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公开(公告)号：US5120579A
公开(公告)日：1992-06-09
申请号：US749144
申请日：1991-08-23
IPC分类号： C03C8/10 , C03C8/22 , H01B3/08 , H01L23/498 , H05K1/03
CPC分类号： H05K1/0306 , C03C8/10 , C03C8/22 , H01B3/085 , H01B3/087 , H01B3/088 , H01L23/49894 , H01L2924/0002 , H01L2924/09701
摘要： A method of bonding a dielectric material to a substrate comprising the steps of:I. providing a substrate;II. providing a dielectric composition comprising:(a) about 30% to about 100% by weight of a glass composition selected from the group consisting of:(a-1) a mixture of two glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C. and a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C.; or(a-2) a mixture of three glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C., a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C., and a third glass composition having a glass transition temperature in the range of about 650.degree. C. to about 720.degree. C.;III. applying to at least one surface of the substrate the dielectric; andIV. heating the substrate in a nonoxidizing atmosphere to a temperature sufficient to permit the glass composition (a) to fuse.
摘要翻译： 一种将介电材料粘合到基底上的方法，包括以下步骤：I.提供基底; 二， 提供一种电介质组合物，其包含：（a）约30％至约100％重量的选自以下的玻璃组合物：（a-1）两种玻璃组合物的混合物，其包含玻璃化转变温度 在约585℃至约620℃的范围内和玻璃化转变温度在约765℃至约815℃范围内的第二玻璃组合物。 或（a-2）三种玻璃组合物的混合物，其包含玻璃化转变温度在约585℃至约620℃范围内的第一玻璃组合物，玻璃化转变温度在该范围内的第二玻璃组合物 约765℃至约815℃，以及玻璃化转变温度在约650℃至约720℃范围内的第三玻璃组合物。 三， 施加到所述基底的至少一个表面上的所述电介质; 和IV。 在非氧化气氛中加热衬底至足以使玻璃组合物（a）熔化的温度。
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公开(公告)号：US5070047A
公开(公告)日：1991-12-03
申请号：US640590
申请日：1991-01-14
IPC分类号： C03C8/10 , C03C8/22 , H01B3/08 , H01L23/498 , H05K1/03
CPC分类号： H01B3/088 , C03C8/10 , C03C8/22 , H01B3/085 , H01B3/087 , H01L23/49894 , H05K1/0306 , H01L2924/0002 , H01L2924/09701
摘要： This invention relates to a dielectric composition comprising:(a) about 30% to about 100% by weight of a glass composition selected from the group consisting of:(a-1) a bismuth-free, lead-free or low-lead containing glass composition having a glass transition temperature in the range of about 600.degree. C. to about 800.degree. C.;(a-2) a mixture of two bismuth-free, lead-free or low-lead containing glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C. and a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C.; or(a-3) a mixture of three bismuth-free, lead-free or low-lead containing glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C., a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C., and a third glass composition having a glass transition temperature in the range of about 650.degree. C. to about 720.degree. C.;(b) up to about 30% by weight of at least one expansion modifier; and(c) up to about 40% by weight of at least one refractory oxide.This invention also relates to thick-film dielectric pastes and dielectric tapes comprising the foregoing dielectric composition. The invention also relates alumina base substrates having the foregoing dielectric composition bonded to at least one surface thereof, and to a method of bonding the foregoing dielectric composition to alumina base substrates.
摘要翻译： 本发明涉及一种电介质组合物，其包含：（a）约30％至约100％重量的选自以下的玻璃组合物：（a-1）无铋，无铅或低铅 玻璃组合物的玻璃化转变温度在约600℃至约800℃的范围内。 （a-2）两种无铋，无铅或低含铅玻璃组合物的混合物，其包含玻璃化转变温度在约585℃至约620℃范围内的第一玻璃组合物和 第二玻璃组合物的玻璃化转变温度在约765℃至约815℃的范围内。 或（a-3）三种无铋，无铅或低含铅玻璃组合物的混合物，其包含玻璃化转变温度在约585℃至约620℃范围内的第一玻璃组合物， 玻璃化转变温度在约765℃至约815℃范围内的第二玻璃组合物，以及玻璃化转变温度在约650℃至约720℃范围内的第三玻璃组合物。 ; （b）至多约30重量％的至少一种膨胀改性剂; 和（c）至多约40重量％的至少一种难熔氧化物。 本发明还涉及包含上述电介质组合物的厚膜电介质浆料和介电胶带。 本发明还涉及具有与上述电介质组合物的至少一个表面接合的氧化铝基底，以及将上述电介质组合物与氧化铝基底结合的方法。
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公开(公告)号：US5397830A
公开(公告)日：1995-03-14
申请号：US186199
申请日：1994-01-24
申请人： Aziz S. Shaikh , Gordon J. Roberts , Gautam Sarkar
发明人： Aziz S. Shaikh , Gordon J. Roberts , Gautam Sarkar
摘要： The present invention provides new and improved dielectric materials. In one preferred embodiment such novel dielectric material is formed by firing a composition including a glass composition comprising in weight percent from about 22% to about 45% ZnO, from about 4% to about 22% MgO, from about 1% to about 16% Al.sub.2 O.sub.3, from about 20% to about 49% SiO.sub.2, from about 2% to about 11% BaO, up to about 10% ZrO.sub.2, from about 0.05% to about 1.1% Fe.sub.2 O.sub.3 and from about 0.05% to about 0.95% PbO.
摘要翻译： 本发明提供了新的和改进的电介质材料。 在一个优选实施方案中，通过焙烧包含重量百分比约22％至约45％ZnO，约4％至约22％MgO，约1％至约16％ 约20％至约49％的SiO 2，约2％至约11％的BaO，至多约10％的ZrO 2，约0.05％至约1.1％的Fe 2 O 3和约0.05％至约0.95％的PbO。
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公开(公告)号：US5164342A
公开(公告)日：1992-11-17
申请号：US604344
申请日：1990-10-24
申请人： S. K. Muralidhar , Aziz S. Shaikh , Gordon J. Roberts , Dana L. Hankey , David J. Leandri , Thomas J. Vlach
发明人： S. K. Muralidhar , Aziz S. Shaikh , Gordon J. Roberts , Dana L. Hankey , David J. Leandri , Thomas J. Vlach
CPC分类号： C03C12/00 , C03C10/0009 , C03C10/0054 , C03C14/004 , C03C8/22 , H01B3/087 , H01L23/49894 , C03C2214/04 , H01L2924/0002 , H01L2924/09701 , H05K1/0306
摘要： A low dielectric, low temperature fired glass ceramic produced by firing at about 800.degree.-950.degree. C. a mixture comprising at least one glass consisting of, by weight percent, 0 to 50% B.sub.2 O.sub.3, 35 to 65% CaO, and 10 to 65% SiO.sub.2 l , and selected from the glasses of CaO-B.sub.2 O.sub.3 -SiO.sub.2 glass system. The glass ceramic is light weight, exhibits a dielectric constant of less than about 5.2, has adequate mechanical strength and thermal conductivity, and is compatible with precious metal conductors. The glass ceramic is useful in the manufacture of integrated circuits and any other electronic or mechanical components where a glass ceramic exhibiting this particular combination of characteristics is suitable.
摘要翻译： 一种低介电低温烧制玻璃陶瓷，其通过在约800-950℃下焙烧而制备的混合物，该混合物包括至少一种玻璃，其中重量百分比为0-50％B2O3,35-65％CaO，和10- 65％SiO2，并选自CaO-B2O3-SiO2玻璃体系玻璃。 玻璃陶瓷重量轻，介电常数小于5.2，具有足够的机械强度和导热性，并与贵金属导体兼容。 玻璃陶瓷可用于制造集成电路和任何其它电子或机械部件，其中表现出特定特征组合的玻璃陶瓷是合适的。
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公开(公告)号：US5258335A
公开(公告)日：1993-11-02
申请号：US838631
申请日：1992-02-19
申请人： S. K. Muralidhar , Gordon J. Roberts , Aziz S. Shaikh , David J. Leandri , Dana L. Hankey , Thomas J. Vlach
发明人： S. K. Muralidhar , Gordon J. Roberts , Aziz S. Shaikh , David J. Leandri , Dana L. Hankey , Thomas J. Vlach
CPC分类号： H01B3/087 , C03C10/0054 , C03C14/004 , C03C8/22 , H01L23/49894 , C03C2214/04 , H01L2924/0002 , H01L2924/09701 , H05K1/0306
摘要： A low dielectric, low temperature fired glass ceramic produced by firing at about 800.degree.-900.degree. C. a mixture comprising at least one glass consisting of, by weight percent, 0 to 50% B.sub.2 O.sub.3, 35 to 65% CaO, and 10 to 65% SiO.sub.2, and selected from the glasses of CaO-B.sub.2 O.sub.3 -SiO.sub.2 glass system. The glass ceramic is light weight, exhibits a dielectric constant of less than about 7.9, has adequate mechanical strength and thermal conductivity, and is compatible with precious metal conductors. The glass ceramic is useful in the manufacture of integrated circuits and any other electronic or mechanical components where a glass ceramic exhibiting this particular combination of characteristics is suitable.
摘要翻译： 一种低介电低温烧制玻璃陶瓷，通过在约800-900℃下烧制而制备的混合物，该混合物包括至少一种玻璃，其中重量百分数为0-50％B2O3,35-65％CaO，和10- 65％SiO2，并选自CaO-B2O3-SiO2玻璃体系玻璃。 玻璃陶瓷重量轻，介电常数小于约7.9，具有足够的机械强度和导热性，并与贵金属导体兼容。 玻璃陶瓷可用于制造集成电路和任何其它电子或机械部件，其中表现出特定特征组合的玻璃陶瓷是合适的。
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公开(公告)号：US08786034B2
公开(公告)日：2014-07-22
申请号：US13608022
申请日：2012-09-10
IPC分类号： H01L29/84
CPC分类号： C03C8/24 , C03C3/066 , C03C3/072 , C03C3/16 , C03C8/245 , H01L2224/48091 , H01L2224/48465 , H01L2924/16235 , H01L2924/00014
摘要： Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.
摘要翻译： 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体，但在约35℃至约90℃的温度下熔融，由此形成可流动的液体分散体，其可施加到基底（例如盖片和 /或MEMS器件的器件晶片）。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此，它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且，由于根据本发明的热熔密封玻璃组合物不是溶剂型体系，它们在沉积后不需要强力干燥。
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7.发明授权公开(公告)号：US08307674B2
公开(公告)日：2012-11-13
申请号：US12532424
申请日：2009-07-15
IPC分类号： C03C27/00
CPC分类号： C03C8/24 , C03C3/066 , C03C3/072 , C03C3/16 , C03C8/245 , H01L2224/48091 , H01L2224/48465 , H01L2924/16235 , H01L2924/00014
摘要： Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.
摘要翻译： 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体，但在约35℃至约90℃的温度下熔融，由此形成可流动的液体分散体，其可施加到基底（例如盖片和 /或MEMS器件的器件晶片）。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此，它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且，由于根据本发明的热熔密封玻璃组合物不是溶剂型体系，它们在沉积后不需要强力干燥。
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8.发明申请公开(公告)号：US20110169108A1
公开(公告)日：2011-07-14
申请号：US12532424
申请日：2009-07-15
CPC分类号： C03C8/24 , C03C3/066 , C03C3/072 , C03C3/16 , C03C8/245 , H01L2224/48091 , H01L2224/48465 , H01L2924/16235 , H01L2924/00014
摘要： Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.
摘要翻译： 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体，但在约35℃至约90℃的温度下熔融，由此形成可流动的液体分散体，其可施加到基底（例如盖片和 /或MEMS器件的器件晶片）。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此，它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且，由于根据本发明的热熔密封玻璃组合物不是溶剂型体系，它们在沉积后不需要强力干燥。
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公开(公告)号：US20130062712A1
公开(公告)日：2013-03-14
申请号：US13608022
申请日：2012-09-10
CPC分类号： C03C8/24 , C03C3/066 , C03C3/072 , C03C3/16 , C03C8/245 , H01L2224/48091 , H01L2224/48465 , H01L2924/16235 , H01L2924/00014
摘要： Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.
摘要翻译： 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体，但在约35℃至约90℃的温度下熔融，由此形成可流动的液体分散体，其可施加到基底（例如盖片和 /或MEMS器件的器件晶片）。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此，它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且，由于根据本发明的热熔密封玻璃组合物不是溶剂型体系，它们在沉积后不需要强力干燥。
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公开(公告)号：US09824790B2
公开(公告)日：2017-11-21
申请号：US14240788
申请日：2012-08-16
申请人： Dongshe Zhang , Aziz S. Shaikh , Srinivasan Sridharan , Himal Khatri , Hong Jiang , George E. Graddy, Jr.
发明人： Dongshe Zhang , Aziz S. Shaikh , Srinivasan Sridharan , Himal Khatri , Hong Jiang , George E. Graddy, Jr.
IPC分类号： H01L31/00 , H01B1/22 , C07F9/11 , C03C8/16 , C03C8/18 , C03C8/22 , H01L31/0224 , H01L21/22 , C03C8/10 , C03C8/08
CPC分类号： H01B1/22 , C03C8/08 , C03C8/10 , C03C8/16 , C03C8/18 , C03C8/22 , C07F9/11 , H01L21/2225 , H01L31/022425 , H01L31/022441 , Y02E10/50
摘要： Paste compositions, methods of making a paste composition, photovoltaic cells, and methods of making a photovoltaic cell contact are disclosed. The paste composition can include a conductive metal component such as aluminum, phosphate glass, phosphorus compounds such as alky! phosphate, and a vehicle. The contact can be formed on a passivation layer on a silicon wafer by applying the paste on the passivation layer and firing the paste. During firing, the metal component can fire through the passivation layer, thereby electrically contacting the silicon substrate.
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