divert common mode (CM) currents, high Q shield-to-shield integrated low-inductance capacitor elements to compliment line-to-line filter capacitors and high Q baseplate integrated low-inductance capacitor elements to attenuate residual CM currents.

公开(公告)号：US11205953B2

公开(公告)日：2021-12-21

申请号：US16741318

申请日：2020-01-13

Applicant: RAYTHEON COMPANY

Inventor： Boris S. Jacobson ,  Steven D. Bernstein ,  Steven M. Lardizabal ,  Jason Adams ,  Jeffrey R. Laroche

IPC: H02J50/00 ,  H02M1/44 ,  H01F27/28 ,  H05K1/16 ,  H01F27/36 ,  H02M1/42 ,  H02M7/00 ,  H02J50/10

Abstract: A power converter assembly is provided and includes high quality factor (Q) shield-to-transistor integrated low-inductance capacitor elements to divert common mode (CM) currents, high Q shield-to-shield integrated low-inductance capacitor elements to compliment line-to-line filter capacitors and high Q baseplate integrated low-inductance capacitor elements to attenuate residual CM currents.

公开(公告)号：US20190081567A1

公开(公告)日：2019-03-14

申请号：US15703455

申请日：2017-09-13

Applicant: Raytheon Company

Inventor： Boris S. Jacobson ,  Steven D. Bernstein ,  Steven M. Lardizabal ,  Jason Adams ,  Jeffrey R. Laroche

IPC: H02M7/00 ,  H01F27/28 ,  H01F27/42 ,  H03M1/12 ,  H02J50/40

CPC classification number: H02M7/003 ,  H01F27/28 ,  H01F27/2804 ,  H01F27/362 ,  H01F27/42 ,  H01F2027/2809 ,  H02M3/335 ,  H02M7/04 ,  H02M2001/007 ,  H02M2001/008

Abstract: A modular high-power converter system includes an electronic power distribution unit configured to output an analog current (AC) voltage to a power bus, and at least one Transmit or Receive Integrated Microwave Module (T/RIMM) that includes a voltage converter unit and a transmitter and receiver (T/R) unit. The voltage converter unit includes at least one analog-to-digital converter (ADC) to convert the AC voltage into a direct current (DC) voltage having a first DC voltage level. The transmitter and receiver (T/R) unit includes a modular-based DC/DC converter to convert the DC voltage into a second DC voltage having a second voltage. The modular-based DC/DC converter includes a modular power converter unit configured to generate the second DC voltage. The modular converter unit is configured to be independently interchangeable with a different modular converter unit.