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1.发明申请Fluorinated Silyethynyl Pentacene Compounds and Compositions and Methods of Making and Using the Same 有权氟化甲硅烷基并五苯化合物及其组合物及其制备和使用方法公开(公告)号：US20120061620A1
公开(公告)日：2012-03-15
申请号：US13318617
申请日：2010-05-28
CPC分类号： C07F7/081
摘要： Fluorinated silylethynyl pentacenes and compositions containing fluorinated silylethynyl pentacenes are disclosed. Methods of making and using fluorinated silylethynyl pentacenes and compositions containing fluorinated silylethynyl pentacenes are also disclosed.
摘要翻译： 公开了含氟化的甲硅烷基乙炔戊烯和含有氟化的甲硅烷基乙炔基并五苯的组合物。 还公开了制备和使用氟化甲硅烷基乙炔基并五苯的方法和含有氟化的甲硅烷基乙炔戊腈的组合物。
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2.发明授权Silylethynyl pentacene compounds and compositions and methods of making and using the same 有权甲基乙炔基并五苯化合物及其制备和使用方法公开(公告)号：US08956555B2
公开(公告)日：2015-02-17
申请号：US12995145
申请日：2009-05-29
申请人： Gregg Alexander Caldwell , Robert Steven Clough , James Craig Novack , David Howard Redinger , Dennis Edward Vogel , John E. Anthony , Marcia M. Payne
发明人： Gregg Alexander Caldwell , Robert Steven Clough , James Craig Novack , David Howard Redinger , Dennis Edward Vogel , John E. Anthony , Marcia M. Payne
CPC分类号： C07F7/081 , H01L51/0055 , H01L51/0094 , H01L51/0545
摘要： Silylethynyl pentacenes and compositions containing silylethynyl pentacenes are disclosed. Exemplary pentacene compounds have 6,13-silylethynyl substitution with one or more groups (e.g., R, R′ and R″) covalently bonded to each Si atom of the silylethynyl groups. Methods of making and using silylethynyl pentacenes and compositions containing silylethynyl pentacenes are also disclosed. Substrates and devices comprising the silylethynyl pentacenes and compositions are also disclosed.
摘要翻译： 公开了含甲硅烷基乙炔戊并烯的含有甲硅烷基乙炔基戊烯的组合物。 示范性并五苯化合物与一个或多个与甲硅烷基乙炔基的每个Si原子共价结合的基团（例如R，R'和R“）具有6,13-甲基乙炔基取代基。 还公开了制备和使用甲硅烷基乙炔戊烯的方法和含有甲硅烷基乙炔基戊烯的组合物。 还公开了包含甲硅烷基乙炔戊烯和组合物的底物和装置。
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3.发明申请Silylethynyl Pentacene Compounds and Compositions and Methods of Making and Using the Same 有权甲基乙炔基并五苯化合物及其组合物及其制备和使用方法公开(公告)号：US20110073813A1
公开(公告)日：2011-03-31
申请号：US12995145
申请日：2009-05-29
申请人： Gregg Alexander Caldwell , Robert Steven Clough , James Craig Novack , David Howard Redinger , Dennis Edward Vogel , John E. Anthony , Marcia M. Payne
发明人： Gregg Alexander Caldwell , Robert Steven Clough , James Craig Novack , David Howard Redinger , Dennis Edward Vogel , John E. Anthony , Marcia M. Payne
IPC分类号： H01B1/12 , C07F7/08 , C07D493/04
CPC分类号： C07F7/081 , H01L51/0055 , H01L51/0094 , H01L51/0545
摘要： Silylethynyl pentacenes and compositions containing silylethynyl pentacenes are disclosed. Exemplary pentacene compounds have 6,13-silylethynyl substitution with one or more groups (e.g., R, R′ and R″) covalently bonded to each Si atom of the silylethynyl groups. Methods of making and using silylethynyl pentacenes and compositions containing silylethynyl pentacenes are also disclosed. Substrates and devices comprising the silylethynyl pentacenes and compositions are also disclosed.
摘要翻译： 公开了含甲硅烷基乙炔戊并烯的含有甲硅烷基乙炔基戊烯的组合物。 示范性并五苯化合物与一个或多个与甲硅烷基乙炔基的每个Si原子共价结合的基团（例如R，R'和R“）具有6,13-甲基乙炔基取代基。 还公开了制备和使用甲硅烷基乙炔戊烯的方法和含有甲硅烷基乙炔基戊烯的组合物。 还公开了包含甲硅烷基乙炔戊烯和组合物的底物和装置。
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4.发明授权Fluorinated silylethynyl pentacene compounds and compositions and methods of making and using the same 有权氟化甲硅烷基乙炔并五苯化合物及其制备和使用方法公开(公告)号：US08920679B2
公开(公告)日：2014-12-30
申请号：US13318617
申请日：2010-05-28
申请人： Robert Steven Clough , Richard M. Flynn , George G. I. Moore , John E. Anthony , Marcia M. Payne
发明人： Robert Steven Clough , Richard M. Flynn , George G. I. Moore , John E. Anthony , Marcia M. Payne
CPC分类号： C07F7/081
摘要： Fluorinated silylethynyl pentacenes and compositions containing fluorinated silylethynyl pentacenes are disclosed. Methods of making and using fluorinated silylethynyl pentacenes and compositions containing fluorinated silylethynyl pentacenes are also disclosed.
摘要翻译： 公开了含氟化的甲硅烷基乙炔戊烯和含有氟化的甲硅烷基乙炔基并五苯的组合物。 还公开了制备和使用氟化甲硅烷基乙炔基并五苯的方法和含有氟化的甲硅烷基乙炔戊腈的组合物。
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公开(公告)号：US06913792B2
公开(公告)日：2005-07-05
申请号：US10870265
申请日：2004-06-17
IPC分类号： C08L71/12 , C08G65/22 , C08L25/04 , C08L51/00 , C08L51/04 , C08L63/00 , H05K1/03 , B05D3/02 , C08F2/50 , C08L25/06
CPC分类号： C08G65/22 , C08L25/06 , C08L51/003 , C08L51/04 , C08L63/00 , C08L71/12 , H05K1/0326 , C08L71/00 , C08L2666/14 , C08L2666/02
摘要： A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably high impact polystyrene (HIPS), and optionally a compatiblizer, with an uncured epoxy component, comprising a curable epoxy and an epoxy curing agent, at a temperature greater than 150° C. and without addition of solvent wherein the epoxy component of the resulting curable melt blended composition remains substantially uncured.
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公开(公告)号：US06787605B2
公开(公告)日：2004-09-07
申请号：US10319953
申请日：2002-12-16
IPC分类号： C08L6300
CPC分类号： C08G65/22 , C08L25/06 , C08L51/003 , C08L51/04 , C08L63/00 , C08L71/12 , H05K1/0326 , C08L71/00 , C08L2666/14 , C08L2666/02
摘要： A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably high impact polystyrene (HIPS), and optionally a compatiblizer, with an uncured epoxy component, comprising a curable epoxy and an epoxy curing agent, at a temperature greater than 150° C. and without addition of solvent wherein the epoxy component of the resulting curable melt blended composition remains substantially uncured.
摘要翻译： 一种可固化的熔融共混组合物和通过将包含聚苯醚（PPE）聚合物和聚苯乙烯聚合物，优选高抗冲聚苯乙烯（HIPS）和任选的增容剂）的热塑性聚合物与未固化的环氧组分熔融共混来制备该组合物的方法，包括 可固化环氧树脂和环氧固化剂，在大于150℃的温度下，并且不加入溶剂，其中所得可固化的熔融共混组合物的环氧组分保持基本上未固化。
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公开(公告)号：US06423367B1
公开(公告)日：2002-07-23
申请号：US09917543
申请日：2001-07-27
申请人： Robert Steven Clough
发明人： Robert Steven Clough
IPC分类号： B05D512
摘要： An electronic circuit device comprises a resin composition including 90 to 100 weight percent of a curable epoxy-modified aromatic vinyl-conjugated diene block copolymer, optionally up to 10 weight percent of an epoxy resin, and an effective amount of an epoxy curative, the weight percent of the copolymer and epoxy resin being based on the weight of the epoxy bearing material exclusive of curative. The resin composition can be used as an electronic adhesive, covercoat, or encapsulant. The electronic circuit device exhibits superior heat and moisture insensitivity, including the absence of voiding and delamination of the cured resin compostion from its substrate under conditions of 85° C. and 85% relative humidity for 168 hours followed by a temperature of 220° C. for 10 to 40 seconds.
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公开(公告)号：US06518362B1
公开(公告)日：2003-02-11
申请号：US09025400
申请日：1998-02-18
IPC分类号： C08L6300
CPC分类号： C08G65/22 , C08L25/06 , C08L51/003 , C08L51/04 , C08L63/00 , C08L71/12 , H05K1/0326 , C08L71/00 , C08L2666/14 , C08L2666/02
摘要： A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably high impact polystyrene (HIPS), and optionally a compatiblizer, with an uncured epoxy component, comprising a curable epoxy and an epoxy curing agent, at a temperature greater than 150° C. and without addition of solvent wherein the epoxy component of the resulting curable melt blended composition remains substantially uncured.
摘要翻译： 一种可固化的熔融共混组合物和通过将包含聚苯醚（PPE）聚合物和聚苯乙烯聚合物，优选高抗冲聚苯乙烯（HIPS）和任选的增容剂）的热塑性聚合物与未固化的环氧组分熔融共混来制备该组合物的方法，包括 可固化环氧树脂和环氧固化剂，在大于150℃的温度下，并且不加入溶剂，其中所得可固化的熔融共混组合物的环氧组分保持基本上未固化。
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9.发明授权Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer 失效包含环氧改性芳族乙烯基 - 共轭二烯嵌段共聚物的电子电路装置公开(公告)号：US06294270B1
公开(公告)日：2001-09-25
申请号：US09219265
申请日：1998-12-23
申请人： Robert Steven Clough
发明人： Robert Steven Clough
IPC分类号： H01L2912
CPC分类号： C08G59/027 , C08L63/08 , H01L23/293 , H01L2924/0002 , H01L2924/09701 , H05K3/386 , Y10S428/901 , Y10T428/12528 , Y10T428/12569 , Y10T428/31511 , Y10T428/31721 , C08L2666/22 , H01L2924/00
摘要： An electronic circuit device comprises a resin composition including 90 to 100 weight percent of a curable epoxy-modified aromatic vinyl-conjugated diene block copolymer, optionally up to 10 weight percent of an epoxy resin, and an effective amount of an epoxy curative, the weight percent of the copolymer and epoxy resin being based on the weight of the epoxy bearing material exclusive of curative. The resin composition can be used as an electronic adhesive, covercoat, or encapsulant. The electronic circuit device exhibits superior heat and moisture insensitivity, including the absence of voiding and delamination of the cured resin compostion from its substrate under conditions of 85° C. and 85% relative humidity for 168 hours followed by a temperature of 220° C. for 10 to 40 seconds.
摘要翻译： 电子电路装置包括一种树脂组合物，其包含90-100重量％的可固化环氧改性的芳族乙烯基 - 共轭二烯嵌段共聚物，任选地至多10重量％的环氧树脂和有效量的环氧固化剂，重量 共聚物和环氧树脂的百分比基于不含治疗剂的环氧树脂承载材料的重量。 树脂组合物可以用作电子粘合剂，覆盖层或密封剂。 电子电路装置表现出优异的耐热和湿度不敏感性，包括在85℃和85％相对湿度条件下168小时后温和220℃的固化树脂组合物从固化树脂组合物不存在空隙和分层。 10至40秒。
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