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公开(公告)号:US20170288072A1
公开(公告)日:2017-10-05
申请号:US15089401
申请日:2016-04-01
IPC分类号: H01L31/0224 , H01L31/0236 , H01L31/0368 , H01L31/0216
CPC分类号: H01L31/0745 , H01L31/022441 , Y02E10/50
摘要: Thermocompression bonding approaches for foil-based metallization of non-metal surfaces of solar cells, and the resulting solar cells, are described. For example, a solar cell includes a substrate and a plurality of alternating N-type and P-type semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of alternating N-type and P-type semiconductor regions. Each conductive contact structure includes a metal foil portion disposed in direct contact with a corresponding one of the alternating N-type and P-type semiconductor regions.
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公开(公告)号:US09620655B1
公开(公告)日:2017-04-11
申请号:US14927265
申请日:2015-10-29
申请人: Robert Woehl , Richard Hamilton Sewell , Mohamed A. Elbandrawy , Taeseok Kim , Thomas P. Pass , Benjamin Ian Hsia , David Fredric Joel Kavulak , Nils-Peter Harder
发明人: Robert Woehl , Richard Hamilton Sewell , Mohamed A. Elbandrawy , Taeseok Kim , Thomas P. Pass , Benjamin Ian Hsia , David Fredric Joel Kavulak , Nils-Peter Harder
IPC分类号: H01L31/00 , H01L31/02 , H01L31/18 , H01L31/0224 , H01L31/05
CPC分类号: H01L31/022433 , H01L31/022441 , H01L31/0516 , H01L31/18 , Y02E10/50
摘要: Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.
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公开(公告)号:US20170110619A1
公开(公告)日:2017-04-20
申请号:US14885820
申请日:2015-10-16
IPC分类号: H01L31/18 , H01L31/0236 , H01L31/0224
CPC分类号: H01L31/18 , H01L31/022433 , H01L31/022441 , H01L31/02363 , H01L31/02366 , H01L31/0745 , H01L31/1876 , Y02E10/50
摘要: Indentation approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of alternating N-type and P-type semiconductor regions in or above a substrate. The method also includes locating a metal foil above the alternating N-type and P-type semiconductor regions. The method also includes forming a plurality of indentations through only a portion of the metal foil, the plurality of indentations formed at regions corresponding to locations between the alternating N-type and P-type semiconductor regions. The method also includes, subsequent to forming the plurality of indentations, isolating regions of the remaining metal foil corresponding to the alternating N-type and P-type semiconductor regions.
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公开(公告)号:US20160380134A1
公开(公告)日:2016-12-29
申请号:US14752818
申请日:2015-06-26
IPC分类号: H01L31/0224 , H01L31/18 , H01L31/05
CPC分类号: H01L31/022441 , H01L31/0682 , Y02E10/547
摘要: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.
摘要翻译: 描述了用于制造用于太阳能电池的线基金属化的方法以及所得到的太阳能电池。 在一个示例中,太阳能电池包括具有背面和相对的光接收表面的基板。 多个交替的N型和P型半导体区域设置在衬底的背面中或上方。 导电接触结构设置在多个交替的N型和P型半导体区域上。 导电接触结构包括多个金属线。 多个金属线的每个金属线沿着第一方向平行,以形成用于太阳能电池的金属化层的一维布局。
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公开(公告)号:US20170179308A1
公开(公告)日:2017-06-22
申请号:US15453612
申请日:2017-03-08
申请人: Robert Woehl , Richard Hamilton Sewell , Mohamed A. Elbandrawy , Taeseok Kim , Thomas P. Pass , Benjamin Ian Hsia , David Fredric Joel Kavulak , Nils-Peter Harder
发明人: Robert Woehl , Richard Hamilton Sewell , Mohamed A. Elbandrawy , Taeseok Kim , Thomas P. Pass , Benjamin Ian Hsia , David Fredric Joel Kavulak , Nils-Peter Harder
IPC分类号: H01L31/02 , H01L31/0224
CPC分类号: H01L31/022433 , H01L31/022441 , H01L31/0516 , H01L31/18 , Y02E10/50
摘要: Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.
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公开(公告)号:US20170125612A1
公开(公告)日:2017-05-04
申请号:US14927265
申请日:2015-10-29
申请人: Robert Woehl , Richard Hamilton Sewell , Mohamed A. Elbandrawy , Taeseok Kim , Thomas P. Pass , Benjamin Ian Hsia , David Fredric Joel Kavulak , Nils-Peter Harder
发明人: Robert Woehl , Richard Hamilton Sewell , Mohamed A. Elbandrawy , Taeseok Kim , Thomas P. Pass , Benjamin Ian Hsia , David Fredric Joel Kavulak , Nils-Peter Harder
IPC分类号: H01L31/02
CPC分类号: H01L31/022433 , H01L31/022441 , H01L31/0516 , H01L31/18 , Y02E10/50
摘要: Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.
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公开(公告)号:US09627566B2
公开(公告)日:2017-04-18
申请号:US14954030
申请日:2015-11-30
申请人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
发明人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
IPC分类号: H01L31/0224 , H01L31/028 , H01L31/0475 , H01L31/05 , H01L31/0236 , H01L31/0745
CPC分类号: H01L31/02245 , H01L31/022441 , H01L31/02363 , H01L31/028 , H01L31/0475 , H01L31/0512 , H01L31/0516 , H01L31/0682 , H01L31/0745 , Y02E10/50 , Y02E10/547 , Y02P70/521
摘要: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.
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公开(公告)号:US20160079450A1
公开(公告)日:2016-03-17
申请号:US14954030
申请日:2015-11-30
申请人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
发明人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
IPC分类号: H01L31/0224 , H01L31/0475 , H01L31/028 , H01L31/05
CPC分类号: H01L31/02245 , H01L31/022441 , H01L31/02363 , H01L31/028 , H01L31/0475 , H01L31/0512 , H01L31/0516 , H01L31/0682 , H01L31/0745 , Y02E10/50 , Y02E10/547 , Y02P70/521
摘要: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.
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公开(公告)号:US20170222068A1
公开(公告)日:2017-08-03
申请号:US15485840
申请日:2017-04-12
申请人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
发明人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
IPC分类号: H01L31/0224 , H01L31/0475 , H01L31/028 , H01L31/05
CPC分类号: H01L31/02245 , H01L31/022441 , H01L31/02363 , H01L31/028 , H01L31/0475 , H01L31/0512 , H01L31/0516 , H01L31/0682 , H01L31/0745 , Y02E10/50 , Y02E10/547 , Y02P70/521
摘要: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.
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公开(公告)号:US20160380132A1
公开(公告)日:2016-12-29
申请号:US14750821
申请日:2015-06-25
申请人: Richard Hamilton Sewell , David Fredric Joel Kavulak , Lewis Abra , Thomas P. Pass , Taeseok Kim , Matthieu Moors , Benjamin Ian Hsia , Gabriel Harley
发明人: Richard Hamilton Sewell , David Fredric Joel Kavulak , Lewis Abra , Thomas P. Pass , Taeseok Kim , Matthieu Moors , Benjamin Ian Hsia , Gabriel Harley
IPC分类号: H01L31/0224 , H01L31/0368 , H01L31/05 , H01L31/0687
摘要: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.
摘要翻译: 描述了制造用于太阳能电池的一维金属化的方法以及所得到的太阳能电池。 在一个示例中,太阳能电池包括具有背面和相对的光接收表面的基板。 多个交替的N型和P型半导体区域设置在基板的背面中或上方并且沿着第一方向平行,以形成用于太阳能电池的发射极区域的一维布局。 导电接触结构设置在多个交替的N型和P型半导体区域上。 导电接触结构包括对应于多个交替的N型和P型半导体区的多个金属线。 多个金属线沿着第一方向平行以形成用于太阳能电池的金属化层的一维布局。
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