公开(公告)号：US20130250480A1

公开(公告)日：2013-09-26

申请号：US13671419

申请日：2012-11-07

Applicant: SAMSUNG ELECTRO-MECHANICS

Inventor： Chul Soon AHN ,  Jae Yeol CHOI ,  Jae Hyuk SHIM ,  Young Sook LEE ,  Hye Young CHOI ,  Eun Young NA

IPC: H01G4/12

CPC classification number: H01G4/129 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30

Abstract: There is provided a multi-layer ceramic electronic component including: a ceramic sintered body in which a plurality of dielectric layers are laminated; first and second internal electrodes formed in the ceramic sintered body; first and second external electrodes formed on both ends of the ceramic sintered body while covering a circumference thereof, and electrically connected to the first and second internal electrodes; and a sealing part including a glass component and formed in a gap between an outer surface of the ceramic sintered body and ends of the first and second external electrodes.

Abstract translation: 提供了一种多层陶瓷电子部件，其包括：层叠有多个电介质层的陶瓷烧结体; 形成在陶瓷烧结体中的第一和第二内部电极; 第一和第二外部电极，其形成在陶瓷烧结体的两端，同时覆盖其周围，并且电连接到第一和第二内部电极; 以及包括玻璃成分并形成在陶瓷烧结体的外表面与第一外部电极和第二外部电极的端部之间的间隙中的密封部。

公开(公告)号：US20170135196A1

公开(公告)日：2017-05-11

申请号：US15183116

申请日：2016-06-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Seong KIM ,  Eun Sang NA ,  Chul Soon AHN

IPC: H05K1/02 ,  H05K1/03 ,  H05K7/20

CPC classification number: H05K7/2039 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/4602 ,  H05K2201/10416

Abstract: A heat dissipation member includes a body formed of a metal; and an epoxy resin layer formed on a surface of the body and having insulating properties. A printed circuit board includes a heat dissipation member embedded in the printed circuit board, the heat dissipation member including a body formed of a metal and an epoxy resin layer formed on a surface of the body and having insulating properties, and an insulator formed to surround the heat dissipation member.