Sub-lithographic printing method
    7.
    发明授权
    Sub-lithographic printing method 失效
    亚平版印刷法

    公开(公告)号:US08421194B2

    公开(公告)日:2013-04-16

    申请号:US13006403

    申请日:2011-01-13

    IPC分类号: H01L29/06

    CPC分类号: H01L21/0337

    摘要: A trench structure and an integrated circuit comprising sub-lithographic trench structures in a substrate. In one embodiment the trench structure is created by forming sets of trenches with a lithographic mask and filling the sets of trenches with sets of step spacer blocks comprising two alternating spacer materials which are separately removable from each other. In one embodiment, the trench structures formed are one-nth the thickness of the lithographic mask's feature size. The size of the trench structures being dependent on the thickness and number of spacer material layers used to form the set of step spacer blocks. The number of spacer material layers being n/2 and the thickness of each spacer material layer being one-nth of the lithographic mask's feature size.

    摘要翻译: 沟槽结构和集成电路,其包括衬底中的次光刻沟槽结构。 在一个实施例中,沟槽结构是通过用光刻掩膜形成一组沟槽而形成的,并且用一组间隔块块填充该组沟槽,该组间隔块包括彼此分离地可拆卸的两个交替间隔物材料。 在一个实施例中,形成的沟槽结构是光刻掩模的特征尺寸的厚度的十分之一。 沟槽结构的尺寸取决于用于形成一组步进间隔块的间隔材料层的厚度和数量。 间隔材料层的数量为n / 2,每个间隔材料层的厚度为光刻掩模的特征尺寸的十分之一。

    SUB-LITHOGRAPHIC PRINTING METHOD
    8.
    发明申请
    SUB-LITHOGRAPHIC PRINTING METHOD 失效
    分层印刷方法

    公开(公告)号:US20110108960A1

    公开(公告)日:2011-05-12

    申请号:US13006403

    申请日:2011-01-13

    IPC分类号: H01L21/02 H01L29/06

    CPC分类号: H01L21/0337

    摘要: A trench structure and an integrated circuit comprising sub-lithographic trench structures in a substrate. In one embodiment the trench structure is created by forming sets of trenches with a lithographic mask and filling the sets of trenches with sets of step spacer blocks comprising two alternating spacer materials which are separately removable from each other. In one embodiment, the trench structures formed are one-nth the thickness of the lithographic mask's feature size. The size of the trench structures being dependent on the thickness and number of spacer material layers used to form the set of step spacer blocks. The number of spacer material layers being n/2 and the thickness of each spacer material layer being one-nth of the lithographic mask's feature size.

    摘要翻译: 沟槽结构和集成电路,其包括衬底中的次光刻沟槽结构。 在一个实施例中,沟槽结构是通过用光刻掩膜形成一组沟槽而形成的,并且用一组间隔块块填充该组沟槽,该组间隔块包括彼此分离地可拆卸的两个交替间隔物材料。 在一个实施例中,形成的沟槽结构是光刻掩模的特征尺寸的厚度的十分之一。 沟槽结构的尺寸取决于用于形成一组步进间隔块的间隔材料层的厚度和数量。 间隔材料层的数量为n / 2,每个间隔材料层的厚度为光刻掩模的特征尺寸的十分之一。