MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND BOARD FOR MOUNTING THE SAME
    1.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND BOARD FOR MOUNTING THE SAME 有权
    多层陶瓷电子元件及其制造方法及其安装板

    公开(公告)号:US20150041194A1

    公开(公告)日:2015-02-12

    申请号:US14060355

    申请日:2013-10-22

    CPC classification number: H01G4/30 H01G2/065 H01G4/232 Y10T29/43

    Abstract: There is provided a multilayer ceramic electronic component including a ceramic body including a plurality of dielectric layers stacked in a thickness direction and satisfying T/W>1.0 when it is defined that a width thereof is W and a thickness thereof is T, a plurality of first and second internal electrodes disposed in the ceramic body so as to face each other, having the dielectric layer interposed therebetween, and alternately exposed through both end surfaces of the ceramic body, and first and second external electrodes including head parts formed on both end surfaces of the ceramic body and two band parts connected to the head parts and formed on portions of upper and lower main surfaces of the ceramic body so as to be spaced apart from each other in a width direction, and electrically connected to the first and second internal electrodes, respectively.

    Abstract translation: 提供了一种多层陶瓷电子部件,其包括陶瓷体,该陶瓷体的宽度为W,厚度为T时,其厚度方向上层叠有多个电介质层,并满足T / W> 1.0,多个 第一和第二内部电极设置在陶瓷体中,以彼此面对,具有介于其间的电介质层,并且通过陶瓷体的两个端面交替暴露;以及第一和第二外部电极,包括形成在两个端面上的头部 并且形成在所述陶瓷体的上下主表面的一部分上,以在宽度方向上彼此间隔开,并且电连接到所述陶瓷体的所述第一和第二内部 电极。

    MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    多层陶瓷电子元件及其制造方法

    公开(公告)号:US20130250480A1

    公开(公告)日:2013-09-26

    申请号:US13671419

    申请日:2012-11-07

    CPC classification number: H01G4/129 H01G4/232 H01G4/2325 H01G4/30

    Abstract: There is provided a multi-layer ceramic electronic component including: a ceramic sintered body in which a plurality of dielectric layers are laminated; first and second internal electrodes formed in the ceramic sintered body; first and second external electrodes formed on both ends of the ceramic sintered body while covering a circumference thereof, and electrically connected to the first and second internal electrodes; and a sealing part including a glass component and formed in a gap between an outer surface of the ceramic sintered body and ends of the first and second external electrodes.

    Abstract translation: 提供了一种多层陶瓷电子部件,其包括:层叠有多个电介质层的陶瓷烧结体; 形成在陶瓷烧结体中的第一和第二内部电极; 第一和第二外部电极,其形成在陶瓷烧结体的两端,同时覆盖其周围,并且电连接到第一和第二内部电极; 以及包括玻璃成分并形成在陶瓷烧结体的外表面与第一外部电极和第二外部电极的端部之间的间隙中的密封部。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    多层陶瓷电子元件及其制造方法

    公开(公告)号:US20140071586A1

    公开(公告)日:2014-03-13

    申请号:US13839836

    申请日:2013-03-15

    CPC classification number: H01G4/30 H01G4/0085 H01G4/12 Y10T156/10

    Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer; first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic body; and first and second external electrodes formed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, wherein, when the dielectric layer is divided into three areas in a thickness direction of the ceramic body, an average size of dielectric grains in a middle area is different from that of dielectric grains in upper and lower areas, and when T1 denotes a thickness of the dielectric layer, T2 denotes a thickness of the middle area, and T3 and T4 denote thicknesses of the upper and lower areas adjacent to the first and second internal electrodes, T2≧0.45T1 and T3+T4≦0.55T1 are satisfied.

    Abstract translation: 提供了一种多层陶瓷电子部件,包括:包括电介质层的陶瓷体; 第一和第二内部电极,其设置成彼此面对,其中介电层介于陶瓷体内; 以及第一和第二外部电极,其形成在陶瓷体的外表面上并电连接到第一和第二内部电极,其中当电介质层在陶瓷体的厚度方向上分为三个区域时,电介质的平均尺寸 中间区域的晶粒与上部和下部区域的电介质晶粒不同,当T1表示电介质层的厚度时,T2表示中间区域的厚度,T3和T4表示上部和下部区域的厚度 与第一和第二内部电极相邻,T2> = 0.45T1和T3+T4@0.55T1。

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