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    SENSOR DEVICE
    1.
    发明申请
    SENSOR DEVICE 有权
    传感器设备

    公开(公告)号：US20150061645A1

    公开(公告)日：2015-03-05

    申请号：US14477538

    申请日：2014-09-04

    Applicant: Renesas Electronics Corporation

    Inventor： Takatsugu Nemoto ,  Yasutaka Nakashiba ,  Takasuke Hashimoto ,  Shinichi Uchida

    IPC: G01R1/20 ,  G01R19/00

    CPC classification number: G01R19/0092 ,  G01R1/203 ,  G01R15/181

    Abstract: This invention provides a sensor device at reduced cost. The sensor device includes a printed circuit board, a first terminal, a second terminal, an interconnect line, and a semiconductor device. The first terminal and second terminal are provided on the printed circuit board and coupled to a power line. The second terminal is coupled to a downstream part of the power line with respect to the first terminal. The interconnect line is disposed on the printed circuit board to couple the first terminal and second terminal to each other. In other words, the interconnect line is coupled to the power line in parallel. The semiconductor device is mounted on the printed circuit board and includes an interconnect layer and an inductor formed in the interconnect layer.

    Abstract translation: 本发明以更低的成本提供传感器装置。 传感器装置包括印刷电路板，第一端子，第二端子，互连线和半导体器件。 第一端子和第二端子设置在印刷电路板上并耦合到电力线。 第二端子相对于第一端子耦合到电力线的下游部分。 互连线布置在印刷电路板上以将第一端子和第二端子彼此耦合。 换句话说，互连线并联耦合到电力线。 半导体器件安装在印刷电路板上，并且包括形成在互连层中的互连层和电感器。

    Semiconductor device
    3.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US08907460B2

    公开(公告)日：2014-12-09

    申请号：US14012324

    申请日：2013-08-28

    Applicant: Renesas Electronics Corporation

    Inventor： Takasuke Hashimoto ,  Shinichi Uchida ,  Yasutaka Nakashiba ,  Takatsugu Nemoto

    IPC: H01L23/552 ,  H01L23/522 ,  H01L23/58 ,  H05K9/00

    CPC classification number: H01L23/5225 ,  H01L23/5227 ,  H01L23/585 ,  H01L2924/0002 ,  H05K9/00 ,  H01L2924/00

    Abstract: To suppress the noise caused by an inductor leaks to the outside, and also to be configured such that magnetic field intensity change reaches the inductor. An inductor surrounds an internal circuit in a planar view and also is coupled electrically to the internal circuit. The upper side of the inductor is covered by an upper shield part and the lower side of the inductor is covered by a lower shield part. The upper shield part is formed by the use of a multilayered wiring layer. The upper shield part has plural first openings. The first opening overlaps the inductor in the planar view.

    Abstract translation: 为了抑制由电感器引起的噪声泄漏到外部，并且还被配置为使得磁场强度变化到达电感器。 电感器在平面视图中围绕内部电路，并且还与内部电路电连接。 电感器的上侧由上屏蔽部分覆盖，电感器的下侧由下屏蔽部分覆盖。 上部屏蔽部分通过使用多层布线层形成。 上部屏蔽部分具有多个第一开口。 第一个开口在平面视图中与电感器重叠。

    Sensor device with inductors
    5.
    发明授权
    Sensor device with inductors 有权
    带感应器的传感器装置

    公开(公告)号：US09529022B2

    公开(公告)日：2016-12-27

    申请号：US14477538

    申请日：2014-09-04

    Applicant: Renesas Electronics Corporation

    Inventor： Takatsugu Nemoto ,  Yasutaka Nakashiba ,  Takasuke Hashimoto ,  Shinichi Uchida

    IPC: G01R1/20 ,  G01R19/00 ,  G01R15/18

    CPC classification number: G01R19/0092 ,  G01R1/203 ,  G01R15/181

    Abstract: This invention provides a sensor device at reduced cost. The sensor device includes a printed circuit board, a first terminal, a second terminal, an interconnect line, and a semiconductor device. The first terminal and second terminal are provided on the printed circuit board and coupled to a power line. The second terminal is coupled to a downstream part of the power line with respect to the first terminal. The interconnect line is disposed on the printed circuit board to couple the first terminal and second terminal to each other. In other words, the interconnect line is coupled to the power line in parallel. The semiconductor device is mounted on the printed circuit board and includes an interconnect layer and an inductor formed in the interconnect layer.

    Abstract translation: 本发明以更低的成本提供传感器装置。 传感器装置包括印刷电路板，第一端子，第二端子，互连线和半导体器件。 第一端子和第二端子设置在印刷电路板上并耦合到电力线。 第二端子相对于第一端子耦合到电力线的下游部分。 互连线布置在印刷电路板上以将第一端子和第二端子彼此耦合。 换句话说，互连线并联耦合到电力线。 半导体器件安装在印刷电路板上，并且包括形成在互连层中的互连层和电感器。

    Semiconductor device having an inductor surrounds the internal circuit
    6.
    发明授权
    Semiconductor device having an inductor surrounds the internal circuit 有权
    具有电感器的半导体器件围绕内部电路

    公开(公告)号：US09245840B2

    公开(公告)日：2016-01-26

    申请号：US14527293

    申请日：2014-10-29

    Applicant: Renesas Electronics Corporation

    Inventor： Takasuke Hashimoto ,  Shinichi Uchida ,  Yasutaka Nakashiba ,  Takatsugu Nemoto

    IPC: H01L23/552 ,  H01L23/522 ,  H01L23/58 ,  H05K9/00

    CPC classification number: H01L23/5225 ,  H01L23/5227 ,  H01L23/585 ,  H01L2924/0002 ,  H05K9/00 ,  H01L2924/00

    Abstract: To suppress the noise caused by an inductor leaks to the outside, and also to be configured such that magnetic field intensity change reaches the inductor.An inductor surrounds an internal circuit in a planar view and also is coupled electrically to the internal circuit. The upper side of the inductor is covered by an upper shield part and the lower side of the inductor is covered by a lower shield part. The upper shield part is formed by the use of a multilayered wiring layer. The upper shield part has plural first openings. The first opening overlaps the inductor in the planar view.

    Abstract translation: 为了抑制由电感器引起的噪声泄漏到外部，并且还被配置为使得磁场强度变化到达电感器。 电感器在平面视图中围绕内部电路，并且还与内部电路电连接。 电感器的上侧由上屏蔽部分覆盖，电感器的下侧由下屏蔽部分覆盖。 上部屏蔽部分通过使用多层布线层形成。 上部屏蔽部分具有多个第一开口。 第一个开口在平面视图中与电感器重叠。

    Semiconductor device
    7.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US08786048B2

    公开(公告)日：2014-07-22

    申请号：US13764306

    申请日：2013-02-11

    Applicant: Renesas Electronics Corporation

    Inventor： Mototsugu Okushima ,  Takasuke Hashimoto

    IPC: H01L27/08

    CPC classification number: H01L23/60 ,  H01L23/5227 ,  H01L23/5228 ,  H01L27/0248 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    Abstract: A semiconductor device has: a signal pad; a power supply line; a ground line; an inductor section whose one end is connected to the signal pad; a terminating resistor connected between the other end of the inductor section and the power supply line or the ground line. The semiconductor device further has: a first ESD protection element connected to a first node in the inductor section; and a second ESD protection element connected to a second node whose position is different from that of the first node in the inductor section.

    Abstract translation: 半导体器件具有：信号焊盘; 电源线; 地线 电感部分，其一端连接到信号焊盘; 连接在电感器部分的另一端与电源线或接地线之间的终端电阻器。 半导体器件还具有：连接到电感器部分中的第一节点的第一ESD保护元件; 以及连接到位置与电感器部分中的第一节点的位置不同的第二节点的第二ESD保护元件。

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