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1.发明授权
公开(公告)号：US5133850A
公开(公告)日：1992-07-28
申请号：US654118
申请日：1991-02-11
IPC分类号： C23C14/35 , C23C14/34 , H01J37/34 , H01L21/203
CPC分类号： H01J37/3423 , C23C14/3407 , H01J37/3408
摘要： Cathode base (1) has a hollow target (8) disposed thereon with at least one planar sputtering surface (8a), of circular shape for example, which is encompassed by at least two concentric, continuous projections (8b, 8c), and with a magnet system (6) with pole faces (6c, 6d) of opposite polarity lying on both sides of the target (8) for the production of magnetic lines of force (11, 11', . . . ) running substantially parallel to the sputtering surface (16a), the wall surfaces (8d, 8e) of the projections (8b, 8c) of the target (8), adjoining the sputtering surface (8a) being disposed at an angle (.alpha.) to the perpendicular, is preferably in a range between 30 and 70 degrees.
摘要翻译： 阴极基座（1）具有设置在其上的中空靶（8），其上具有圆形的至少一个平面溅射表面（8a），该平面溅射表面由至少两个同心连续的突起（8b，8c）包围，并且与 具有相对极性的极面（6c，6d）的磁体系统（6）位于目标（8）的两侧，用于产生基本上平行于所述目标（8）的磁力线（11,11'，...） 溅射表面（16a），与溅射表面（8a）相邻的靶（8）的突出部（8b，8c）的壁表面（8d，8c）优选地以垂直角度（α）设置 在30和70度之间的范围内。
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公开(公告)号：US5074984A
公开(公告)日：1991-12-24
申请号：US449785
申请日：1989-12-13
CPC分类号： C23C14/35 , C23C14/205
摘要： In a device for coating a substrate 1 made of polymethylmethacrylate with aluminum by means of a direct current source 10 which is connected to an electrode 5 disposed in an evacuable coating chamber 15a and electrically connected to a target 3 to be sputtered and the sputtered particles are deposited on a substrate 1 and wherein a process gas is introduced into the coating chamber (15, 15a), helium has is introduced as a process gas in order to improve adhesiveness and service life 2.
摘要翻译： 在通过直流电源10涂覆由聚甲基丙烯酸甲酯制成的基板1的装置中，所述直流电源10连接到设置在可抽出的涂覆室15a中并电连接到待溅射的靶3并且溅射的颗粒的电极5 沉积在基板1上，并且其中将工艺气体引入涂覆室（15,15a）中，引入氦气作为工艺气体，以改善粘附性和使用寿命2。
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公开(公告)号：US5068021A
公开(公告)日：1991-11-26
申请号：US510043
申请日：1990-04-17
CPC分类号： C23C14/3492 , C23C14/20 , C23C14/35
摘要： In a process for coating a plastic substrate 1 made of polymethylmethacrylate with metal using a direct current source 10 connected to an electrode disposed in an evacuable coating chamber 15, 15a and electrically connected to a target 3 to be sputtered, the adhesiveness and the service life of the layer are improved. In a first coating step, an argon plasma is maintained in the coating chamber 15, 15a for an extremely short period of time preferably until the so generated sputtering process passes from the oxidic to the metallic process. In a second coating step, helium is introduced in the coating chamber 15, 15a and a helium plasma is ignited. In a third coating step, argon is introduced into the coating chamber 15, 15a and an argon plasma is ignited and this argon plasma process is maintained until a desired thickness is reached.
摘要翻译： 在使用连接到设置在可抽出的涂布室15,15a中的电极的直流电源10涂覆由聚甲基丙烯酸甲酯与金属制成的塑料基板1并与要溅射的靶3电连接的电极的粘合性和使用寿命 的层次得到改善。 在第一涂覆步骤中，氩等离子体在涂覆室15和15a中保持极短的时间，优选地直到所产生的溅射工艺从氧化物转移到金属工艺。 在第二涂覆步骤中，将氦引入涂覆室15和15a中，并且氦等离子体被点燃。 在第三涂覆步骤中，将氩气引入涂覆室15和15a中，并且氩等离子体被点燃，并且保持氩等离子体工艺，直到达到所需的厚度。
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公开(公告)号：US5300205A
公开(公告)日：1994-04-05
申请号：US32420
申请日：1993-03-16
申请人： Wolf-Eckart Fritsche
发明人： Wolf-Eckart Fritsche
CPC分类号： H01J37/32752 , C23C14/34 , H01J37/34 , H01J37/3444
摘要： The invention relates to a device for coating substrates by sputtering out of a plasma with at least one anode, one cathode, and an electric dc current voltage source, connectable pulse-wise to the anode/cathode path. The length of the voltage pulses and/or the interval between the pulses is regulatable.
摘要翻译： 本发明涉及一种用至少一个阳极，一个阴极和直流电压源通过溅射等离子体来涂覆基板的装置，其可以脉冲地连接到阳极/阴极路径。 电压脉冲的长度和/或脉冲之间的间隔是可调节的。
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公开(公告)号：US08157975B2
公开(公告)日：2012-04-17
申请号：US12388342
申请日：2009-02-18
IPC分类号： C23C14/00
CPC分类号： C23C14/3414 , C23C4/04 , C23C4/067 , Y02E10/548
摘要： A sputter target for sputtering a silicon-containing film is provided. The target includes a silicon-containing sputter material layer, and a carrier for carrying the sputter material layer, wherein the sputter material layer contains less than 200 ppm iron.
摘要翻译： 提供溅射含硅膜的溅射靶。 靶包括含硅溅射材料层和用于承载溅射材料层的载体，其中溅射材料层含有少于200ppm的铁。
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公开(公告)号：US5540823A
公开(公告)日：1996-07-30
申请号：US864177
申请日：1992-04-03
申请人： Wolf-Eckart Fritsche
发明人： Wolf-Eckart Fritsche
CPC分类号： H01J37/3441 , C23C14/3407 , H01J37/3408 , H01J37/3414
摘要： A magnetron cathode for a cathode sputtering system has a target holder for holding a target 9 where the erosion zone is opposite the substrate. The non-sputtering target surfaces 9a are covered with a barrier layer or protective layer 21.
摘要翻译： 用于阴极溅射系统的磁控管阴极具有用于保持靶9的靶保持器，其中侵蚀区与衬底相对。 非溅射靶表面9a被阻挡层或保护层21覆盖。
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