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    Stacked cold plate with flow guiding vanes and method of manufacturing
    1.
    发明授权
    Stacked cold plate with flow guiding vanes and method of manufacturing 有权

    公开(公告)号：US11723173B1

    公开(公告)日：2023-08-08

    申请号：US17702752

    申请日：2022-03-23

    Applicant: Rolls-Royce Corporation

    Inventor： Shuai Wang ,  Chandana J. Gajanayake ,  David R. Trawick

    IPC: F01D25/12 ,  H05K7/20

    CPC classification number: H05K7/20254 ,  F01D25/12 ,  F05D2220/70 ,  F05D2260/213

    Abstract: A cold plate assembly for cooling an electronic device includes a manifold, a comb insert, and a first vaned plate. The manifold is formed to define a cavity therein. The comb insert is located in the cavity includes channels defined by walls for receiving a fluid from passages in the manifold and transferring heat to the fluid. The first vaned plate includes a first panel and first channel vanes extending away from the first panel. The first vaned plate is removably coupled with the comb insert such that first channel vanes are located within the channels to guide the fluid. Each first channel vane extends from a wall toward a neighboring wall at an angle to direct the fluid to impinge upon the neighboring wall with increased velocity so as to increase the heat transfer between the neighboring wall and the fluid.

    Multilayer electronic components with soldered through holes
    2.
    发明授权
    Multilayer electronic components with soldered through holes 有权

    公开(公告)号：US11876364B2

    公开(公告)日：2024-01-16

    申请号：US17688469

    申请日：2022-03-07

    Applicant: Rolls-Royce Corporation

    Inventor： Shuai Wang ,  Chandana J. Gajanayake ,  David R. Trawick

    IPC: H02G5/00

    CPC classification number: H02G5/005

    Abstract: An electrical assembly, such as a multi-layer bus bar, includes an electrical connection pin and a plurality of electrically conductive layers. Each of the electrically conductive layers is formed to define a cutout therein to receive the electrical connection pin and allow access for joining material to join the electrical connection pin with the plurality of electrically conductive layers. Each of the cutouts is formed to include a first through hole arranged around the electrical connection pin and a second through hole located radially outward of the first through hole.

    STACKED COLD PLATE WITH FLOW GUIDING VANES HAVING THROUGH HOLES AND METHOD OF MANUFACTURING
    5.
    发明公开
    STACKED COLD PLATE WITH FLOW GUIDING VANES HAVING THROUGH HOLES AND METHOD OF MANUFACTURING 审中-公开

    公开(公告)号：US20230309260A1

    公开(公告)日：2023-09-28

    申请号：US17702753

    申请日：2022-03-23

    Applicant: Rolls-Royce Corporation

    Inventor： Shuai Wang ,  Chandana J. Gajanayake ,  David R. Trawick

    IPC: H05K7/20

    CPC classification number: H05K7/20254

    Abstract: A cold plate assembly for cooling an electronic device includes a manifold, a comb insert, and a plurality of vanes. The manifold is formed to define a cavity therein. The comb insert is located in the cavity and formed to include channels for receiving a fluid from cooling passages in the manifold and transfer heat to the fluid. The plurality of vanes are removably coupled with the comb insert and are located in the channels to guide the fluid through channels. The vanes extend between walls that define the channels. Each vane is formed to define a throughhole formed therein to direct the fluid at the first wall or the second wall with increased velocity so as to increase the heat transfer between the fluid and the first wall or the second wall.

    MULTILAYER ELECTRONIC COMPONENTS WITH SOLDERED THROUGH HOLES
    6.
    发明公开
    MULTILAYER ELECTRONIC COMPONENTS WITH SOLDERED THROUGH HOLES 审中-公开

    公开(公告)号：US20230283057A1

    公开(公告)日：2023-09-07

    申请号：US17688469

    申请日：2022-03-07

    Applicant: Rolls-Royce Corporation

    Inventor： Shuai Wang ,  Chandana J. Gajanayake ,  David R. Trawick

    IPC: H02G5/00

    CPC classification number: H02G5/005

    Abstract: An electrical assembly, such as a multi-layer bus bar, includes an electrical connection pin and a plurality of electrically conductive layers. Each of the electrically conductive layers is formed to define a cutout therein to receive the electrical connection pin and allow access for joining material to join the electrical connection pin with the plurality of electrically conductive layers. Each of the cutouts is formed to include a first through hole arranged around the electrical connection pin and a second through hole located radially outward of the first through hole.

    VARIABLE LENGTH WIRE HARNESS FOR ELECTRONIC DEVICES
    8.
    发明申请
    VARIABLE LENGTH WIRE HARNESS FOR ELECTRONIC DEVICES 有权

    公开(公告)号：US20240380168A1

    公开(公告)日：2024-11-14

    申请号：US18144423

    申请日：2023-05-08

    Applicant: Rolls-Royce Corporation

    Inventor： David R. Trawick

    IPC: H01R24/28 ,  H01R13/405

    Abstract: A method of assembling a wire harness adapted for use with a piece of electrical equipment includes several steps. The wire harness includes a plurality of wires, a plurality of connector pins, and an electrical connector. The electrical connector is configured to be coupled to the piece of electrical equipment.

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