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公开(公告)号：US6088504A
公开(公告)日：2000-07-11
申请号：US160315
申请日：1998-09-25
CPC分类号： G02B6/4248
摘要： An in-line hermetic seal for an optical fiber which has an outer diameter and a stripped mid-section contains the stripped mid-section. A tube has an interior with a diameter larger than the outer diameter of the optical fiber and has an opening through a wall of the tube to the interior. The tube and the optical fiber having the stripped mid-section extending through the tube define an annular space therebetween. Soldering means fills the annular space. Sealing means holds the optical fiber approximately centered in ends of the tube. The stripped mid-section is contained by the tube, the sealing means and the soldering means. A method in accordance with the present invention is also described.
摘要翻译： 具有外径和剥离的中间部分的光纤的直列密封用于包含剥离的中间部分。 管具有直径大于光纤的外径的内部，并且具有通过管的壁到内部的开口。 具有延伸穿过管的剥离的中间部分的管和光纤在其间限定了环形空间。 焊接装置填充环形空间。 密封装置将光纤保持在管的端部大致中心。 剥离的中段由管，密封装置和焊接装置容纳。 还描述了根据本发明的方法。
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公开(公告)号：US6081646A
公开(公告)日：2000-06-27
申请号：US863432
申请日：1997-05-27
CPC分类号： G02B6/4248
摘要： An in-line hermetic seal for an optical fiber which has an outer diameter and a stripped mid-section contains the stripped mid-section. A tube has an interior with a diameter larger than the outer diameter of the optical fiber and has an opening through a wall of the tube to the interior. The tube and the optical fiber having the stripped mid-section extending through the tube define an annular space therebetween. Soldering means fills the annular space. Sealing means holds the optical fiber approximately centered in ends of the tube. The stripped mid-section is contained by the tube, the sealing means and the soldering means.
摘要翻译： 具有外径和剥离的中间部分的光纤的直列密封用于包含剥离的中间部分。 管具有直径大于光纤的外径的内部，并且具有通过管的壁到内部的开口。 具有延伸穿过管的剥离的中间部分的管和光纤在其间限定了环形空间。 焊接装置填充环形空间。 密封装置将光纤保持在管的端部大致中心。 剥离的中段由管，密封装置和焊接装置容纳。
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公开(公告)号：US4445980A
公开(公告)日：1984-05-01
申请号：US526480
申请日：1983-08-25
申请人： Craig G. Smith
发明人： Craig G. Smith
摘要： In traditional copper electroplating processes, soluble copper anodes are used as the source of copper. There are certain potential advantages to using nonconsumable anodes and adding a source of copper such as copper oxide to replenish the electroplating bath. Periodic reverse current plating is used by some manufacturers to obtain smoother deposits without the use of additives. This periodic reversal of current drastically reduces the service life of the nonconsumable anodes because of dissolution of the metal oxide on the insoluble anode. The invention is a copper electroplating process with a dual-element anode assembly. This assembly consists of electrically isolated copper and metal-oxide electrodes. The metal-oxide electrode is active only during the anodic part of the cycle while the copper electrode is active only during the cathodic part of the cycle. Electrical isolation is achieved by the use of diodes or relays.
摘要翻译： 在传统的铜电镀工艺中，可溶性铜阳极被用作铜的来源。 使用非消耗性阳极和添加铜源（如氧化铜）来补充电镀浴具有一定的潜在优势。 一些制造商使用定期逆向电镀来获得更平滑的沉积物而不使用添加剂。 由于金属氧化物溶解在不溶性阳极上，所以这种周期性的电流反转大大降低了非消耗性阳极的使用寿命。 本发明是一种具有双元件阳极组件的铜电镀工艺。 该组件由电隔离的铜和金属氧化物电极组成。 金属氧化物电极仅在循环的阳极部分是有效的，而铜电极仅在循环的阴极部分是有效的。 通过使用二极管或继电器实现电气隔离。
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公开(公告)号：US4310391A
公开(公告)日：1982-01-12
申请号：US105977
申请日：1979-12-21
申请人： Yutaka Okinaka , Craig G. Smith
发明人： Yutaka Okinaka , Craig G. Smith
摘要： A particular type of electrode structure is described which is useful as a counter electrode in gold plating processes. The electrode surface comprises oxides of certain group eight elements and oxides of certain valve metals. A process for preparing the electrodes is also described. Such electrodes or anodes exhibit long life and reduced undesirable side reactions in the gold plating process. For example, consumption of buffer material is greatly reduced and formation of trivalent gold is reduced.
摘要翻译： 描述了一种特定类型的电极结构，其可用作镀金工艺中的对电极。 电极表面包括某些第八组元素的氧化物和某些阀金属的氧化物。 还描述了制备电极的方法。 这种电极或阳极在镀金过程中表现出长寿命和减少不希望的副反应。 例如，缓冲材料的消耗大大降低，三价金的形成降低。
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5.发明授权Uniformity of copper etching in the fabrication of multilayer printed circuit boards 失效多层印刷电路板制造中铜蚀刻的均匀性
公开(公告)号：US5127991A
公开(公告)日：1992-07-07
申请号：US709050
申请日：1991-06-03
申请人： Sudarshan Lal , Craig G. Smith
发明人： Sudarshan Lal , Craig G. Smith
摘要： This invention is a process for etching copper sheets on insulating boards for use in fabricating multilayer printed circuit boards. The improvement resides in adding to a standard copper etching solution certain alkyltrimethyl ammonium chlorides with alkyl chain lengths ranging from 6 to 20 carbon atoms in amounts sufficient to yield intermediate kinetics behavior. Of special interest are dodecyltrimethyl ammonium chloride, hexadecyltrimethyl ammonium chloride and octadecyltrimethyl ammonium chloride present in an amount of from 0.01 to 1.0 wt %. A silicon-based antiforming agent may be added in amounts of from 0.05 to 2.0 wt. % to prevent an unacceptably large amount of foam from occurring during etching. With this formulation, the rate is mass transport controlled at low rates and almost independent of mass transport at high rates due to the inhibition of the surface reaction rate. As a result, non-uniformities in etch rates due to variations in mass transport conditions in processing equipment may be eliminated. This unique formulation could significantly improve the yields presently obtained in manufacturing as well as allow the processing of fine-line multilayer circuit boards.
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公开(公告)号：US4844608A
公开(公告)日：1989-07-04
申请号：US29040
申请日：1987-03-23
申请人： Craig G. Smith
发明人： Craig G. Smith
CPC分类号： G01N21/43 , G01N21/314
摘要： Processes are described in which solution composition is monitored by extremely accurate measurements of index of refraction involving measurement of reflectivity from a glass-solution interface. A particularly useful application is the swelling operation in metallizing polymer surfaces where dimethylformamate-water solution is contacted with the polymer surface to produce the swelling. Accurate, continuous control of the solution composition is necessary to insure optimum amount of swelling.
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公开(公告)号：US5384153A
公开(公告)日：1995-01-24
申请号：US28847
申请日：1993-03-10
申请人： Alfred J. Grady, Jr. , Sudarshan Lal , Mary J. Mitchell , Yutaka Okinaka , Craig G. Smith , Harvey S. Trop , Chwan-Tsann Wang
发明人： Alfred J. Grady, Jr. , Sudarshan Lal , Mary J. Mitchell , Yutaka Okinaka , Craig G. Smith , Harvey S. Trop , Chwan-Tsann Wang
CPC分类号： C23C18/1683 , C23C18/1675 , H05K3/187
摘要： Disclosed is a method of monitoring electroless plating solutions. The solutions are used to plate a light-transmitting medium. Measurements are made to determine the time it takes for light transmission through the medium to be reduced to a certain level. This measurement can be used to determine whether articles will be sufficiently plated by the solutions.
摘要翻译： 公开了一种监测化学镀溶液的方法。 解决方案用于平板透光介质。 进行测量以确定通过介质的光透射所需的时间减少到一定水平。 该测量可用于确定物品是否将被溶液充分镀覆。
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公开(公告)号：US4269670A
公开(公告)日：1981-05-26
申请号：US126840
申请日：1980-03-03
申请人： Craig G. Smith
发明人： Craig G. Smith
CPC分类号： C25C7/02 , C25B11/0478 , C25D17/10 , C25D3/48
摘要： An electrochemical process is described in which a particular kind of electrode is used. The electrode surface is made up of certain types of oxides. A process for preparing the electrodes is also described. Such electrodes exhibit long life and are highly efficient in that reduced electropotential is observed. This property is particularly advantageous in that it reduces power consumption for the electrochemical process and reduces undesirable side reactions in the electrochemical process. Particular processes where this electrode is useful are electrodeposition of metals such as gold, copper, nickel, and palladium, the production of chlorine and oxygen by electrolysis, electrolytic loading of electrodes for batteries, and production of electricity in fuel cells.
摘要翻译： 描述了使用特定种类的电极的电化学方法。 电极表面由某些类型的氧化物组成。 还描述了制备电极的方法。 这样的电极具有长寿命并且是高效的，因为观察到降低的电位。 该特性是特别有利的，因为它降低了电化学过程的功耗并减少了电化学过程中的不期望的副反应。 该电极有用的具体方法是电沉积诸如金，铜，镍和钯的金属，通过电解产生氯和氧，电解电极的电解负载以及在燃料电池中产生电。
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公开(公告)号：USH36H
公开(公告)日：1986-03-04
申请号：US717601
申请日：1985-04-01
申请人： Craig G. Smith
发明人： Craig G. Smith
IPC分类号： C25D21/14
CPC分类号： C25D21/14
摘要： The invention comprises improvements in inert anode electroplating processes that make possible the utilization of typically inexpensive and otherwise advantageous cation-yielding compounds for replenishing the plating bath, compounds that typically are not well suited for such use in prior art systems due to their relatively low dissolution rate which typically requires their use in powder form, and the tendency of the powder particles to aggregate. Exemplary applications for the improved plating process are in Cu-, Ni-, and Pd-plating, and exemplary cation-yielding compounds or CuO, NiO, PdO, Cu(OH).sub.2,Ni(OH).sub.2, and Pd(OH).sub.2. The improvements according to the invention comprise agitating the powder/electrolyte mixture or slurry in a reactor vessel separate from the plating tank, and maintaining the cation concentration in the plating tank within predetermined limits. Agitation typically requires power input to the slurry of at least about 2.5 watt/liter of slurry, with a preferred range of power for CuO of about 10 .mu.m average particle size and concentration between about 5 and about 200 gram/liter being between about 5 and about 200 watt/liter of slurry. Schemes for maintaining the cation concentration in the plating bath within predetermined limits are described, and include controlling the rate of addition of cation-yielding compound to the slurry, and/or controlling the flow rate of electrolyte between reactor and plating tank.
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公开(公告)号：US4469564A
公开(公告)日：1984-09-04
申请号：US407151
申请日：1982-08-11
摘要： A copper electroplating process is described in which the anode is surrounded by a cation-permeable membrane so as to prevent decomposition of additives in the electrochemical bath. Such a feature adds to bath lifetime and permits better control of bath chemistry and plating quality during the electroplating process. The feature is especially advantageous for copper electroplating processes using nonconsumable electrodes because of the high consumption of additives and that the copper can be added to the cathode side of the membrane so that acid copper ions need not pass through the membrane.
摘要翻译： 描述了一种铜电镀工艺，其中阳极被阳离子可渗透膜包围，以防止电化学浴中的添加剂分解。 这样的特征增加了浴的寿命，并且允许在电镀过程中更好地控制浴化学和电镀质量。 该特征对于使用非消耗性电极的铜电镀工艺是特别有利的，因为添加剂的消耗量高，并且可以将铜添加到膜的阴极侧，使得酸性铜离子不需要通过膜。
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