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公开(公告)号：US07329446B2
公开(公告)日：2008-02-12
申请号：US10691882
申请日：2003-10-23
CPC分类号： B32B7/12 , B23B35/00 , B23B2222/21 , B23B2222/41 , B23B2222/64 , B23B2240/21 , B32B7/06 , B32B15/01 , B32B15/04 , B32B15/20 , H05K3/0047 , H05K3/44 , H05K2203/1536 , Y10T83/0476 , Y10T156/1057 , Y10T156/1184 , Y10T408/03 , Y10T428/12569 , Y10T428/14 , Y10T428/1495 , Y10T428/24273 , Y10T428/24322 , Y10T428/28 , Y10T428/2804
摘要： The present invention provides a structure. The structure includes a stack of sheets. Successive sheets in each pair of successive sheets of the stack are coupled to each other by a removable adhesive. The removable adhesive is also disposed on top and bottom surfaces of the stack so as to respectively couple first and second layers to the cop and bottom surfaces of the stack.
摘要翻译： 本发明提供一种结构。 该结构包括一叠纸。 堆叠的每对连续片中的连续片材通过可移除的粘合剂彼此连接。 可拆卸粘合剂也设置在堆叠的顶表面和底表面上，以便将第一层和第二层分别耦合到堆叠的掩模和底表面。
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公开(公告)号：US06669805B2
公开(公告)日：2003-12-30
申请号：US09788081
申请日：2001-02-16
IPC分类号： B32B3118
CPC分类号： B32B7/12 , B23B35/00 , B23B2222/21 , B23B2222/41 , B23B2222/64 , B23B2240/21 , B32B7/06 , B32B15/01 , B32B15/04 , B32B15/20 , H05K3/0047 , H05K3/44 , H05K2203/1536 , Y10T83/0476 , Y10T156/1057 , Y10T156/1184 , Y10T408/03 , Y10T428/12569 , Y10T428/14 , Y10T428/1495 , Y10T428/24273 , Y10T428/24322 , Y10T428/28 , Y10T428/2804
摘要： The present invention provides a method of temporarily adhering a stack of sheets together to facilitate drilling a hole through the stack of sheets. The method includes using a temporary adhesive that prevents burring while drilling a hole through the stack.
摘要翻译： 本发明提供了一种临时将一叠片材粘合在一起以便于穿过一叠片材的孔的方法。 该方法包括使用临时粘合剂，其在通过堆叠钻孔时防止翻边。
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公开(公告)号：US06834426B1
公开(公告)日：2004-12-28
申请号：US09625135
申请日：2000-07-25
IPC分类号： H05K320
CPC分类号： H05K3/4641 , H05K3/4069 , H05K3/445 , H05K3/4614 , H05K2201/09536 , H05K2201/096 , H05K2201/09881 , H05K2201/10378 , Y10T29/49126 , Y10T29/49128 , Y10T29/49165
摘要： A method for fabricating a laminate circuit structure is provided. The method comprises: providing at least two modularized circuitized voltage plane subassemblies wherein each of the subassemblies comprise at least two signal planes having an external and internal surface disposed about an internal voltage plane; providing a dielectric material between the signal and voltage planes; and providing dielectric on each external surface of each signal plane; and providing a non-cured or partially cured curable dielectric composition between the subassemblies wherein the dielectric composition comprises, dielectric material that is of the same material as the dielectric material used in said subassemblies, aligning the subassemblies, and then laminating to cause bonding of the subassemblies.
摘要翻译： 提供一种制造叠层电路结构的方法。 该方法包括：提供至少两个模块化的电路化电压平面子组件，其中每个子组件包括至少两个具有围绕内部电压平面设置的外部和内部表面的信号平面; 在信号和电压平面之间提供介电材料; 并在每个信号平面的每个外表面上提供电介质; 并且在所述子组件之间提供未固化或部分固化的可固化电介质组合物，其中所述电介质组合物包括与所述子组件中使用的介电材料具有相同材料的介电材料，对准所述子组件，然后层压以引起 子组件
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公开(公告)号：US06395998B1
公开(公告)日：2002-05-28
申请号：US09661652
申请日：2000-09-13
IPC分类号： H05K116
CPC分类号： H01L23/145 , H01L23/13 , H01L2924/0002 , Y10T29/4913 , H01L2924/00
摘要： An electronic package and method of making the electronic package is provided. An opening in a thermally conductive member of the electronic package is formed to substantially prevent adhesive which can bleed from under a substrate mounted and secured on the thermally conductive member from contacting a portion of the thermally conductive member upon which an electrical element will be mounted.
摘要翻译： 提供电子封装和制造电子封装的方法。 形成电子封装件的导热构件中的开口，以基本上防止粘合剂，该粘合剂可以从安装和固定在导热构件上的基板下方泄漏，以接触将要安装电气元件的导热构件的一部分。
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