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公开(公告)号：USRE45842E1
公开(公告)日：2016-01-12
申请号：US13463087
申请日：2012-05-03
CPC分类号： H05K3/244 , B23K35/007 , C23C18/42 , C23C18/54 , H05K2203/073
摘要： A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
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公开(公告)号：USRE45881E1
公开(公告)日：2016-02-09
申请号：US13463110
申请日：2012-05-03
摘要： A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant electromigration.
摘要翻译： 公开了一种用于增强金属表面的可焊性的方法，其中金属表面在焊接之前镀有浸银板，该浸渍银板用选自脂肪胺，脂肪酰胺，季铵盐 ，间苯二甲酸盐，树脂胺，树脂酰胺，脂肪酸，树脂酸，上述任何一种的乙氧基化衍生物，以及任何上述物质的混合物。 所产生的沉浸银沉积物是电阻迁移。
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公开(公告)号：USRE45297E1
公开(公告)日：2014-12-23
申请号：US13371848
申请日：2012-02-13
摘要： A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
摘要翻译： 公开了一种用于增强金属表面的可焊性的方法，其中金属表面在焊接之前镀有浸银板，该浸渍银板用选自脂肪胺，脂肪酰胺，季铵盐的添加剂 ，间苯二甲酸盐，树脂胺，树脂酰胺，脂肪酸，树脂酸，上述任何一种的乙氧基化衍生物，以及任何上述物质的混合物。 所产生的沉浸银沉积物抵抗电迁移。
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公开(公告)号：US07267259B2
公开(公告)日：2007-09-11
申请号：US10456329
申请日：2003-06-06
申请人： Ronald Redline , David Sawoska , Peter Kukanskis
发明人： Ronald Redline , David Sawoska , Peter Kukanskis
CPC分类号： H05K3/244 , B23K35/007 , C23C18/54
摘要： A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
摘要翻译： 公开了一种用于增强金属表面的可焊性的方法，其中金属表面在焊接之前镀有浸银板，该浸渍银板用选自脂肪胺，脂肪酰胺，季铵盐 ，间苯二甲酸盐，树脂胺，树脂酰胺，脂肪酸，树脂酸，上述任何一种的乙氧基化衍生物，以及任何上述物质的混合物。 所产生的沉浸银沉积物抵抗电迁移。
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公开(公告)号：US06444109B1
公开(公告)日：2002-09-03
申请号：US09698370
申请日：2000-10-26
申请人： Ronald Redline , David Sawoska , Peter Kukanskis
发明人： Ronald Redline , David Sawoska , Peter Kukanskis
IPC分类号： C25D554
CPC分类号： H05K3/244 , B23K35/007 , C23C18/42
摘要： A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, ampihateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
摘要翻译： 公开了一种用于增强金属表面的可焊性的方法，其中金属表面在焊接之前镀有浸银板，该浸渍银板用选自脂肪胺，脂肪酰胺，季铵盐 ，淀粉盐，树脂胺，树脂酰胺，脂肪酸，树脂酸，上述任何一种的乙氧基化衍生物，以及任何上述物质的混合物。 所产生的沉浸银沉积物抵抗电迁移。
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公开(公告)号：US06200451B1
公开(公告)日：2001-03-13
申请号：US09251641
申请日：1999-02-17
申请人： Ronald Redline , David Sawoska , Peter Kukanskis
发明人： Ronald Redline , David Sawoska , Peter Kukanskis
IPC分类号： C25D554
CPC分类号： H05K3/244 , B23K35/007 , C23C18/42
摘要： A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
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公开(公告)号：US06905587B2
公开(公告)日：2005-06-14
申请号：US10341859
申请日：2003-01-14
申请人： Ronald Redline , David Sawoska , Peter Kukanskis
发明人： Ronald Redline , David Sawoska , Peter Kukanskis
摘要： A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
摘要翻译： 公开了一种用于增强金属表面的可焊性的方法，其中金属表面在焊接之前镀有浸银板，该浸渍银板用选自脂肪胺，脂肪酰胺，季铵盐 ，间苯二甲酸盐，树脂胺，树脂酰胺，脂肪酸，树脂酸，上述任何一种的乙氧基化衍生物，以及任何上述物质的混合物。 所产生的沉浸银沉积物抵抗电迁移。
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公开(公告)号：US06544397B2
公开(公告)日：2003-04-08
申请号：US09821205
申请日：2001-03-29
申请人： Ronald Redline , David Sawoska , Peter Kukanskis
发明人： Ronald Redline , David Sawoska , Peter Kukanskis
IPC分类号： C25D554
摘要： A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
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公开(公告)号：US06585904B2
公开(公告)日：2003-07-01
申请号：US09784242
申请日：2001-02-15
申请人： Peter Kukanskis , Dennis Fritz , Frank Durso , Steven Castaldi , David Sawoska
发明人： Peter Kukanskis , Dennis Fritz , Frank Durso , Steven Castaldi , David Sawoska
IPC分类号： H01B1300
CPC分类号： H01C17/24 , H01C17/242 , H05K1/167 , H05K3/027 , H05K3/064 , H05K3/184 , H05K2201/0344 , H05K2203/0315 , H05K2203/107 , H05K2203/1105 , H05K2203/1453 , H05K2203/171
摘要： A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
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10.发明申请公开(公告)号：US20080003351A1
公开(公告)日：2008-01-03
申请号：US11899256
申请日：2007-09-04
申请人： Peter Kukanskis , Dennis Fritz , Frank Durso , Steven Castaldi , David Sawoska
发明人： Peter Kukanskis , Dennis Fritz , Frank Durso , Steven Castaldi , David Sawoska
IPC分类号： H05K3/06
CPC分类号： H01C17/24 , H01C17/242 , H05K1/167 , H05K3/027 , H05K3/064 , H05K3/184 , H05K2201/0344 , H05K2203/0315 , H05K2203/107 , H05K2203/1105 , H05K2203/1453 , H05K2203/171
摘要： A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
摘要翻译： 揭示了一种工艺，其中电阻器可以通过将电阻器电镀到绝缘基板上而与印刷电路板一体制造。 作为用于改善镀覆电阻器的均匀性和一致性的技术，讨论了绝缘衬底通过电镀电阻器的蚀刻和氧化的均匀化。 还公开了修整和烘烤作为用于调节和稳定电镀电阻器的电阻的方法。
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