Dielectric compositions
    1.
    发明授权
    Dielectric compositions 失效
    介电组合物

    公开(公告)号:US5120579A

    公开(公告)日:1992-06-09

    申请号:US749144

    申请日:1991-08-23

    摘要: A method of bonding a dielectric material to a substrate comprising the steps of:I. providing a substrate;II. providing a dielectric composition comprising:(a) about 30% to about 100% by weight of a glass composition selected from the group consisting of:(a-1) a mixture of two glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C. and a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C.; or(a-2) a mixture of three glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C., a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C., and a third glass composition having a glass transition temperature in the range of about 650.degree. C. to about 720.degree. C.;III. applying to at least one surface of the substrate the dielectric; andIV. heating the substrate in a nonoxidizing atmosphere to a temperature sufficient to permit the glass composition (a) to fuse.

    摘要翻译: 一种将介电材料粘合到基底上的方法,包括以下步骤:I.提供基底; 二, 提供一种电介质组合物,其包含:(a)约30%至约100%重量的选自以下的玻璃组合物:(a-1)两种玻璃组合物的混合物,其包含玻璃化转变温度 在约585℃至约620℃的范围内和玻璃化转变温度在约765℃至约815℃范围内的第二玻璃组合物。 或(a-2)三种玻璃组合物的混合物,其包含玻璃化转变温度在约585℃至约620℃范围内的第一玻璃组合物,玻璃化转变温度在该范围内的第二玻璃组合物 约765℃至约815℃,以及玻璃化转变温度在约650℃至约720℃范围内的第三玻璃组合物。 三, 施加到所述基底的至少一个表面上的所述电介质; 和IV。 在非氧化气氛中加热衬底至足以使玻璃组合物(a)熔化的温度。

    Dielectric compositions
    2.
    发明授权
    Dielectric compositions 失效
    介电组合物

    公开(公告)号:US5070047A

    公开(公告)日:1991-12-03

    申请号:US640590

    申请日:1991-01-14

    摘要: This invention relates to a dielectric composition comprising:(a) about 30% to about 100% by weight of a glass composition selected from the group consisting of:(a-1) a bismuth-free, lead-free or low-lead containing glass composition having a glass transition temperature in the range of about 600.degree. C. to about 800.degree. C.;(a-2) a mixture of two bismuth-free, lead-free or low-lead containing glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C. and a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C.; or(a-3) a mixture of three bismuth-free, lead-free or low-lead containing glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C., a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C., and a third glass composition having a glass transition temperature in the range of about 650.degree. C. to about 720.degree. C.;(b) up to about 30% by weight of at least one expansion modifier; and(c) up to about 40% by weight of at least one refractory oxide.This invention also relates to thick-film dielectric pastes and dielectric tapes comprising the foregoing dielectric composition. The invention also relates alumina base substrates having the foregoing dielectric composition bonded to at least one surface thereof, and to a method of bonding the foregoing dielectric composition to alumina base substrates.

    摘要翻译: 本发明涉及一种电介质组合物,其包含:(a)约30%至约100%重量的选自以下的玻璃组合物:(a-1)无铋,无铅或低铅 玻璃组合物的玻璃化转变温度在约600℃至约800℃的范围内。 (a-2)两种无铋,无铅或低含铅玻璃组合物的混合物,其包含玻璃化转变温度在约585℃至约620℃范围内的第一玻璃组合物和 第二玻璃组合物的玻璃化转变温度在约765℃至约815℃的范围内。 或(a-3)三种无铋,无铅或低含铅玻璃组合物的混合物,其包含玻璃化转变温度在约585℃至约620℃范围内的第一玻璃组合物, 玻璃化转变温度在约765℃至约815℃范围内的第二玻璃组合物,以及玻璃化转变温度在约650℃至约720℃范围内的第三玻璃组合物。 ; (b)至多约30重量%的至少一种膨胀改性剂; 和(c)至多约40重量%的至少一种难熔氧化物。 本发明还涉及包含上述电介质组合物的厚膜电介质浆料和介电胶带。 本发明还涉及具有与上述电介质组合物的至少一个表面接合的氧化铝基底,以及将上述电介质组合物与氧化铝基底结合的方法。

    Hot-Melt Sealing Glass Compositions And Devices Using The Same
    3.
    发明申请
    Hot-Melt Sealing Glass Compositions And Devices Using The Same 有权
    热熔胶封玻璃组合物和使用它的设备

    公开(公告)号:US20130062712A1

    公开(公告)日:2013-03-14

    申请号:US13608022

    申请日:2012-09-10

    IPC分类号: C03C8/24 H01L29/84

    摘要: Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.

    摘要翻译: 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体,但在约35℃至约90℃的温度下熔融,由此形成可流动的液体分散体,其可施加到基底(例如盖片和 /或MEMS器件的器件晶片)。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此,它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且,由于根据本发明的热熔密封玻璃组合物不是溶剂型体系,它们在沉积后不需要强力干燥。

    Hot-melt sealing glass compositions and devices using the same
    4.
    发明授权
    Hot-melt sealing glass compositions and devices using the same 有权
    热熔密封玻璃组合物及使用其的装置

    公开(公告)号:US08786034B2

    公开(公告)日:2014-07-22

    申请号:US13608022

    申请日:2012-09-10

    IPC分类号: H01L29/84

    摘要: Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.

    摘要翻译: 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体,但在约35℃至约90℃的温度下熔融,由此形成可流动的液体分散体,其可施加到基底(例如盖片和 /或MEMS器件的器件晶片)。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此,它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且,由于根据本发明的热熔密封玻璃组合物不是溶剂型体系,它们在沉积后不需要强力干燥。

    Hot-melt sealing glass compositions and methods of making and using the same
    5.
    发明授权
    Hot-melt sealing glass compositions and methods of making and using the same 有权
    热熔密封玻璃组合物及其制备和使用方法

    公开(公告)号:US08307674B2

    公开(公告)日:2012-11-13

    申请号:US12532424

    申请日:2009-07-15

    IPC分类号: C03C27/00

    摘要: Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.

    摘要翻译: 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体,但在约35℃至约90℃的温度下熔融,由此形成可流动的液体分散体,其可施加到基底(例如盖片和 /或MEMS器件的器件晶片)。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此,它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且,由于根据本发明的热熔密封玻璃组合物不是溶剂型体系,它们在沉积后不需要强力干燥。

    Hot-Melt Sealing Glass Compositions And Methods Of Making And Using The Same
    6.
    发明申请
    Hot-Melt Sealing Glass Compositions And Methods Of Making And Using The Same 有权
    热熔胶封玻璃组合物及其使用方法

    公开(公告)号:US20110169108A1

    公开(公告)日:2011-07-14

    申请号:US12532424

    申请日:2009-07-15

    摘要: Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.

    摘要翻译: 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体,但在约35℃至约90℃的温度下熔融,由此形成可流动的液体分散体,其可施加到基底(例如盖片和 /或MEMS器件的器件晶片)。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此,它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且,由于根据本发明的热熔密封玻璃组合物不是溶剂型体系,它们在沉积后不需要强力干燥。

    System and method for attributing to a corresponding virtual machine CPU utilization of a network driver domain based on weighted communication
    7.
    发明授权
    System and method for attributing to a corresponding virtual machine CPU utilization of a network driver domain based on weighted communication 有权
    基于加权通信归因于网络驱动程序域的相应虚拟机CPU利用率的系统和方法

    公开(公告)号:US08214838B2

    公开(公告)日:2012-07-03

    申请号:US11493492

    申请日:2006-07-26

    IPC分类号: G06F15/173 G06F9/455 G06F9/44

    CPC分类号: G06F9/5077

    摘要: A method comprises observing communication through a virtualized interface between at least one virtual machine (VM) and a driver domain. Based on the observed communication through the virtualized interface, a weighted amount of communication between the VM and the driver domain is determined for each of the VM(s), wherein the weighted amount is based at least in part on at least one characteristic of the observed communication, such as directional flow and/or size of packets in the communication. Another method comprises evaluating CPU utilization of a target network driver domain in processing communications having different characteristics, and deriving corresponding weighting for the different communication characteristics. The derived weighting for the different communication characteristics are employed within a communication monitor that observes communication between virtual machines and the target network driver domain.

    摘要翻译: 一种方法包括通过至少一个虚拟机(VM)和驱动器域之间的虚拟化接口观察通信。 基于通过虚拟化接口的观察到的通信,为每个VM确定VM与驱动器域之间的加权通信量,其中加权量至少部分地基于至少一个 观察到的通信,例如通信中的分组的定向流和/或大小。 另一种方法包括在处理具有不同特征的通信中评估目标网络驱动器域的CPU利用率,以及为不同的通信特征导出相应的加权。 在通信监视器中采用不同通信特性的导出加权,其监视虚拟机与目标网络驱动器域之间的通信。

    System and method for attributing to a corresponding virtual machine CPU usage of a domain in which a shared resource's device driver resides
    8.
    发明授权
    System and method for attributing to a corresponding virtual machine CPU usage of a domain in which a shared resource's device driver resides 有权
    将系统和方法归因于共享资源的设备驱动程序驻留的域的相应虚拟机CPU使用率

    公开(公告)号:US07797707B2

    公开(公告)日:2010-09-14

    申请号:US11070605

    申请日:2005-03-02

    IPC分类号: G06F3/00 G06F9/455

    摘要: According to at least one embodiment, a method comprises observing communication from a virtual machine (VM) to a domain in which a device driver for a shared resource resides. The method further comprises determining, based on the observed communication, CPU utilization of the domain that is attributable to the VM. According to at least one embodiment, a system comprises a Central Processing Unit (CPU), Virtual Machines (VMs), and a domain in which a device driver for a shared resource resides, wherein the domain is operable to receive requests from the VMs for access to the shared resource. The system further comprises a CPU utilization monitor operable to determine an amount of CPU utilization of the domain in processing the received requests that is attributable to each of the VMs.

    摘要翻译: 根据至少一个实施例,一种方法包括观察从虚拟机(VM)到共享资源的设备驱动程序驻留的域的通信。 该方法还包括基于观察到的通信来确定可归因于VM的域的CPU利用率。 根据至少一个实施例,系统包括中央处理单元(CPU),虚拟机(VM)以及其中驻留有用于共享资源的设备驱动程序的域,其中所述域可操作以从VM接收对于 访问共享资源。 该系统还包括CPU利用监视器,其可操作以在处理可归因于每个VM的接收到的请求时确定域的CPU利用量。

    Systems and methods for flexibly controlling resource usage by a driver domain on behalf of a virtual machine
    10.
    发明申请
    Systems and methods for flexibly controlling resource usage by a driver domain on behalf of a virtual machine 有权
    用于灵活地控制代表虚拟机的驱动器域的资源使用的系统和方法

    公开(公告)号:US20080028410A1

    公开(公告)日:2008-01-31

    申请号:US11493179

    申请日:2006-07-26

    IPC分类号: G06F9/46

    摘要: A method comprises determining a flexible limit on an amount of resource usage by a driver domain on behalf of a given virtual machine (VM). The method further comprises controlling the resource usage by the driver domain on behalf of the given VM so as not to exceed the flexible limit except under a permitted condition. In certain embodiments the resource usage by the driver domain on behalf of the given VM is controlled so as not to exceed the flexible limit except when a slack share of resource usage is available to the driver domain. Such a slack share of resource usage is a share of resource usage allocated to the driver domain that will not otherwise be used on behalf of another VM.

    摘要翻译: 一种方法包括为代表给定的虚拟机(VM)的驱动器域确定对资源使用量的灵活限制。 该方法还包括代表给定的VM控制驱动器域的资源使用,以便除了允许的条件之外,不超过灵活限制。 在某些实施例中,代表给定VM的驱动器域的资源使用被控制为不超过灵活限制,除非当驱动器域的资源使用的松散份额可用时。 资源使用量的这种松散份额是分配给驱动程序域的资源使用份额,不会以其他方式代替另一个VM使用。