公开(公告)号：US20140159224A1

公开(公告)日：2014-06-12

申请号：US14093337

申请日：2013-11-29

Applicant: Renesas Electronics Corporation

Inventor： Makoto OKADA ,  Shuuichi KARIYAZAKI ,  Wataru SHIROI ,  Masafumi SUZUHARA ,  Naoko SERA

IPC: H01L23/02 ,  H01L23/498 ,  H01L23/28

CPC classification number: H01L25/0655 ,  H01L23/02 ,  H01L23/04 ,  H01L23/055 ,  H01L23/28 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/562 ,  H01L24/33 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/3224 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2924/1015 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/167 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device in which warpage is less likely to occur. In the semiconductor device, two semiconductor chips are mounted over a diagonal of a substrate and one of the semiconductor chips lies over the intersection of the two diagonals of the substrate. The semiconductor device gives a solution to the following problem. In order to implement a semiconductor device with a plurality of semiconductor chips mounted on a substrate, generally the substrate must have a larger area. If the area of the substrate is increased without an increase in its thickness, warpage or deformation of the semiconductor device is more likely to occur. It is difficult or impossible to mount a warped or deformed semiconductor device over a wiring substrate.

Abstract translation: 其中翘曲不太可能发生的半导体器件。 在半导体器件中，两个半导体芯片安装在衬底的对角线上，并且半导体芯片之一位于衬底的两个对角线的交叉点之上。 半导体器件给出了以下问题的解决方案。 为了实现具有安装在基板上的多个半导体芯片的半导体器件，通常基板必须具有更大的面积。 如果基板的面积增加而不增加其厚度，则更可能发生半导体器件的翘曲或变形。 将翘曲或变形的半导体器件安装在布线基板上是困难或不可能的。