公开(公告)号：US06505811B1

公开(公告)日：2003-01-14

申请号：US09604591

申请日：2000-06-27

申请人： Richard J. Barron ,  Anil K. Kollipara ,  Edward Nelson Fuller

发明人： Richard J. Barron ,  Anil K. Kollipara ,  Edward Nelson Fuller

IPC分类号： F16K3102

CPC分类号： F16K99/0001 ,  B60T8/363 ,  F15C5/00 ,  F16K99/0046 ,  F16K2099/008 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/00014

摘要： A fluid control valve assembly including a microvalve for controlling fluid flow in a fluid circuit having a relatively high fluid pressure requirement, such as vehicular brake system, is fixed to an associated fluid distributing substrate with a high-pressure fluid connection. The fluid distributing substrate is provided with fluid passages adapted for connection to a fluid source to provide communication between the fluid source and the microvalve device. The connection between the microvalve and the fluid distributing substrate may include metallic connections forming electrical current paths between the microvalve and the substrate; solder joints forming part of the pressure boundary of the high-pressure fluid connection; underfill formed of elastomeric or other adhesive; and bonding between the substrate and the microvalves in only selected portions of the surface of the microvalve.

摘要翻译： 一种流体控制阀组件，其包括用于控制具有相对较高流体压力要求的流体回路中的流体流动的微型阀，例如车辆制动系统，其通过高压流体连接固定到相关联的流体分配基板。 流体分配衬底设置有适于连接到流体源的流体通道，以提供流体源和微型阀装置之间的连通。 微阀和流体分配衬底之间的连接可以包括在微型阀和衬底之间形成电流通路的金属连接; 焊点形成高压流体连接的压力边界的一部分; 底层填充物由弹性体或其他粘合剂形成; 以及仅在微型阀的表面的选定部分中在基板和微型阀之间结合。

公开(公告)号：US5395679A

公开(公告)日：1995-03-07

申请号：US38379

申请日：1993-03-29

申请人： Bruce A. Myers ,  Dwadasi H. R. Sarma ,  Anil K. Kollipara ,  Ponnusamy Palanisamy

发明人： Bruce A. Myers ,  Dwadasi H. R. Sarma ,  Anil K. Kollipara ,  Ponnusamy Palanisamy

IPC分类号： H01L21/52 ,  H01L23/12 ,  H01L23/373 ,  H05K7/06 ,  H05K7/20 ,  B32B9/00

CPC分类号： H01L23/3735 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/8384 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/14 ,  Y10S428/901 ,  Y10T428/12479 ,  Y10T428/12493 ,  Y10T428/12528 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12646 ,  Y10T428/12993 ,  Y10T428/24917

摘要： Disclosed is an ultra-thick thick film of copper or silver or other suitable conductor material for use in spreading heat laterally, i.e., in the x and y directions, along a substrate. A substrate of suitable thickness is chosen to dissipate heat in the vertical or z-direction underneath a heat generating component such as a semiconductor chip. The ultra-thick films have a thickness ranging from about 2 to about 5 mils and are prepared from metal powders having average particles sizes ranging from about 1 micron to 3 microns.

摘要翻译： 公开了一种铜或银或其它适合的导体材料的超厚厚膜，用于沿着衬底横向散布热量，即在x和y方向上散热。 选择合适厚度的衬底以在诸如半导体芯片的发热部件之下的垂直或z方向上散发热量。 超厚膜具有约2至约5密耳的厚度，并且由平均粒度范围为约1微米至3微米的金属粉末制备。