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公开(公告)号：US08638559B2
公开(公告)日：2014-01-28
申请号：US13293174
申请日：2011-11-10
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
IPC分类号： H05K7/20
CPC分类号： F28D15/0275 , G06F1/185 , G06F1/20 , H01L23/4093 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K7/20509 , H05K7/20772 , H05K7/20809 , H01L2924/00
摘要： A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.
摘要翻译： 用于存储器模块的冷却系统包括用于将热量从存储器模块传导到液冷的安装块的热传导组件。 在一个实施例中，每个热传导组件包括具有相对的第一和第二支撑件的框架，每个从第一支撑件延伸到第二支撑件的第一和第二散热板，以及一对扁平化的热管， 散热板从第一支撑到第二支撑。 液体冷却的安装块通过存储器模块插座可释放地支撑热传导组件，存储器模块位于散热板之间。
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2.发明授权Liquid-cooling memory modules with liquid flow pipes between memory module sockets 有权内存模块插槽之间具有液体流管的液冷存储器模块公开(公告)号：US08587943B2
公开(公告)日：2013-11-19
申请号：US13305092
申请日：2011-11-28
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
CPC分类号： H01L23/473 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.
摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。
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3.发明申请LIQUID-COOLING MEMORY MODULES WITH LIQUID FLOW PIPES BETWEEN MEMORY MODULE SOCKETS 有权存储器模块插座之间液体流管的液体冷却存储器模块公开(公告)号：US20130135812A1
公开(公告)日：2013-05-30
申请号：US13305092
申请日：2011-11-28
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
CPC分类号： H01L23/473 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.
摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。
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公开(公告)号：US20130120926A1
公开(公告)日：2013-05-16
申请号：US13293174
申请日：2011-11-10
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
CPC分类号： F28D15/0275 , G06F1/185 , G06F1/20 , H01L23/4093 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K7/20509 , H05K7/20772 , H05K7/20809 , H01L2924/00
摘要： A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.
摘要翻译： 用于存储器模块的冷却系统包括用于将热量从存储器模块传导到液冷的安装块的热传导组件。 在一个实施例中，每个热传导组件包括具有相对的第一和第二支撑件的框架，每个从第一支撑件延伸到第二支撑件的第一和第二散热板，以及一对扁平化的热管， 散热板从第一支撑到第二支撑。 液体冷却的安装块通过存储器模块插座可释放地支撑热传导组件，存储器模块位于散热板之间。
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公开(公告)号：US20130147503A1
公开(公告)日：2013-06-13
申请号：US13323330
申请日：2011-12-12
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/20772
摘要： A liquid cooled planer including: one or more computing components mounted on the planer, wherein at least one or more of the computing components is liquid cooled; one or more conductive cooling components mounted on the planer; and one or more convective cooling components mounted on the planer, wherein the convective cooling components are removable from the planer without removing the conductive cooling components from the planer.
摘要翻译： 一种液体冷却刨床，包括：一个或多个安装在所述刨床上的计算部件，其中至少一个或多个所述计算部件是液体冷却的; 安装在刨床上的一个或多个导电冷却组件; 以及安装在刨床上的一个或多个对流冷却部件，其中所述对流冷却部件可从所述刨床移除，而不从所述刨床移除所述导电冷却部件。
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公开(公告)号：US20110225819A1
公开(公告)日：2011-09-22
申请号：US12728096
申请日：2010-03-19
申请人： Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
发明人： Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
CPC分类号： H05K13/0491 , Y10T29/4913 , Y10T29/53183 , Y10T29/53257 , Y10T29/53274 , Y10T29/53283
摘要： A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented.
摘要翻译： 根据一个实施例的工具包括具有凸轮板的致动机构; 至少一个可操作地联接到所述凸轮板的夹持器构件; 以及用于支撑所述至少一个夹持构件的滑架，其中所述至少一个夹持构件可由所述凸轮板致动，其中所述凸轮板的旋转使所述至少一个夹持构件在第一位置和第二位置之间移动， 其中，当所述至少一个夹持构件处于所述第一位置时，所述工具能够接受用于保持其的处理器，并且其中当所述至少一个夹持构件处于所述第二位置时，所述工具将所述处理器牢固地保持在其中。 还介绍了其他系统和方法。
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公开(公告)号：US07344394B1
公开(公告)日：2008-03-18
申请号：US11872987
申请日：2007-10-16
IPC分类号： H01R13/62
CPC分类号： H05K7/1489 , G06F1/183
摘要： A latch mechanism for securing a module in an electronic component chassis includes at least one lever arm attached to the module and rotable between a latched and unlatched position, at least a portion of the lever arm having an interference fit with the chassis when the lever arm is in the latched position. The latch mechanism further includes at least one pawl rotably attached to the module such that when the lever arm is moved to the latched position, the lever arm rotates the pawl into a latched position wherein the pawl has an interference fit with the chassis.
摘要翻译： 用于将模块固定在电子部件底盘中的闩锁机构包括至少一个杠杆臂，该杠杆臂附接到模块并可在锁定和解锁位置之间旋转，当杠杆臂 处于锁定位置。 闩锁机构还包括可旋转地附接到模块的至少一个棘爪，使得当杠杆臂移动到闩锁位置时，杠杆臂将棘爪旋转到闩锁位置，其中棘爪与底盘具有过盈配合。
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公开(公告)号：US08336199B2
公开(公告)日：2012-12-25
申请号：US12728096
申请日：2010-03-19
申请人： Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
发明人： Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
IPC分类号： B23P19/00
CPC分类号： H05K13/0491 , Y10T29/4913 , Y10T29/53183 , Y10T29/53257 , Y10T29/53274 , Y10T29/53283
摘要： A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented.
摘要翻译： 根据一个实施例的工具包括具有凸轮板的致动机构; 至少一个可操作地联接到所述凸轮板的夹持器构件; 以及用于支撑所述至少一个夹持构件的滑架，其中所述至少一个夹持构件可由所述凸轮板致动，其中所述凸轮板的旋转使所述至少一个夹持构件在第一位置和第二位置之间移动， 其中，当所述至少一个夹持构件处于所述第一位置时，所述工具能够接受用于保持其的处理器，并且其中当所述至少一个夹持构件处于所述第二位置时，所述工具将所述处理器牢固地保持在其中。 还介绍了其他系统和方法。
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9.发明授权公开(公告)号：US08659897B2
公开(公告)日：2014-02-25
申请号：US13360328
申请日：2012-01-27
CPC分类号： G06F1/20 , G06F2200/201
摘要： Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.
摘要翻译： 存储器系统中的每对存储器模块使用诸如热管或液体流管的共用冷却管来冷却。 示例实施例包括在相应冷却管的相对侧上的一对存储器模块插槽。 内部散热板热耦合到冷却管并且与存储器模块的与附带的冷却管相邻的第一面热接合。 热量从存储器模块的第二面传导到冷却管，例如从与存储器模块的相对的第二面和内板热接合的外板。
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10.发明申请公开(公告)号：US20130194745A1
公开(公告)日：2013-08-01
申请号：US13360328
申请日：2012-01-27
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , G06F2200/201
摘要： Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.
摘要翻译： 存储器系统中的每对存储器模块使用诸如热管或液体流管的共用冷却管来冷却。 示例实施例包括在相应冷却管的相对侧上的一对存储器模块插槽。 内部散热板热耦合到冷却管并且与存储器模块的与附带的冷却管相邻的第一面热接合。 热量从存储器模块的第二面传导到冷却管，例如从与存储器模块的相对的第二面和内板热接合的外板。
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