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1.发明授权Material handling system and methods for a multichamber plasma treatment system 失效多室等离子体处理系统的材料处理系统和方法公开(公告)号：US06709522B1
公开(公告)日：2004-03-23
申请号：US09702416
申请日：2000-10-31
IPC分类号： C23C16458
CPC分类号： H01L21/67236 , H01L21/67069
摘要： A plasma treatment system wherein workpieces are carried in slots in a magazine. The plasma treatment system has first and second plasma treatment chambers mounted on a common base a base. A queuing station is located on the base for receiving the magazines. A magazine handler moves a magazine to a location adjacent one of the first and second plasma treatment chambers. A workpiece handler transfers a workpiece between the magazine and the one of the first and second plasma treatment chambers. The workpiece handler has a workpiece translator with a first surface that contacts a first edge of the workpiece for pushing the workpiece into the plasma treatment chamber. In addition, the workpiece translator has a second surface that contacts an opposite edge of the workpiece for pushing the workpiece out of the plasma treatment chamber. There are various methods relating to the use of multiple plasma treatment chambers on a single base and the automatic handling of workpieces for loading and unloading the multiple plasma treatment chambers.
摘要翻译： 一种等离子体处理系统，其中工件承载在盒中的槽中。 等离子体处理系统具有安装在公共基座上的第一和第二等离子体处理室。 一个排队站位于基地，用于接收杂志。 杂志处理器将杂志移动到与第一和第二等离子体处理室之一相邻的位置。 工件处理器在工作台与第一等离子体处理室和第二等离子体处理室之间传送工件。 工件处理器具有工件转换器，其具有接触工件的第一边缘的第一表面，用于将工件推入等离子体处理室。 此外，工件转换器具有接触工件的相对边缘的第二表面，用于将工件推出等离子体处理室。 关于在单个基座上使用多个等离子体处理室的各种方法以及用于装载和卸载多个等离子体处理室的工件的自动处理。
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2.发明申请公开(公告)号：US20210399673A1
公开(公告)日：2021-12-23
申请号：US17336407
申请日：2021-06-02
申请人： James Scott Tyler
发明人： James Scott Tyler
摘要： An earth mount-enabled utility-scale solar photovoltaic array has plural rows of solar panels supported on the grounds to establish an earth orientation of the solar panels. Edge portions of the panels rest on a ground support area and provide mechanical support, and an end curb member abuts at least one edge of the arrangement. The panels are interconnected in at least one series-connected string extending in at least two rows so that the string has a total distance between terminal ends of the series connection less than a lengthwise dimension of the solar panels constituting the string, routed to reduce “home run” connections at the end of the string.
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公开(公告)号：US07013834B2
公开(公告)日：2006-03-21
申请号：US10324436
申请日：2002-12-20
CPC分类号： H01J37/32082 , H01J37/32357 , H01J37/32422
摘要： A plasma treatment system for treating a workpiece with a downstream-type plasma. The processing chamber of the plasma treatment system includes a chamber lid having a plasma cavity disposed generally between a powered electrode and a grounded plate, a processing space separated from the plasma cavity by the grounded plate, and a substrate support in the processing space for holding the workpiece. A direct plasma is generated in the plasma cavity. The grounded plate is adapted with openings that remove electrons and ions from the plasma admitted from the plasma cavity into the processing space to provide a downstream-type plasma of free radicals. The openings may also eliminate line-of-sight paths for light between the plasma cavity and processing space. In another aspect, the volume of the processing chamber may be adjusted by removing or inserting at least one removable sidewall section from the chamber lid.
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公开(公告)号：US06972071B1
公开(公告)日：2005-12-06
申请号：US10030723
申请日：2000-07-10
申请人： James Scott Tyler
发明人： James Scott Tyler
CPC分类号： H01J37/32449 , H01J37/32357 , H01J37/3244
摘要： A plasma treatment system (10) and related methods for rapidly treating a workpiece (56) with ions from a plasma having an ion density that is reproducibly uniform and symmetrical. The processing chamber (12) of the plasma treatment system (10) includes a chamber (14) lid having a symmetrical array of apertures (192) and further includes a vacuum distribution baffle (180), which are both configured to uniformly disperse a process gas adjacent the surface of the workpiece (56). The uniform dispersion of process gas and a symmetrical placement of the workpiece within the chamber (12) contribute to providing a uniformly dense plasma of ions adjacent the workpiece (56). A treatment system control (304) automates the operation of the system and controls the flow of process gas, evacuation of the chamber, and the application of the plasma excitation power to minimize the length of a treatment cycle and to optimize the uniformity of the plasma treatment.
摘要翻译： 一种等离子体处理系统（10）以及用离子密度可重复地均匀和对称地等离子体快速处理工件（56）的相关方法。 等离子体处理系统（10）的处理室（12）包括具有对称阵列的孔（192）的腔室（14），并且还包括真空分配挡板（180），所述真空分配挡板（180）被构造成均匀地分散工艺 邻近工件表面的气体（56）。 工艺气体的均匀分散和工件在腔室（12）内的对称放置有助于提供邻近工件（56）的均匀致密的离子等离子体。 处理系统控制（304）使系统的操作自动化并且控制处理气体的流动，腔室的排空以及施加等离子体激发功率以最小化治疗周期的长度并优化等离子体的均匀性 治疗。
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公开(公告)号：US20100140223A1
公开(公告)日：2010-06-10
申请号：US12703812
申请日：2010-02-11
IPC分类号： C23F1/00
CPC分类号： H01J37/32082 , H01J37/32357 , H01J37/32422
摘要： A plasma treatment system for treating a workpiece with a downstream-type plasma. The processing chamber of the plasma treatment system includes a chamber lid having a plasma cavity disposed generally between a powered electrode and a grounded plate, a processing space separated from the plasma cavity by the grounded plate, and a substrate support in the processing space for holding the workpiece. A direct plasma is generated in the plasma cavity. The grounded plate is adapted with openings that remove electrons and ions from the plasma admitted from the plasma cavity into the processing space to provide a downstream-type plasma of free radicals. The openings may also eliminate line-of-sight paths for light between the plasma cavity and processing space. In another aspect, the volume of the processing chamber may be adjusted by removing or inserting at least one removable sidewall section from the chamber lid.
摘要翻译： 一种用下游式等离子体处理工件的等离子体处理系统。 等离子体处理系统的处理室包括具有通常设置在供电电极和接地板之间的等离子体空腔的室盖，通过接地板与等离子体腔分离的处理空间以及用于保持的处理空间中的基板支撑 工件。 在等离子体腔中产生直接等离子体。 接地板适于具有从等离子体空腔中进入处理空间的等离子体中的电子和离子的开口，以提供自由基的下游型等离子体。 开口还可以消除等离子体腔和处理空间之间的光线的视线路径。 在另一方面，可以通过从室盖移除或插入至少一个可拆卸的侧壁部分来调节处理室的体积。
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公开(公告)号：US08613827B2
公开(公告)日：2013-12-24
申请号：US11177575
申请日：2005-07-08
IPC分类号： C23C16/455 , C23C16/50 , C23C16/505 , C23C16/509 , C23F1/00 , H01L21/306 , C23C16/06 , C23C16/22
CPC分类号： H01J37/32082 , H01J37/32357 , H01J37/32422
摘要： A plasma treatment system for treating a workpiece with a downstream-type plasma. The processing chamber of the plasma treatment system includes a chamber lid having a plasma cavity disposed generally between a powered electrode and a grounded plate, a processing space separated from the plasma cavity by the grounded plate, and a substrate support in the processing space for holding the workpiece. A direct plasma is generated in the plasma cavity. The grounded plate is adapted with openings that remove electrons and ions from the plasma admitted from the plasma cavity into the processing space to provide a downstream-type plasma of free radicals. The openings may also eliminate line-of-sight paths for light between the plasma cavity and processing space. In another aspect, the volume of the processing chamber may be adjusted by removing or inserting at least one removable sidewall section from the chamber lid.
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公开(公告)号：US08480850B2
公开(公告)日：2013-07-09
申请号：US12703812
申请日：2010-02-11
IPC分类号： C23F1/00 , H01L21/306 , C23C16/50 , C23C16/505 , C23C16/509 , C23C16/06 , C23C16/22
CPC分类号： H01J37/32082 , H01J37/32357 , H01J37/32422
摘要： A plasma treatment system for treating a workpiece with a downstream-type plasma. The processing chamber of the plasma treatment system includes a chamber lid having a plasma cavity disposed generally between a powered electrode and a grounded plate, a processing space separated from the plasma cavity by the grounded plate, and a substrate support in the processing space for holding the workpiece. A direct plasma is generated in the plasma cavity. The grounded plate is adapted with openings that remove electrons and ions from the plasma admitted from the plasma cavity into the processing space to provide a downstream-type plasma of free radicals. The openings may also eliminate line-of-sight paths for light between the plasma cavity and processing space. In another aspect, the volume of the processing chamber may be adjusted by removing or inserting at least one removable sidewall section from the chamber lid.
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