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公开(公告)号：US09790606B2
公开(公告)日：2017-10-17
申请号：US14556154
申请日：2014-11-30
发明人： Koichi Yomogida
CPC分类号： C25D3/48 , C23C22/05 , C23C22/60 , C23F11/10 , C23F11/161 , C25D5/48 , H05K3/282 , H05K2203/122
摘要： To provide a surface treatment solution and treatment method for gold or gold alloy plating that effectively suppresses corrosion of underlying metal or substrate metal from pinholes that develop on the gold or gold alloy plating film.[Solution] A surface treatment solution containing a disulfide compound is brought into contact with a gold or gold alloy plating film. A compound represented by the following formula (2) is preferred as the disulfide compound. X1O3S—R3—S—S—R4—SO3X2 (2) in the formula, R3 and R4 independently represent a linear or branched alkylene group having from 1 to 10 carbon atoms, cyclic alkylene group having from 3 to 10 carbon atoms, or phenylene group, R3 and R4 independently may be substituted by one or more substituents selected from an alkyl group, halogen atom, hydroxyl group, or alkoxy group, and X1 and X2 represent monovalent cations.
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公开(公告)号：US20170002211A1
公开(公告)日：2017-01-05
申请号：US15157453
申请日：2016-05-18
发明人： Yoko Mizuno , Makoto Kondo , Koichi Yomogida , Toshiyuki Morinaga
IPC分类号： C09D5/08 , H01L21/288 , C23C26/00 , C25D5/48 , C09D179/04 , C09D7/12
CPC分类号： C09D5/08 , C07D233/00 , C07D233/02 , C07D333/04 , C08G59/00 , C08G73/0616 , C08K3/32 , C08K5/00 , C08K5/3462 , C08K2003/324 , C09D7/61 , C09D179/04 , C23C26/00 , C25D3/38 , C25D3/48 , C25D3/62 , C25D5/12 , C25D5/48 , C25D7/00 , C25D11/246 , H01L21/288 , H05K1/00 , H05K1/0346 , H05K3/00
摘要： A composition containing a cationic polymer obtained from a reaction product of nitrogen-containing heterocyclic compound and epihalohydrin; and a phosphorus compound. The composition can be used as a surface treatment for gold or gold alloy. The composition can seal pinholes on the surface of the gold or gold alloy.
摘要翻译： 含有由含氮杂环化合物与表卤代醇反应产物得到的阳离子聚合物的组合物; 和磷化合物。 该组合物可用作金或金合金的表面处理。 该组合物可以密封金或金合金表面上的针孔。
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公开(公告)号：US09914838B2
公开(公告)日：2018-03-13
申请号：US15157453
申请日：2016-05-18
发明人： Yoko Mizuno , Makoto Kondo , Koichi Yomogida , Toshiyuki Morinaga
IPC分类号： B05D5/12 , C09D5/08 , H05K1/03 , H05K3/00 , C07D333/04 , C25D3/38 , C08K5/3462 , C07D233/02 , C25D11/24 , C09D7/12 , C09D179/04 , C23C26/00 , C25D5/48 , H01L21/288 , C08G73/06 , C08G59/00 , H05K1/00 , C07D233/00 , C08K5/00 , C08K3/32 , C25D5/12
CPC分类号： C09D5/08 , C07D233/00 , C07D233/02 , C07D333/04 , C08G59/00 , C08G73/0616 , C08K3/32 , C08K5/00 , C08K5/3462 , C08K2003/324 , C09D7/61 , C09D179/04 , C23C26/00 , C25D3/38 , C25D3/48 , C25D3/62 , C25D5/12 , C25D5/48 , C25D7/00 , C25D11/246 , H01L21/288 , H05K1/00 , H05K1/0346 , H05K3/00
摘要： A composition containing a cationic polymer obtained from a reaction product of nitrogen-containing heterocyclic compound and epihalohydrin; and a phosphorus compound. The composition can be used as a surface treatment for gold or gold alloy. The composition can seal pinholes on the surface of the gold or gold alloy.
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