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    BRIDGE APPARATUS AND METHOD FOR SEMICONDUCTOR DIE TRANSFER
    4.
    发明公开
    BRIDGE APPARATUS AND METHOD FOR SEMICONDUCTOR DIE TRANSFER 审中-公开

    公开(公告)号：US20230411185A1

    公开(公告)日：2023-12-21

    申请号：US17824887

    申请日：2022-05-25

    申请人： Rohinni, LLC

    发明人： Nicholas Steven Busch ,  Justin Wendt

    IPC分类号： H01L21/67 ,  H01L21/683

    CPC分类号： H01L21/67132 ,  H01L21/6836 ,  H01L21/67144

    摘要： An apparatus for transferring a semiconductor die (“die”) from the first substrate to the second substrate. The apparatus includes a stage configured to hold a product substrate. A bridge holds a transfer mechanism assembly and a die substrate holder configured to hold the first substrate. A controller is configured to cause the bridge and the transfer mechanism assembly and the die substrate holder to move to align the transfer mechanism assembly with the die on the first substrate with a transfer position on the second substrate where the die is to be transferred.

    Method and Apparatus to Increase Transfer Speed of Semiconductor Devices With Micro-Adjustment
    6.
    发明申请
    Method and Apparatus to Increase Transfer Speed of Semiconductor Devices With Micro-Adjustment 有权

    公开(公告)号：US20210375656A1

    公开(公告)日：2021-12-02

    申请号：US17402987

    申请日：2021-08-16

    申请人： Rohinni, LLC

    发明人： Andrew Huska ,  Justin Wendt ,  Luke Dupin ,  Cody Peterson

    IPC分类号： H01L21/677 ,  H01L21/683 ,  H01L21/67

    摘要： An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.

    Method of dampening a force applied to an electrically-actuatable element
    7.
    发明授权
    Method of dampening a force applied to an electrically-actuatable element 有权

    公开(公告)号：US11069551B2

    公开(公告)日：2021-07-20

    申请号：US16200419

    申请日：2018-11-26

    申请人： Rohinni, LLC

    发明人： Justin Wendt ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow ,  Andrew Huska

    IPC分类号： H05K3/20 ,  H01L21/677 ,  H01L23/544 ,  H01L21/683 ,  H01L21/687

    摘要： A method of dampening a force applied to an electrically-actuatable element during a transfer of the electrically-actuatable element from a first side of a first substrate to a second substrate. The method includes positioning a needle adjacent a second side of the first substrate opposite the first side of the first substrate. The needle is moved via a needle actuator to a position at which the needle presses on the second side of the first substrate to press the electrically-actuatable element into contact with the second substrate disposed adjacent the first side of the first substrate. A force applied to the electrically-actuatable element is dampened when the needle presses the electrically-actuatable element into contact with the second substrate.

    METHOD AND APPARATUS FOR EMBEDDING SEMICONDUCTOR DEVICES
    8.
    发明申请
    METHOD AND APPARATUS FOR EMBEDDING SEMICONDUCTOR DEVICES 审中-公开

    公开(公告)号：US20190267265A1

    公开(公告)日：2019-08-29

    申请号：US16412641

    申请日：2019-05-15

    申请人： Rohinni, LLC

    发明人： Cody Peterson ,  Andrew Huska ,  Justin Wendt

    IPC分类号： H01L21/67 ,  H01L23/00 ,  H01L21/68 ,  H01L33/00 ,  H01L21/683 ,  G02F1/1335 ,  H01L33/54 ,  B32B37/00

    摘要： An apparatus includes a product substrate having a transfer surface, and a semiconductor die defined, at least in part, by a first surface adjoined to a second surface that extends in a direction transverse to the first surface. The transfer surface includes ripples in a profile thereof such that an apex on an individual ripple is a point on a first plane and a trough on the individual ripple is a point on a second plane. The semiconductor die is disposed on the transfer surface between the first plane and the second plane such that the second surface of the semiconductor die extends transverse to the first plane and the second plane.