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公开(公告)号:US12058881B2
公开(公告)日:2024-08-06
申请号:US17318026
申请日:2021-05-12
发明人: Dong Hyeon Lee , Jong In Ahn , Chang Moo Lee
IPC分类号: H10K50/842 , H10K71/00
CPC分类号: H10K50/8426 , H10K71/00
摘要: A display device includes: a window; a display panel disposed on a rear surface of the window; an adhesive layer disposed between the window and the display panel and attaching the display panel to the window; and a protruding structure that protrudes from the rear surface of the window and includes a first surface facing the adhesive layer.
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公开(公告)号:US11271191B2
公开(公告)日:2022-03-08
申请号:US16845417
申请日:2020-04-10
发明人: Kang-Woo Lee , Sun Hee Oh , Boo-Kan Ki , Dong Hyeon Lee , Jeong In Lee
摘要: A display device includes: a display panel including a flat area and a bended area which extends bent from the flat area; and a cover panel comprises a heat dissipation member. The heat dissipation member includes: a flat portion corresponding to the flat area of the display panel, a bent portion corresponding to the bended area of the display panel, a first opening in the flat portion, and a second opening in the bent portion.
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公开(公告)号:US09658475B2
公开(公告)日:2017-05-23
申请号:US14320746
申请日:2014-07-01
发明人: Dong Hoon Kim , Dong Hyeon Lee , Seung Hwan Baek , Ju Young Yoon , Han Moe Cha , Young Jun Choi
IPC分类号: G02F1/01 , H01L33/50 , G02F1/1335 , B82Y20/00
CPC分类号: G02F1/0105 , B82Y20/00 , G02F1/133602 , G02F1/133603 , G02F1/133606 , G02F2001/133614 , G02F2202/10 , G02F2202/36 , H01L33/504 , Y10S977/95
摘要: A backlight assembly includes a light source portion including a plurality of light sources. The light sources are configured to emit light. A wavelength conversion member is disposed on the light source portion. The wavelength conversion member is configured to convert a wavelength of light emitted from the light source portion. The wavelength conversion member includes a first substrate disposed on the light source portion, a second substrate disposed on the first substrate, and a plurality of wavelength conversion layers interposed between the first substrate and the second substrate. Each of the plurality of wavelength conversion layers correspond to a light source of the plurality of light sources.
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公开(公告)号:US20150234111A1
公开(公告)日:2015-08-20
申请号:US14295029
申请日:2014-06-03
发明人: Dong Hyeon Lee , Jun Woo You , Dong Hoon Kim , Seung Hwan Baek
IPC分类号: F21V8/00 , G02F1/1335 , F21V23/00 , F21K99/00
CPC分类号: G02F1/1336 , G02B6/0023 , G02B6/0091
摘要: A backlight unit includes a light guide plate (LGP), one or more light-emitting devices disposed to face a side of the LGP and configured to generate light, a circuit board electrically connected to the one or more light-emitting devices, a quantum dot bar interposed between the LGP and the one or more light-emitting devices and configured to convert a wavelength of light, and a housing configured to house the one or more light-emitting devices, the circuit board and the quantum dot bar, and comprising first and second open end portions and an open side portion through which a portion of the LGP is inserted. The backlight unit further includes first and second covers covering the first and second open end portions of the housing, respectively, and coupled to the housing. The first cover and the second cover respectively include a first coupling portion and a second coupling portion which are coupled to first and second ends of the quantum dot bar, respectively.
摘要翻译: 背光单元包括导光板(LGP),一个或多个发光装置,其设置成面对LGP的一侧并被配置为产生光;电连接到一个或多个发光器件的电路板,量子 插入在所述LGP和所述一个或多个发光器件之间并且被配置为转换光的波长的点划线以及被配置为容纳所述一个或多个发光器件,所述电路板和所述量子点棒的壳体,并且包括 第一和第二开口端部以及开放侧部分,LGP的一部分穿过该开口侧部分插入。 背光单元还包括分别覆盖壳体的第一和第二开口端部分并联接到壳体的第一和第二盖。 第一盖和第二盖分别包括耦合到量子点棒的第一和第二端的第一耦合部分和第二耦合部分。
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公开(公告)号:US11953958B2
公开(公告)日:2024-04-09
申请号:US18079832
申请日:2022-12-12
发明人: Kang Woo Lee , Boo Kan Ki , June Hyoung Park , Sun Hee Oh , Dong Hyeon Lee , Jeong In Lee , Hyuk Hwan Kim , Seong Sik Choi
CPC分类号: G06F1/203 , G06F3/0412 , H05K7/20963 , H10K50/87
摘要: A display includes: a display panel; and a panel bottom sheet disposed below the display panel, the panel bottom sheet including: a first heat dissipation layer; a second heat dissipation layer over the first heat dissipation layer, including a first opening formed completely through the second heat dissipation layer in a thickness direction; a heat dissipation coupling interlayer between the first heat dissipation layer and the second heat dissipation layer, and a heat dissipation substrate on the second heat dissipation layer.
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公开(公告)号:US11526201B2
公开(公告)日:2022-12-13
申请号:US16924030
申请日:2020-07-08
发明人: Kang Woo Lee , Boo Kan Ki , June Hyoung Park , Sun Hee Oh , Dong Hyeon Lee , Jeong In Lee , Hyuk Hwan Kim , Seong Sik Choi
摘要: A panel bottom sheet includes: a first heat dissipation layer; a second heat dissipation layer having circumferential side surfaces located further inside than circumferential side surfaces of the first heat dissipation layer in a plan view, the second heat dissipation layer including: a main heat dissipation pattern including a first opening formed completely through the second heat dissipation layer in a thickness direction; and a heat dissipation substrate disposed directly on the second heat dissipation layer.
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公开(公告)号:US09645305B2
公开(公告)日:2017-05-09
申请号:US14309593
申请日:2014-06-19
发明人: Jin Seo , Dong Hoon Kim , Seul Gi Kim , Dong Hyeon Lee
CPC分类号: G02B6/0088 , G02B6/0023 , G02B6/0091
摘要: A backlight unit includes a light source, a light guiding plate disposed on a side of the light source to guide light, a quantum dot bar disposed between the light source and the light guiding plate and spaced apart from the light source and the light guiding plate, the quantum dot bar for performing wavelength conversion of light, and a quantum dot bar receiving unit disposed on lower surfaces of the quantum dot bar and the light guiding plate, wherein the quantum dot bar is seated on the quantum dot bar receiving unit, and the light guiding plate is mounted on the quantum dot bar receiving unit, and wherein the quantum dot bar receiving unit and the light guiding plate are coupled to each other.
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公开(公告)号:US11262967B2
公开(公告)日:2022-03-01
申请号:US16908813
申请日:2020-06-23
发明人: Byoung Dae Ye , Jun Woo You , Dong Hyeon Lee , Tae Ho Lee
IPC分类号: G06F3/14 , H01L51/52 , G09G3/3266 , G09F9/302 , G09G3/3275
摘要: A display device includes, a substrate, a pixel circuit disposed on the substrate, a light emitting element connected to the pixel circuit and, that emits light toward the substrate, an encapsulation layer that covers the light emitting element, and a panel driver disposed on the encapsulation layer and electrically connected to the pixel circuit through a via line that penetrates the encapsulation layer.
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公开(公告)号:US11256137B2
公开(公告)日:2022-02-22
申请号:US17102129
申请日:2020-11-23
发明人: Dong Hyeon Lee , Young Min Park
IPC分类号: G02F1/00 , G02F1/13357 , G02F1/1335
摘要: A backlight unit and a display device are disclosed. The backlight unit includes a substrate, light sources, a side mold, a resin layer, and an optical member. The light sources are disposed on a surface of the substrate. The side mold is fixed to the substrate and surrounds the light sources. The resin layer fills a region defined by the side mold. The optical member is disposed on the resin layer. A first height of the side mold measured from the surface of the substrate is greater than a second height of the resin layer measured from the surface of the substrate. The display device includes the backlight unit and a display panel disposed on the backlight unit. Manufacture of the unit includes forming the substrate with the light units disposed on the surface, attaching the side mold to the substrate, and forming the resin layer and the optical member.
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公开(公告)号:US20210034121A1
公开(公告)日:2021-02-04
申请号:US16924030
申请日:2020-07-08
发明人: Kang Woo Lee , Boo Kan Ki , June Hyoung Park , Sun Hee Oh , Dong Hyeon Lee , Jeong In Lee , Hyuk Hwan Kim , Seong Sik Choi
摘要: A panel bottom sheet includes: a first heat dissipation layer; a second heat dissipation layer having circumferential side surfaces located further inside than circumferential side surfaces of the first heat dissipation layer in a plan view, the second heat dissipation layer including: a main heat dissipation pattern including a first opening formed completely through the second heat dissipation layer in a thickness direction; and a heat dissipation substrate disposed directly on the second heat dissipation layer.
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