公开(公告)号：US20160133548A1

公开(公告)日：2016-05-12

申请号：US14997509

申请日：2016-01-16

Applicant: Renesas Electronics Corporation

Inventor： Akito SHIMIZU ,  Kenji NISHIKAWA ,  Sadayuki MOROI ,  Tomoo lmura

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49503 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49579 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device, includes a die pad that has a first main surface and a second main surface located on the opposite side of the first main surface; a lead arranged next to the die pad; a semiconductor chip that has a surface, a first electrode and a second electrode formed on the surface, and a reverse side located on the opposite side of the surface, and is mounted on a chip mounting area of the first main of the die pad; a first wire that electrically couples the first electrode of the semiconductor chip and the lead; a second wire that electrically couples the second electrode of the semiconductor chip and the die pad; and a sealed body that seals the semiconductor chip, the first wire, and the second wire.

Abstract translation: 一种半导体器件，包括具有位于所述第一主表面的相对侧的第一主表面和第二主表面的管芯焊盘; 引线布置在芯片垫的旁边; 具有表面的半导体芯片，形成在所述表面上的第一电极和第二电极以及位于所述表面的相反侧的反面，并且安装在所述管芯焊盘的第一主体的芯片安装区域上; 电连接半导体芯片的第一电极和引线的第一导线; 电连接半导体芯片的第二电极和芯片焊盘的第二导线; 以及密封半导体芯片，第一线和第二线的密封体。