摘要:
A method of bonding a dielectric material to a substrate comprising the steps of:I. providing a substrate;II. providing a dielectric composition comprising:(a) about 30% to about 100% by weight of a glass composition selected from the group consisting of:(a-1) a mixture of two glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C. and a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C.; or(a-2) a mixture of three glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C., a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C., and a third glass composition having a glass transition temperature in the range of about 650.degree. C. to about 720.degree. C.;III. applying to at least one surface of the substrate the dielectric; andIV. heating the substrate in a nonoxidizing atmosphere to a temperature sufficient to permit the glass composition (a) to fuse.
摘要:
This invention relates to a dielectric composition comprising:(a) about 30% to about 100% by weight of a glass composition selected from the group consisting of:(a-1) a bismuth-free, lead-free or low-lead containing glass composition having a glass transition temperature in the range of about 600.degree. C. to about 800.degree. C.;(a-2) a mixture of two bismuth-free, lead-free or low-lead containing glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C. and a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C.; or(a-3) a mixture of three bismuth-free, lead-free or low-lead containing glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C., a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C., and a third glass composition having a glass transition temperature in the range of about 650.degree. C. to about 720.degree. C.;(b) up to about 30% by weight of at least one expansion modifier; and(c) up to about 40% by weight of at least one refractory oxide.This invention also relates to thick-film dielectric pastes and dielectric tapes comprising the foregoing dielectric composition. The invention also relates alumina base substrates having the foregoing dielectric composition bonded to at least one surface thereof, and to a method of bonding the foregoing dielectric composition to alumina base substrates.
摘要:
Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.
摘要:
Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.
摘要:
Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.
摘要:
Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.
摘要:
A method comprises observing communication through a virtualized interface between at least one virtual machine (VM) and a driver domain. Based on the observed communication through the virtualized interface, a weighted amount of communication between the VM and the driver domain is determined for each of the VM(s), wherein the weighted amount is based at least in part on at least one characteristic of the observed communication, such as directional flow and/or size of packets in the communication. Another method comprises evaluating CPU utilization of a target network driver domain in processing communications having different characteristics, and deriving corresponding weighting for the different communication characteristics. The derived weighting for the different communication characteristics are employed within a communication monitor that observes communication between virtual machines and the target network driver domain.
摘要:
According to at least one embodiment, a method comprises observing communication from a virtual machine (VM) to a domain in which a device driver for a shared resource resides. The method further comprises determining, based on the observed communication, CPU utilization of the domain that is attributable to the VM. According to at least one embodiment, a system comprises a Central Processing Unit (CPU), Virtual Machines (VMs), and a domain in which a device driver for a shared resource resides, wherein the domain is operable to receive requests from the VMs for access to the shared resource. The system further comprises a CPU utilization monitor operable to determine an amount of CPU utilization of the domain in processing the received requests that is attributable to each of the VMs.
摘要:
A simultaneous ascending price auction (“SAA”) can be used to allocate advertising inventory to bidders. The advertising inventory can be, for example, radio or television advertisement spots (“spots”). The bidders can be advertisers that can provide advertisements for presentation in the spots. Two or more contiguous spots can define an advertising block. Spots or advertising blocks can be allocated to advertisers by the SM mechanism based on bid criteria. The SAA can perform simultaneous advertisement scheduling and pricing. The auction allocation can be optimized to facilitate efficient allocation of advertisements to spots or blocks.
摘要:
A method comprises determining a flexible limit on an amount of resource usage by a driver domain on behalf of a given virtual machine (VM). The method further comprises controlling the resource usage by the driver domain on behalf of the given VM so as not to exceed the flexible limit except under a permitted condition. In certain embodiments the resource usage by the driver domain on behalf of the given VM is controlled so as not to exceed the flexible limit except when a slack share of resource usage is available to the driver domain. Such a slack share of resource usage is a share of resource usage allocated to the driver domain that will not otherwise be used on behalf of another VM.