摘要:
The concentration of the active ingredient in a rolling oil emulsion can be rapidly determined, and correction of the concentration of the active ingredient can be undertaken by measuring the measuring the amount of light reflected from the emulsion at the peak absorbing wavelength of the dye to obtain a first reflectance value and measuring the amount of light reflected from said emulsion at a wavelength other than the peak absorbing wavelength of the dye to obtain a second reflectance value for at least two different concentrations of the rolling oil in the rolling oil emulsion, establishing a calibration curve, and then monitoring the rolling oil emulsion in like manner. The results may be utilized to feed additional additive to the emulsion, or may be used to feed water into the emulsion system.
摘要:
An adhesive composition for a insect-control agent, such as gypsy moth pheromone beads, provides retention and water insolubility to such pesticide upon deposit of an aqueous mixture of such adhesive composition and insect-control agent. The adhesive composition concentrate comprises a salt such as sodium sulfate, an ethoxylated alkylphenol, a polymeric adhesive material, and a high molecular weight acrylate polymer.
摘要:
A concentrated lapping composition having the following makeup:______________________________________ Ingredient % by Weight ______________________________________ Finely divided inorganic 5-70 abrasive Carboxylic acid dispersant 0.1-1 polymer having a molecular weight of from 500-50,000 Lubricant 0.5-29 ______________________________________ said lapping composition having its pH adjusted to greater than 8.5 in order to afford an improved lapping rate.
摘要:
New and useful silica sols especially suitable for polishing semiconductor wafers are prepared by a special process involving heating a broad distribution aqueous silica sol containing larger silica particles of which at least 50% in number have a particle size of at least 40 millimicrons, the remainder of the silica particles being smaller and of different sizes, whereby the resultant silica sol contains a number of the larger silica particles having a particle size of at least 40 millimicrons which is at least as great as the starting sol, the weight average of said larger silica particles is greater than that of the larger silica particles in the starting sol, the number of smaller particles is less than the number of smaller particles in the starting sol, and the resultant sol contains fewer particles of different sizes than the starting sol.
摘要:
Superiority in retained slide angle of antiskid paper is achieved by spraying the paper with a composition of matter consisting essentially of an acrylamide, glycerine, balance antiskid aqueous silica sol.
摘要:
Composition of matter and method of cleaning silicon wafers; the composition of matter is an aqueous solution of potassium hydroxide and a nitrogen-containing compound, preferably tetramethylammonium hydroxide. The wafer is immersed in the solution, rinsed and dried.
摘要:
Chemical complexing compounds such as salts of aminotrimethylene phosphonic acid or ethylenediamine tetracetic acid are added to alkali-stabilized silica sols in order to promote rapid and complete re-saturation of alumino-silicate fiber insulation previously formed and dried using colloidal silica products.
摘要:
Large particle aqueous silica sols are prepared in a single step by heating an alkaline aqueous slica sol containing smaller silica particles mixed with larger silica particles while maintaining the ratio of the total surface area of the smaller silica particles to the total surface area of the larger silica particles at a predetermined ratio and under conditions such that the smaller silica particles dissolve and redeposit on the larger silica particles thereby producing an aqueous silica sol in which the majority of the silica particles have a size significantly larger than the larger silica particles in the starting mixed sol.
摘要:
Antistatically modified fixturing cements useful in the polishing of silicon wafers are disclosed. The fixturing adhesives disclosed generally comprise:(a) a solvent carrier having a boiling point no greater than 200.degree. F. under a vacuum of 25 inches of mercury;(b) a fixturing adhesive soluble in the solvent carrier; and,(c) an antistatic agent.
摘要:
A lubricating composition for use in slicing or cutting silicon wafers. The composition includes a soap, a phosphorous containing compound, and an ethylene oxide-propylene oxide polymer. The phosphorous compound is a low temperature, extreme pressure lubricant. The ethylene oxide propylene oxide polymer is a high temperature, extreme pressure lubricant. Suitable soaps include C6-C18 fatty acids reacted with triethanolamine or aminoethanolamine. Additionally, biocides or fungicides may be added. Also an antifoam and a complexing aid such as EDTA may be used.